公开(公告)号：US08677618B2

公开(公告)日：2014-03-25

申请号：US13137631

申请日：2011-08-30

申请人： Ki Hwan Kim ,  Jin Yong An ,  Myung Sam Kang

发明人： Ki Hwan Kim ,  Jin Yong An ,  Myung Sam Kang

IPC分类号： H05K3/02 ,  H05K3/10

CPC分类号： H05K3/0097 ,  H05K3/0052 ,  H05K3/20 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2203/0156 ,  H05K2203/1536

摘要： A method of manufacturing a substrate using a carrier, that includes preparing a carrier having a releasing layer, and insulating layers and metal layers sequentially disposed on both sides of the releasing layer; patterning the metal layers to form base circuit layers; forming buildup layers on the base circuit layers; executing a routing process to separate the insulating layers from the releasing layer; and forming solder resist layers on the buildup layers and forming openings in the solder resist layers and the insulating layers to expose pads.

摘要翻译： 使用载体制造衬底的方法，其包括制备具有释放层的载体，以及顺序地设置在释放层两侧的绝缘层和金属层; 图案化金属层以形成基极电路层; 在基极电路层上形成积层; 执行布线过程以将绝缘层与释放层分离; 以及在堆积层上形成阻焊层，并在阻焊层和绝缘层中形成开口以露出焊盘。

公开(公告)号：US08547923B2

公开(公告)日：2013-10-01

申请号：US13291995

申请日：2011-11-08

申请人： Ki Hwan Kim ,  Jae Hoon Chung ,  Moon Il Lee

发明人： Ki Hwan Kim ,  Jae Hoon Chung ,  Moon Il Lee

IPC分类号： H04W72/04 ,  H04W7/216 ,  H04L27/28 ,  H04L1/18

CPC分类号： H04W72/0406 ,  H04J1/02 ,  H04L1/0026 ,  H04L1/0075 ,  H04L1/1607 ,  H04L1/1861 ,  H04L5/0007 ,  H04L5/0044 ,  H04L5/0053 ,  H04W72/04

摘要： A method for multiplexing a data information stream, including a systematic symbol and a non-systematic symbol, and a control information stream of at least three types in a wireless mobile communication system is disclosed. The method includes mapping the data information stream to a resource area so that the systematic symbol is not mapped to a specific resource area to which the control information stream is mapped, and mapping the control information stream to the specific resource area.

公开(公告)号：US08520600B2

公开(公告)日：2013-08-27

申请号：US13143914

申请日：2009-08-20

申请人： Ki Hwan Kim ,  Hyun Soo Ko ,  Jae Hoon Chung ,  Yeong Hyeon Kwon

发明人： Ki Hwan Kim ,  Hyun Soo Ko ,  Jae Hoon Chung ,  Yeong Hyeon Kwon

IPC分类号： H04L12/28

CPC分类号： H04L5/001 ,  H04L5/0057

摘要： A method of transmitting channel quality information in a wireless communication system is disclosed. The method of transmitting channel quality information from a mobile station in a wireless communication system includes generating channel quality information of a downlink multi carrier including N number of downlink component carriers; and transmitting the generated channel quality information to a base station through at least one of a physical uplink control channel (PUCCH) a physical uplink shared channel (PUSCH) on a single uplink component carrier.

摘要翻译： 公开了一种在无线通信系统中发送信道质量信息的方法。 在无线通信系统中从移动台发送信道质量信息的方法包括生成包括N个下行链路分量载波的下行链路多载波的信道质量信息; 以及通过单个上行链路分量载波上的物理上行链路共享信道（PUSCH）中的物理上行链路控制信道（PUCCH）中的至少一个，将生成的信道质量信息发送到基站。

公开(公告)号：US08435376B2

公开(公告)日：2013-05-07

申请号：US12787300

申请日：2010-05-25

申请人： Jin Ho Kim ,  Jin Yong Ahn ,  Ki Hwan Kim ,  Byung Moon Kim ,  Seok Kyu Lee

发明人： Jin Ho Kim ,  Jin Yong Ahn ,  Ki Hwan Kim ,  Byung Moon Kim ,  Seok Kyu Lee

IPC分类号： B29C65/02 ,  B29C65/52 ,  B29C63/26 ,  B32B37/26 ,  B32B38/10

CPC分类号： H05K13/04 ,  B32B2457/08 ,  H05K3/0097 ,  H05K3/4682 ,  H05K2203/1536 ,  H05K2203/1572 ,  Y10T156/1043 ,  Y10T156/1142 ,  Y10T428/2804

