摘要:
A method of forming photo masks having rectangular patterns and a method for forming a semiconductor structure using the photo masks is provided. The method for forming the photo masks includes determining a minimum spacing and identifying vertical conductive feature patterns having a spacing less than the minimum spacing value. The method further includes determining a first direction to expand and a second direction to shrink, and checking against design rules to see if the design rules are violated for each of the vertical conductive feature patterns identified. If designed rules are not violated, the identified vertical conductive feature pattern is replaced with a revised vertical conductive feature pattern having a rectangular shape. The photo masks are then formed. The semiconductor structure can be formed using the photo masks.
摘要:
A method of forming photo masks having rectangular patterns and a method for forming a semiconductor structure using the photo masks is provided. The method for forming the photo masks includes determining a minimum spacing and identifying vertical conductive feature patterns having a spacing less than the minimum spacing value. The method further includes determining a first direction to expand and a second direction to shrink, and checking against design rules to see if the design rules are violated for each of the vertical conductive feature patterns identified. If designed rules are not violated, the identified vertical conductive feature pattern is replaced with a revised vertical conductive feature pattern having a rectangular shape. The photo masks are then formed. The semiconductor structure can be formed using the photo masks.
摘要:
A solar cell module includes multiple solar cells connected in series through wiring units. Each solar cell comprises an electrode unit disposed on a photoelectric conversion unit converting solar energy into electrical energy, and including multiple finger electrodes. At least one finger electrode has a first conducting section connected to a bus bar electrode, and a second conducting section disposed on one side of the first conducting section, extending away from the bus bar electrode and having a thickness greater than that of each of the first conducting section and the bus bar electrode.
摘要:
An electronic apparatus with electrostatic discharge protection includes: a conducting casing and a circuit board. The circuit board has a power ground node and a conditional conducting path, and is set inside the conducting casing. The conditional conducting path further includes: a conducting element and an electrostatic discharging component. One end of the conducting element is electrically connected to the conducting casing, and the electrostatic discharging component is electrically connected between another end of the conducting element and the power ground node. When the voltage variation between the two ends of the electrostatic discharging element reaches a preset condition, the electrostatic discharging component functions as a short circuit; otherwise, the electrostatic discharging element is equivalent to a high impedance element. The power ground node electrically connects to an electrode of a battery for using it as a vessel of receiving electrostatic charges.
摘要:
A method, a system, an apparatus, and a computer-readable medium for browsing spot information, adapted to an electronic device, are provided. In the present method, a plurality of spot information are retrieved, in which each of the spot information at least comprises a picture and a location of a spot. Next, an electronic map is displayed and a spot marker is marked at the spot location of each spot information on the electronic map. Meanwhile, a spot browsing bar is displayed on a side of the electronic map and the spot pictures of the spot information are sequentially displayed in the spot browsing bar. When a select operation of a certain spot marker on the electronic map is received, the spot browsing bar is scrolled to show the spot picture corresponding to the selected spot marker.
摘要:
A semiconductor package and related methods are described. In one embodiment, the package includes a die pad, a first plurality of leads disposed in a lead placement area around the die pad, a second plurality of leads disposed in corner regions of the lead placement area, a semiconductor chip on the die pad and coupled to each lead, and a package body. Each lead includes an upper sloped portion and a lower sloped portion. An average of surface areas of lower surfaces of each of the second plurality of leads is at least twice as large as an average of surface areas of lower surfaces of each of the first plurality of leads. The package body substantially covers the upper sloped portions of the leads. The lower sloped portions of the leads at least partially extend outwardly from a lower surface of the package body.
摘要:
A composite cover sheet includes a first protective film, a first adhesive layer, a second protective film and a second adhesive layer. The first protective film has a first sticking part and a first movable part. The first protective film is attached to a base sheet through the first adhesive layer, and the first protective film is removed from the base sheet through the first movable part. The second protective film has a second sticking part and a second movable part, and the second protective film and the first protective film are separately formed. The second protective film is attached to the first protective film through the second adhesive layer, and the second protective film is removed from the first protective film through the second movable part.
摘要:
Methods and systems for interface management are provided. First, a request message, requesting for arrangement information of at least one interface is received from a server, wherein the at least one interface contains at least one object and can be displayed on a screen of an electronic device according to the arrangement information. In response to the request message, respective arrangement information of the at least one interface is obtained and then transmitted to the server, such that a simulated interface of the at least one interface is displayed on a user interface at the server side based on the respective arrangement information received by the server, wherein when a change is made to the simulated interface of the at least one interface at the server side, the arrangement of the at least one interface is accordingly changed.
摘要:
A system and method for extracting the parasitic contact/via capacitance in an integrated circuit are provided. Parasitic extraction using this system can lead to an improved accuracy on contact/via parasitic capacitance extraction by taking into account of the actual contact/via shape and size variation. The common feature of the various embodiments includes the step of generating a technology file, in which the contact/via capacitance in the capacitance table is derived from an effective contact/via width table. Each element of the effective contact/via width table is calibrated to have a parasitic capacitance matching to that of an actual contact/via configuration occurring in an IC.
摘要:
A system and method for extracting the parasitic contact/via capacitance in an integrated circuit are provided. Parasitic extraction using this system can lead to an improved accuracy on contact/via parasitic capacitance extraction by taking into account of the actual contact/via shape and size variation. The common feature of the various embodiments includes the step of generating a technology file, in which the contact/via capacitance in the capacitance table is derived from an effective contact/via width table. Each element of the effective contact/via width table is calibrated to have a parasitic capacitance matching to that of an actual contact/via configuration occurring in an IC.