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公开(公告)号:US20210408494A1
公开(公告)日:2021-12-30
申请号:US17471074
申请日:2021-09-09
Applicant: Applied Materials, Inc.
Inventor: Gang Yu , Chung-Chia Chen , Wan-Yu Lin , Hyunsung Bang , Lisong Xu , Byung Sung Kwak , Robert Jan Visser
Abstract: A method for manufacturing an organic light-emitting diode (OLED) structure includes depositing a light extraction layer (LEL) over a stack of OLED layers by directing fluid droplets of a LEL precursor to an array of well structures separated by plateau areas. Each well structure includes a recess with sidewalls and a floor, and the plateau areas have rounded top surfaces such that the droplets of the LEL precursor are guided into recesses of the well structures. The droplets of the LEL precursor are cured to solidify the LEL in the recess.
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12.
公开(公告)号:US20210159464A1
公开(公告)日:2021-05-27
申请号:US16696971
申请日:2019-11-26
Applicant: Applied Materials, Inc.
Inventor: Gang Yu , Chung-Chia Chen , Wan-Yu Lin , Hyunsung Bang , Lisong Xu , Byung Sung Kwak , Robert Jan Visser
Abstract: An organic light-emitting diode (OLED) structure includes a substrate, a dielectric layer on the substrate having an array of well structures with each well structure including a recess with side walls and a floor and the recesses are separated by plateaus having rounded top surfaces, a stack of OLED layers covering at least the floor of the well, and a light extraction layer (LEL) in the well over the stack of OLED layers.
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公开(公告)号:US12224272B2
公开(公告)日:2025-02-11
申请号:US17701599
申请日:2022-03-22
Applicant: Applied Materials, Inc.
Inventor: Lisong Xu , Byung Sung Kwak , Mingwei Zhu , Hou T. Ng , Nag B. Patibandla , Christopher Dennis Bencher
IPC: H01L25/16 , H01L25/075 , H01L33/00 , H01L33/44 , H01L33/48 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/32
Abstract: A method for manufacturing micro-LED displays includes depositing a first material over a substrate having a plurality of micro-LEDs such that the plurality of micro-LEDs are covered by the first material and the first material fills gaps laterally separating the micro-LEDs, removing a portion of the first material from the gaps that laterally separate the plurality of micro-LEDs to form trenches that extend to or below light-emitting layers of the micro-LEDs, depositing a second material over the substrate such that the second material covers the first material and extends into the trenches, and removing a portion of the first and second material over the plurality of micro-LEDs to expose top surfaces of the plurality of micro-LEDs and such that isolation walls positioned in the gaps between the plurality of micro-LEDs extend vertically higher than the top surface of the first material.
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公开(公告)号:US11942576B2
公开(公告)日:2024-03-26
申请号:US17006663
申请日:2020-08-28
Applicant: Applied Materials, Inc
Inventor: Yingdong Luo , Lisong Xu , Sivapackia Ganapathiappan , Hou T. Ng , Byung Sung Kwak , Mingwei Zhu , Nag B. Patibandla
CPC classification number: H01L33/504 , C09K11/025 , C09K11/06 , H01L33/005 , C09K2211/1007 , C09K2211/1011 , C09K2211/1014 , C09K2211/1029 , C09K2211/1033 , C09K2211/1037 , C09K2211/1044 , C09K2211/1059 , C09K2211/1092 , C09K2211/185 , H01L2933/0041
Abstract: A photocurable composition includes a blue photoluminescent material, one or more monomers, and a photoinitiator that initiates polymerization of the one or more monomers in response to absorption of the ultraviolet light. The blue photoluminescent material is selected to absorb ultraviolet light with a maximum wavelength in a range of about 300 nm to about 430 nm and to emit blue light. The blue photoluminescent material also has an emission peak in a range of about 420 nm to about 480 nm. The full width at half maximum of the emission peak is less than 100 nm, and the photoluminescence quantum yield is in a range of 5% to 100%.
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公开(公告)号:US20240096854A1
公开(公告)日:2024-03-21
申请号:US18244466
申请日:2023-09-11
Applicant: Applied Materials, Inc.
Inventor: Zhiyong Li , Sivapackia Ganapathiappan , Kulandaivelu Sivanandan , Hao Yu , Hou T. Ng , Nag Patibandla , Mingwei Zhu , Lisong Xu , Kai Ding
IPC: H01L25/075
CPC classification number: H01L25/0753 , H01L33/56
Abstract: Processing methods are described that include forming a group of LED structures on a substrate layer to form a patterned LED substrate. The methods also include depositing a light absorption material on the pattered LED substrate, where the light absorption material includes at least one photocurable compound and at least one ultraviolet light absorbing material. The methods further include exposing a portion of the light absorption material to patterned light, wherein the patterned light cures the exposed portion of the light absorption material into pixel isolation structures. The methods additionally include depositing an isotropic layer on a top portion and a side portion of the pixel isolation structures, where the LED structures are substantially free of the as-deposited isotropic light reflecting layer.