摘要： Disclosed herein is a carrier for manufacturing a substrate, including: a base plate; adhesive layers formed on one side or both sides of the base plate; auxiliary adhesive layers, each of which is buried in one side of each of the adhesive layers, has a smaller area than each of the adhesive layers and has lower adhesivity than each of the adhesive layers; and metal layers, each of which is formed on one side of each of the auxiliary adhesive layers, whose edges are attached to the adhesive layers, and whose other portions excluding the edges are attached to the auxiliary adhesive layers. The carrier is advantageous in that a metal layer and an auxiliary adhesive layer are attached to each other by the adhesivity of the auxiliary adhesive layer, so that it is not required to use vacuum adsorption, with the result that a process of manufacturing a substrate can be performed more stably.

摘要翻译： 本文公开了一种用于制造基板的载体，包括：基板; 形成在基板的一侧或两侧的粘合剂层; 每个粘合剂层的一侧的辅助粘合剂层具有比每个粘合剂层更小的面积，并且具有比每个粘合剂层更低的粘附性; 以及金属层，其各自形成在每个辅助粘合剂层的一侧上，其边缘附着到粘合剂层，并且除了边缘之外的其它部分附着到辅助粘合剂层。 载体的优点在于，金属层和辅助粘合剂层通过辅助粘合剂层的粘合性彼此附接，使得不需要使用真空吸附，结果是制造基材的工艺可以 更稳定地进行。

公开(公告)号：US08396160B2

公开(公告)日：2013-03-12

申请号：US13122462

申请日：2009-10-15

申请人： Ki Hwan Kim ,  Yeong Hyeon Kwon ,  Jae Hoon Chung ,  So Yeon Kim

发明人： Ki Hwan Kim ,  Yeong Hyeon Kwon ,  Jae Hoon Chung ,  So Yeon Kim

IPC分类号： H04L27/00

CPC分类号： H04L1/0067 ,  H04L1/0073 ,  H04L5/0053

摘要： Disclosed herein is a method for transmitting signals in a wireless communication system, including joint coding one or more signals, separating the joint coded signal by a number of a plurality of channel aggregation used for transmission, respectively allocating the separated signals to the plurality of the channel aggregation, and transmitting the signals, such that a receiver smoothly performs decoding.

摘要翻译： 本文公开了一种在无线通信系统中发送信号的方法，包括：联合编码一个或多个信号，将联合编码信号分离多个用于传输的多个信道聚合，分别将分离的信号分配给多个 信道聚合和发送信号，使得接收机平滑地执行解码。

公开(公告)号：US20110163064A1

公开(公告)日：2011-07-07

申请号：US12716193

申请日：2010-03-02

申请人： Jae Joon LEE ,  Jin Yong Ahn ,  Suk Hyeon Cho ,  Ki Hwan Kim ,  Seok Kyu Lee

发明人： Jae Joon LEE ,  Jin Yong Ahn ,  Suk Hyeon Cho ,  Ki Hwan Kim ,  Seok Kyu Lee

IPC分类号： C23F1/00 ,  B32B15/00 ,  B32B37/00 ,  B32B38/10

CPC分类号： H05K3/007 ,  B32B3/10 ,  B32B3/14 ,  B32B3/18 ,  B32B7/04 ,  B32B15/00 ,  B32B15/043 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B2457/08 ,  H05K3/0097 ,  H05K3/205 ,  H05K2201/0355 ,  Y10T156/10 ,  Y10T156/1052 ,  Y10T428/12 ,  Y10T428/12229 ,  Y10T428/12264 ,  Y10T428/12271 ,  Y10T428/161 ,  Y10T428/19 ,  Y10T428/192 ,  Y10T428/239 ,  Y10T428/24917

摘要： Disclosed is a carrier for manufacturing a printed circuit board, which includes a first carrier including a first binder having a first opening and a first metal layer formed in the first opening of the first binder, and a second carrier, stacked with the first carrier and including a second binder having a second opening and a second metal layer which is formed in the second opening of the second binder and which partially overlaps with the first metal layer, so that the carrier is simply configured and the binders are formed not only on the lateral surfaces of the metal layers but also on the upper surfaces thereof, thus improving the reliability of bonding of the carrier at the periphery. A method of manufacturing the carrier and a method of manufacturing a printed circuit board using the carrier are also provided.

