Heterojunction semiconductor device having high blocking capability

    公开(公告)号:US11322606B2

    公开(公告)日:2022-05-03

    申请号:US16969437

    申请日:2019-10-21

    IPC分类号: H01L29/778

    摘要: A heterojunction semiconductor device comprises a substrate; a second barrier layer is disposed on the second channel layer and a second channel is formed; a trench gate structure is disposed in the second barrier layer; the trench gate structure is embedded into the second barrier layer and is composed of a gate medium and a gate metal located in the gate medium; an isolation layer is disposed in the second channel layer and separates the second channel layer into an upper layer and a lower layer; a first barrier layer is disposed between the lower layer of the second channel layer and the first channel layer and a first channel is formed; a bottom of the metal drain is flush with a bottom of the first barrier layer; and a first metal source is disposed between the second metal source and the first channel layer.

    High-current N-type silicon-on-insulator lateral insulated-gate bipolar transistor
    13.
    发明授权
    High-current N-type silicon-on-insulator lateral insulated-gate bipolar transistor 有权
    大电流N型绝缘体上半导体绝缘栅双极晶体管

    公开(公告)号:US09159818B2

    公开(公告)日:2015-10-13

    申请号:US14349632

    申请日:2012-10-24

    摘要: A high-current, N-type silicon-on-insulator lateral insulated-gate bipolar transistor, including: a P-type substrate, a buried-oxide layer disposed on the P-type substrate, an N-type epitaxial layer disposed on the oxide layer, and an N-type buffer trap region. A P-type body region and an N-type central buffer trap region are disposed inside the N-type epitaxial layer; a P-type drain region is disposed in the buffer trap region; N-type source regions and a P-type body contact region are disposed in the P-type body region; an N-type base region and a P-type emitter region are disposed in the buffer trap region; gate and field oxide layers are disposed on the N-type epitaxial layer; polycrystalline silicon gates are disposed on the gate oxide layers; and a passivation layer and metal layers are disposed on the surface of the symmetrical transistor. P-type emitter region output and current density are improved without increasing the area of the transistor.

    摘要翻译: 一种高电流,N型绝缘体上的横向绝缘栅双极晶体管,包括:P型衬底,设置在P型衬底上的掩埋氧化物层,设置在P型衬底上的N型外延层 氧化物层和N型缓冲阱捕获区。 P型体区域和N型中央缓冲区捕获区域设置在N型外延层内部; P型漏极区域设置在缓冲陷阱区域中; N型源极区域和P型体接触区域设置在P型体区域中; N型基极区域和P型发射极区域设置在缓冲陷阱区域中; 栅极和场氧化物层设置在N型外延层上; 多晶硅栅极设置在栅极氧化物层上; 并且钝化层和金属层设置在对称晶体管的表面上。 改善P型发射极区域的输出和电流密度,而不增加晶体管的面积。

    ISOLATION STRUCTURE OF HIGH-VOLTAGE DRIVING CIRCUIT
    14.
    发明申请
    ISOLATION STRUCTURE OF HIGH-VOLTAGE DRIVING CIRCUIT 有权
    高压驱动电路隔离结构

    公开(公告)号:US20140203406A1

    公开(公告)日:2014-07-24

    申请号:US14240287

    申请日:2012-08-14

    摘要: An isolation structure of a high-voltage driving circuit includes a P-type substrate and a P-type epitaxial layer; a high voltage area, a low voltage area and a high and low voltage junction terminal area are arranged on the P-type epitaxial layer; a first P-type junction isolation area is arranged between the high and low voltage junction terminal area and the low voltage area, and a high-voltage insulated gate field effect tube is arranged between the high voltage area and the low voltage area; two sides of the high-voltage insulated gate field effect tube and an isolation structure between the high-voltage insulated gate field effect tube and a high side area are formed as a second P-type junction isolation area.

