摘要:
A file download method for a mobile device, a server and a mobile device thereof, and a computer-readable medium are provided. In the method, the server obtains file identification information according to an access operation of a terminal device on a service website. When the file identification information corresponds to a file of a first type, the server transmits the file of the first type to the mobile device directly. When the file identification corresponds to a file of a second type, the server transmits the file identification information to the mobile device, so that the mobile device downloads the file of the second type according to the file identification information.
摘要:
In a semiconductor device design method performed by at least one processor, location data of at least one electrical component in a layout of a semiconductor device is extracted by the at least one processor. Voltage data associated with the at least one electrical component and based on a simulation of an operation of the semiconductor device is extracted by the at least one processor. Based on the extracted location data, the extracted voltage data is incorporated, by the at least one processor, in the layout to generate a modified layout of the semiconductor device.
摘要:
A system comprises an electronic design automation (EDA) tool, for generating a schematic design of an integrated circuit (IC), generating a layout from the schematic design, editing the layout, and verifying the schematic design and layout. At least one non-transitory, computer readable storage medium, is provided for storing data representing the schematic design and the layout, the layout having a network of routing paths connecting at least two active layer devices of the IC design. An RC tool is provided for computing estimated parasitic capacitances of the routing paths of the network before verifying the schematic design and layout, and for inserting a capacitor corresponding to the estimated parasitic capacitance into the data representing the schematic design of the IC. A first device level simulation tool for simulating performance of the network based on the at least two active layer devices and the estimated parasitic capacitances.
摘要:
A design system for designing an integrated circuit that includes a processor, a memory coupled to the processor, and instructions to generate and edit a schematic of the integrated circuit, generate at least one recommended layout parameter of an integrated circuit device within the integrated circuit, extract the at least one recommended layout parameter during a layout stage of the integrated circuit, and calculate a circuit performance parameter of the integrated circuit using the at least one recommended layout parameter, and a user interface configured to display at least one of the circuit performance parameter and layout constraints of the integrated circuit device of the integrated circuit.
摘要:
A design system includes a layout module and a user interface. The layout module includes a computing unit, which is configured to extract layout parameters of an integrated circuit device in a circuit during a layout stage of the circuit, and calculate circuit parameters of the device using the layout parameters. The user interface is configured to display the circuit parameters of the device in response to a user selection of the device.
摘要:
A knee joint includes a knee member including a movable plate connected to and pressable toward a fixed seat, and an interspace formed between the fixed seat and the movable plate. An upper connecting unit disposed atop the knee member abuts against the movable plate. A pivot shaft is inserted threadedly into the knee member and is rotatable relative thereto. Pressing the upper connection unit against the movable plate constricts the interspace so that the pivot shaft is clamped tightly between the fixed seat and the movable plate, thereby restricting a relative rotation between the knee member and the pivot shaft. The movable plate is restored to its original position when unpressed.
摘要:
A reset control device for an electronic device having a battery for providing operating power for a system circuit is provided. The reset control device includes a signal generating unit for generating a control signal, and a control module installed in the battery and coupled to the signal generating unit for disconnecting a power supply link between the battery and the system circuit for a predetermined duration and recovering the power supply link, when the control signal conforms to a predefined rule, so as to reset the system circuit.
摘要:
The present invention provides a method for packaging semiconductor device which is using more than once reflow processes to heat the solder ball to prevent the deformation of solder ball, so that the yield of the manufacturing process can be increased and the reliability of the semiconductor device can be increased.
摘要:
A file download method for a mobile device, a server and a mobile device thereof, and a computer-readable medium are provided. In the method, the server obtains file identification information according to an access operation of a terminal device on a service website. When the file identification information corresponds to a file of a first type, the server transmits the file of the first type to the mobile device directly. When the file identification corresponds to a file of a second type, the server transmits the file identification information to the mobile device, so that the mobile device downloads the file of the second type according to the file identification information.
摘要:
A semiconductor package and related methods are described. In one embodiment, the package includes a die pad, multiple leads, a chip, a package body, and a protective layer. The die pad includes an upper sloped portion, a lower sloped portion, and a peripheral edge region defining a cavity with a cavity bottom. Each lead includes an upper sloped portion and a lower sloped portion. The chip is disposed on the cavity bottom and is coupled to the leads. The package body is formed over the chip and the leads, substantially fills the cavity, and substantially covers the upper sloped portions of the die pad and the leads. The lower sloped portions of the die pad and the leads at least partially extend outwardly from a lower surface of the package body. The protective layer substantially covers the lower sloped portion and the lower surface of at least one lead.