摘要翻译： 公开了一种用于制造印刷电路板的载体，其包括第一载体，其包括具有第一开口的第一粘合剂和形成在第一粘合剂的第一开口中的第一金属层，以及与第一载体堆叠的第二载体， 包括具有第二开口的第二粘合剂和形成在第二粘合剂的第二开口中并且与第一金属层部分重叠的第二金属层，使得载体被简单地构造，并且粘结剂不仅形成在 金属层的侧面，也在其上表面，从而提高载体在周边的接合的可靠性。 还提供了制造载体的方法和使用该载体制造印刷电路板的方法。

公开(公告)号：US20110159282A1

公开(公告)日：2011-06-30

申请号：US12787300

申请日：2010-05-25

申请人： Jin Ho KIM ,  Jin Yong Ahn ,  Ki Hwan Kim ,  Byung Moon Kim ,  Seok Kyu Lee

发明人： Jin Ho KIM ,  Jin Yong Ahn ,  Ki Hwan Kim ,  Byung Moon Kim ,  Seok Kyu Lee

IPC分类号： B32B7/12 ,  B32B38/10 ,  B32B38/00 ,  B32B37/02

CPC分类号： H05K13/04 ,  B32B2457/08 ,  H05K3/0097 ,  H05K3/4682 ,  H05K2203/1536 ,  H05K2203/1572 ,  Y10T156/1043 ,  Y10T156/1142 ,  Y10T428/2804

摘要： Disclosed herein is a carrier for manufacturing a substrate, including: a base plate; adhesive layers formed on one side or both sides of the base plate; auxiliary adhesive layers, each of which is buried in one side of each of the adhesive layers, has a smaller area than each of the adhesive layers and has lower adhesivity than each of the adhesive layers; and metal layers, each of which is formed on one side of each of the auxiliary adhesive layers, whose edges are attached to the adhesive layers, and whose other portions excluding the edges are attached to the auxiliary adhesive layers. The carrier is advantageous in that a metal layer and an auxiliary adhesive layer are attached to each other by the adhesivity of the auxiliary adhesive layer, so that it is not required to use vacuum adsorption, with the result that a process of manufacturing a substrate can be performed more stably.

摘要翻译： 本文公开了一种用于制造基板的载体，包括：基板; 形成在基板的一侧或两侧的粘合剂层; 每个粘合剂层的一侧的辅助粘合剂层具有比每个粘合剂层更小的面积，并且具有比每个粘合剂层更低的粘附性; 以及金属层，其各自形成在每个辅助粘合剂层的一侧上，其边缘附着到粘合剂层，并且除了边缘之外的其它部分附着到辅助粘合剂层。 载体的优点在于，金属层和辅助粘合剂层通过辅助粘合剂层的粘合性彼此附接，使得不需要使用真空吸附，结果是制造基材的工艺可以 更稳定地进行。

公开(公告)号：US20110122794A1

公开(公告)日：2011-05-26

申请号：US13054895

申请日：2009-07-30

申请人： Ki Hwan Kim ,  Hyun Soo Ko

发明人： Ki Hwan Kim ,  Hyun Soo Ko

IPC分类号： H04W24/00

CPC分类号： H04L1/0026 ,  H04L1/0029 ,  H04L5/0007 ,  H04L5/0037 ,  H04L25/022 ,  H04L27/2601 ,  H04W8/24 ,  H04W24/10 ,  H04W48/08 ,  H04W72/04

摘要： A method for reporting channel quality information in a wireless communication system, and a method for assigning radio resources according to the channel quality information are disclosed. A method for reporting channel quality information by a user equipment (UE) of a wireless communication system measures channel quality information of a downlink multi-carrier including a plurality of downlink component carriers, and transmits the measured channel quality information to a base station.