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公开(公告)号:US20220367763A1
公开(公告)日:2022-11-17
申请号:US17870769
申请日:2022-07-21
Applicant: Applied Materials, Inc.
Inventor: Yingdong Luo , Lisong Xu , Sivapackia Ganapathiappan , Hou T. Ng , Byung Sung Kwak , Mingwei Zhu , Nag B. Patibandla
Abstract: A light-emitting device includes a plurality of light-emitting diodes, a first cured composition over a first subset of the light-emitting diodes, and a second cured composition over a second subset of light-emitting diodes. The first cured composition includes a first photopolymer and a blue photoluminescent material that is an organic, organometallic, or polymeric material, embedded in the first photopolymer. The second cured composition includes a second photopolymer and a nanomaterial embedded in the second photopolymer. The nanomaterial is selected to emit red or green light in response.
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17.
公开(公告)号:US11121345B2
公开(公告)日:2021-09-14
申请号:US16696971
申请日:2019-11-26
Applicant: Applied Materials, Inc.
Inventor: Gang Yu , Chung-Chia Chen , Wan-Yu Lin , Hyunsung Bang , Lisong Xu , Byung Sung Kwak , Robert Jan Visser
Abstract: An organic light-emitting diode (OLED) structure includes a substrate, a dielectric layer on the substrate having an array of well structures with each well structure including a recess with side walls and a floor and the recesses are separated by plateaus having rounded top surfaces, a stack of OLED layers covering at least the floor of the well, and a light extraction layer (LEL) in the well over the stack of OLED layers.
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公开(公告)号:US20210135140A1
公开(公告)日:2021-05-06
申请号:US16685944
申请日:2019-11-15
Applicant: Applied Materials, Inc
Inventor: Gang Yu , Chung-Chia Chen , Wan-Yu Lin , Hyunsung Bang , Lisong Xu , Byung Sung Kwak , Robert Jan Visser
Abstract: An organic light-emitting diode (OLED) structure includes a stack of OLED layers; a light extraction layer (LEL) comprising a UV-cured ink; and a UV blocking layer between the LEL and the stack of OLED layers.
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公开(公告)号:US20240194837A1
公开(公告)日:2024-06-13
申请号:US18586175
申请日:2024-02-23
Applicant: Applied Materials, Inc.
Inventor: Yingdong Luo , Lisong Xu , Sivapackia Ganapathiappan , Hou T. Ng , Byung Sung Kwak , Mingwei Zhu , Nag B. Patibandla
CPC classification number: H01L33/504 , C09K11/025 , C09K11/06 , H01L33/005 , C09K2211/1007 , C09K2211/1011 , C09K2211/1014 , C09K2211/1029 , C09K2211/1033 , C09K2211/1037 , C09K2211/1044 , C09K2211/1059 , C09K2211/1092 , C09K2211/185 , H01L2933/0041
Abstract: A display includes a light emitting diode and a color conversion layer that includes a polymer matrix, a blue photoluminescent material, and a components of a photoinitiator that initiated polymerization to form the polymer matrix. The blue photoluminescent material is selected to absorb ultraviolet light with a maximum wavelength in a range of about 300 nm to about 430 nm and to emit blue light. The blue photoluminescent material also has an emission peak in a range of about 420 nm to about 480 nm. The full width at half maximum of the emission peak is less than 100 nm, and the photoluminescence quantum yield is in a range of 5% to 100%.
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公开(公告)号:US20240186458A1
公开(公告)日:2024-06-06
申请号:US18413013
申请日:2024-01-15
Applicant: Applied Materials, Inc.
Inventor: Kai Ding , Lisong Xu , Mingwei Zhu , Zhiyong Li , Hou T. Ng , Sivapackia Ganapathiappan , Nag Patibandla
CPC classification number: H01L33/46 , H01L25/167 , H01L2933/0025
Abstract: Micro-LED structures include an LED epilayer that may be formed before the micro-LED structure is coupled to a backplane substrate. In order to prevent light leakage and maximize light output, the sidewalls and other surfaces of the LED epilayer may be coated with a reflective coating. For example, the reflective coating may include a metal layer that is electrically insulated between dielectric layers from the micro-LED electrodes. The reflective coating may also be formed using multiple layers in a distributed Bragg reflector configuration. This reflective coating may be formed during the LED fabrication process before the micro-LED structure is coupled to the backplane. The pixel isolation structures on the backplane may also include a reflective coating that is applied above the LED epilayers.
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