公开(公告)号：US11964359B2

公开(公告)日：2024-04-23

申请号：US16661400

申请日：2019-10-23

Applicant: Applied Materials, Inc.

Inventor： Ashwin Chockalingham ,  Mahendra C. Orilall ,  Mayu Yamamura ,  Boyi Fu ,  Rajeev Bajaj ,  Daniel Redfield

IPC: B33Y80/00 ,  B24B37/20 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24D18/00 ,  H01L21/306

CPC classification number: B24B37/20 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24D18/0045 ,  B33Y80/00 ,  H01L21/30625

Abstract: Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.

公开(公告)号：US11813712B2

公开(公告)日：2023-11-14

申请号：US17036623

申请日：2020-09-29

Applicant: Applied Materials, Inc.

Inventor： Aniruddh Jagdish Khanna ,  Jason G. Fung ,  Puneet Narendra Jawali ,  Rajeev Bajaj ,  Adam Wade Manzonie ,  Nandan Baradanahalli Kenchappa ,  Veera Raghava Reddy Kakireddy ,  Joonho An ,  Jaeseok Kim ,  Mayu Yamamura

IPC: B24B37/02 ,  B24B37/04 ,  B24B37/20

CPC classification number: B24B37/20 ,  B24B37/042

Abstract: Polishing pads having discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material are provided herein. In one embodiment a polishing pad features a plurality of polishing elements each comprising a polishing surface and sidewalls extending downwardly from the polishing surface to define a plurality of channels disposed between the polishing elements, wherein one or more of the polishing elements is formed of a continuous phase of polymer material having one or more first regions comprising a first porosity and a second region comprising a second porosity, wherein the second porosity is less than the first porosity.

公开(公告)号：US10456886B2

公开(公告)日：2019-10-29

申请号：US15394044

申请日：2016-12-29

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Nag B. Patibandla ,  Rajeev Bajaj ,  Daniel Redfield ,  Fred C. Redeker ,  Mahendra C. Orilall ,  Boyi Fu ,  Mayu Yamamura ,  Ashwin Chockalingam

IPC: B24D3/20 ,  B24D3/28 ,  B24D11/02 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B33Y10/00 ,  B33Y80/00

Abstract: Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.

公开(公告)号：US10391605B2

公开(公告)日：2019-08-27

申请号：US15287665

申请日：2016-10-06

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Boyi Fu ,  Ashwin Chockalingam ,  Daniel Redfield ,  Rajeev Bajaj ,  Mahendra C. Orilall ,  Hou T. Ng ,  Jason G. Fung ,  Mayu Yamamura

IPC: B24B37/24

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

公开(公告)号：US10384330B2

公开(公告)日：2019-08-20

申请号：US14885950

申请日：2015-10-16

Applicant: Applied Materials, Inc.

Inventor： Rajeev Bajaj ,  Daniel Redfield ,  Mahendra C. Orilall ,  Boyi Fu ,  Aniruddh Khanna ,  Jason G. Fung ,  Mario Cornejo ,  Ashwin Chockalingam ,  Mayu Yamamura ,  Veera Raghava Reddy Kakireddy ,  Ashavani Kumar ,  Venkat Hariharan ,  Gregory E. Menk ,  Fred C. Redeker ,  Nag B. Patibandla ,  Hou T. Ng ,  Robert E. Davenport ,  Amritanshu Sinha

IPC: B24D18/00 ,  B24D3/28 ,  B33Y10/00 ,  B33Y80/00

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.