摘要翻译： 公开了一种在无线通信系统中报告信道质量信息的方法，以及根据信道质量信息分配无线资源的方法。 用于通过无线通信系统的用户设备（UE）报告信道质量信息的方法测量包括多个下行链路分量载波的下行链路多载波的信道质量信息，并将测量的信道质量信息发送到基站。

公开(公告)号：US07841074B2

公开(公告)日：2010-11-30

申请号：US12005353

申请日：2007-12-27

申请人： Jee Soo Mok ,  Jun Heyoung Park ,  Ki Hwan Kim ,  Sung Yong Kim ,  Sang Hyun Park

发明人： Jee Soo Mok ,  Jun Heyoung Park ,  Ki Hwan Kim ,  Sung Yong Kim ,  Sang Hyun Park

IPC分类号： H01R43/00

CPC分类号： H05K3/4069 ,  H05K3/4614 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2203/0139 ,  H05K2203/0278 ,  H05K2203/1476 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49222 ,  Y10T29/53243

摘要： A method of fabricating a paste bump for a printed circuit board, provides preparing a base plate; printing a conductive paste on the base plate and drying the conductive paste on the base plate, thus forming a first paste bump; flattening an upper surface of the first paste bump through coining; and printing a conductive paste on the first paste bump and drying the conductive paste on the first bump, thus forming a second paste bump, wherein the printing a conductive paste on the base plate and drying the conductive paste on the base plate includes placing a first mask having a hole having a first size on the base plate; applying a conductive paste on the first mask, and pressing the conductive paste using a squeegee; filling the hole having a first size in the first mask with the conductive paste, and sticking a bottom of the conductive paste to the base plate; and removing the first mask and drying the conductive paste, thus forming the first paste bump.

摘要翻译： 一种制造印刷电路板用焊膏凸块的方法，提供制备基板; 在基板上印刷导电膏并干燥基板上的导电膏，从而形成第一浆料凸块; 通过压印使第一糊状凸块的上表面变平; 以及在所述第一贴片凸块上印刷导电膏并干燥所述第一凸点上的导电膏，从而形成第二膏凸，其中在所述基板上印刷导电膏并干燥所述基板上的导电膏包括： 掩模，在基板上具有第一尺寸的孔; 在第一掩模上施加导电膏，并使用刮板压接导电膏; 在第一掩模中用导电膏填充具有第一尺寸的孔，并将导电糊的底部粘贴到基板上; 并且去除第一掩模并干燥导电膏，从而形成第一浆料凸块。

公开(公告)号：US09154162B2

公开(公告)日：2015-10-06

申请号：US13488332

申请日：2012-06-04

申请人： Ki Hwan Kim ,  Young Seob Lee ,  Seung Hyun Kang ,  Jae Hoon Chung

发明人： Ki Hwan Kim ,  Young Seob Lee ,  Seung Hyun Kang ,  Jae Hoon Chung

IPC分类号： G06F11/00 ,  H03M13/09 ,  H04L1/00

CPC分类号： H04L1/0061 ,  G06F11/1004 ,  H03M13/091 ,  H04L1/0065 ,  H04L1/0083

摘要： A method of transmitting data in a wireless access system includes: calculating a number C of code blocks using a size B of an input bit sequence, a maximum size Z of the code blocks, and a size L of a cyclic redundancy check (CRC) which is to be attached to each of the code blocks; calculating a size B′ of a modified input bit sequence using the number C, the size L, and the size B; obtaining a size K of each of the code blocks using the size B′ and the number C; segmenting the input bit sequence to have the number C of the code blocks and the obtained size K of each of the code blocks; generating the code blocks by attaching the CRC to each of the segmented input bit sequences; and channel-coding the code blocks.

摘要翻译： 一种在无线接入系统中发送数据的方法包括：使用输入比特序列的大小B，码块的最大大小Z以及循环冗余校验（CRC）的大小L来计算码块数C， 其被附加到每个代码块; 使用数量C，尺寸L和尺寸B计算修改的输入比特序列的大小B'; 使用大小B'和数量C获得每个代码块的大小K; 将输入比特序列分割成具有代码块的编号C和每个代码块的获得的大小K; 通过将CRC附加到每个分段输入比特序列来产生代码块; 并对代码块进行通道编码。