    摘要翻译: 高电压驱动电路的隔离结构包括P型衬底和P型外延层; 在P型外延层上布置有高电压区域,低电压区域和高低压端子区域; 在高低压区和低电压区之间设置第一P型结隔离区,高电压区与低压区之间设置高压绝缘栅场效应管; 高压绝缘栅场效应管的两侧和高压绝缘栅场效应管与高边区之间的隔离结构形成为第二P型结隔离区。

    Lateral insulated gate bipolar transistor with low turn-on overshoot current

    公开(公告)号:US11367785B2

    公开(公告)日:2022-06-21

    申请号:US17606216

    申请日:2020-03-31

    摘要: A lateral insulated gate bipolar transistor (IGBT) with a low turn-on overshoot current is provided to reduce a peak value of a current flowing through a device during turn-on of a second gate pulse while preventing a current capability and a withstand voltage capability from being degraded. The lateral IGBT includes: a buried oxygen arranged on a P-type substrate, an N-type drift region arranged on the buried oxygen, on which a P-type body region and an N-type buffer region are arranged, a P-type collector region arranged in the N-type buffer region, a field oxide layer arranged above the N-type drift region, a P-type well region arranged in the P-type body region, and a P-type emitter region and an emitter region arranged in the P-type well region, where inner boundaries of the foregoing 4 regions are synchronously recessed to form a pinch-off region. A gate oxide layer is arranged on a surface of the P-type body region, and a polysilicon gate is arranged on the gate oxide layer. The polysilicon gate includes a first gate located above the surface of the P-type body region and a second gate located above the pinch-off region and the N-type drift region. The first gate is connected to a first gate resistor, and the second gate is connected to a second gate resistor.

    Self-adaptive synchronous rectification control system and method of active clamp flyback converter

    公开(公告)号:US11081967B2

    公开(公告)日:2021-08-03

    申请号:US16617508

    申请日:2018-09-28

    IPC分类号: H02M3/335 H02M1/08 H02M1/00

    摘要: The invention discloses a self-adaptive synchronous rectification control system and a self-adaptive synchronous rectification control method of an active clamp flyback converter. The control system comprises a sampling and signal processing circuit, a control circuit with a microcontroller as a core and a gate driver. According to the control method, a switching-on state, an early switching-off state, a late switching-off state and an exact switching-off state of a secondary synchronous rectifier of the active clamp flyback converter can be directly detected, and the synchronous rectifier and a switching-on time of the synchronous rectifier in next cycle can be controlled according to a detection result. After several cycles of self-adaptive control, the synchronous rectifier enters the exact switching-on state, thus avoiding oscillation of an output waveform of the active clamp flyback converter.

    High-threshold power semiconductor device and manufacturing method thereof

    公开(公告)号:US12107167B2

    公开(公告)日:2024-10-01

    申请号:US17762929

    申请日:2021-01-20

    摘要: The present invention discloses a high-threshold power semiconductor device and a manufacturing method thereof. The high-threshold power semiconductor device includes, in sequence from bottom to top: a metal drain electrode, a substrate, a buffer layer, and a drift region; further including: a composite column body which is jointly formed by a drift region protrusion, a columnar p-region and a columnar n-region on the drift region, a channel layer, a passivation layer, a dielectric layer, a heavily doped semiconductor layer, a metal gate electrode and a source metal electrode. The composite column body is formed by sequentially depositing a p-type semiconductor layer and an n-type semiconductor layer on the drift region and then etching same. The channel layer and the passivation layer are formed in sequence by deposition. Thus, the above devices are divided into a cell region and a terminal region. The dielectric layer, the heavily doped semiconductor layer, the metal gate electrode and the source metal electrode only exist in the cell region, and the passivation layer of the terminal region extends upwards and is wrapped outside the channel layer. This structure can increase a threshold voltage of the device, improve the blocking characteristics of the device and reduce the size of a gate capacitance.

    Multi-phase high-precision current sharing control method applied to constant on-time control

    公开(公告)号:US12046990B1

    公开(公告)日:2024-07-23

    申请号:US18641384

    申请日:2024-04-21

    IPC分类号: H02M1/08 H02M1/00 H02M3/158

    摘要: A multi-phase high-precision current sharing control method applied to constant on-time control is provided, wherein a current difference between continuously sampled current of each line and mean current is processed by a PI compensation module and a low-pass filter module to obtain on-time regulation data. A high bit of the regulation data controls the value of counter reference Vref in an on-time control module, and a low bit controls the length of an enabled delay line in a delay line module. The counter timing control of the on-time control module is combined with the delay line timing control of the delay line module to improve the control precision of a DPWM. The method takes COT control of a Buck converter as a typical application. Compared with a multi-phase COT controller without a current-sharing mechanism, the method can improve the stability and reliability of the system.