IGBT device and related device having robustness under extreme conditions
    13.
    发明授权
    IGBT device and related device having robustness under extreme conditions 有权
    IGBT器件及相关器件在极端条件下具有鲁棒性

    公开(公告)号:US07696600B2

    公开(公告)日:2010-04-13

    申请号:US11713226

    申请日:2007-03-02

    IPC分类号: H01L29/10 H01L29/72

    摘要: A semiconductor device in the form of an IGBT has a front side contact, a rear side contact, and a semiconductor volume disposed between the front side contact and the rear side contact. The semiconductor volume includes a field stop layer for spatially delimiting an electric field that can be formed in the semiconductor volume. The semiconductor volume further includes a plurality of semiconductor zones, the plurality of semiconductor zones spaced apart from each other and each inversely doped with respect to adjacent areas. The plurality of semiconductor zones are located within the field stop layer.

    摘要翻译: IGBT形式的半导体器件具有前侧触点,后侧触点和设置在前侧触点和后侧触点之间的半导体体。 半导体体积包括用于空间地限定可以形成在半导体体积中的电场的场停止层。 半导体体积还包括多个半导体区域,多个半导体区域彼此间隔开并且相对于相邻区域反向掺杂。 多个半导体区域位于场停止层内。

    Trench diffusion isolation in semiconductor devices
    14.
    发明授权
    Trench diffusion isolation in semiconductor devices 有权
    半导体器件中的沟槽扩散隔离

    公开(公告)号:US07541260B2

    公开(公告)日:2009-06-02

    申请号:US11677430

    申请日:2007-02-21

    IPC分类号: H01L21/76

    CPC分类号: H01L29/0634 H01L29/66727

    摘要: A semiconductor structure is formed comprising a plurality of columns doped with alternating dopants. The columns are separated by trenches, and the dopant is diffused in the doped columns. The trenches are filled with semiconductor material. Other embodiments may be described and claimed.

    摘要翻译: 形成包括掺杂有交替掺杂剂的多个列的半导体结构。 这些列由沟槽分开,并且掺杂剂在掺杂柱中扩散。 沟槽填充有半导体材料。 可以描述和要求保护其他实施例。

    SEMICONDUCTOR DEVICE AND METHOD
    16.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD 有权
    半导体器件和方法

    公开(公告)号:US20090085103A1

    公开(公告)日:2009-04-02

    申请号:US11864238

    申请日:2007-09-28

    IPC分类号: H01L29/94 H01L21/00

    摘要: A semiconductor device and production method is disclosed. In one embodiment, the semiconductor device includes a first electrode and a second electrode, located on surfaces of a semiconductor body, and an insulated gate electrode. The semiconductor body has a contact groove for the first electrode in an intermediate oxide layer. Highly doped zones of a first conduction type are located in edge regions of the source connection zone. Below the highly doped zones of the first conduction type, there are highly doped zones of a body zone with a complementary conduction type. In a central region of the source connection zone, the body zone has a net charge carrier concentration with a complementary conduction type which is lower than the charge carrier concentration in the edge regions of the source connection zone.

    摘要翻译: 公开了一种半导体器件和制造方法。 在一个实施例中,半导体器件包括位于半导体本体表面上的第一电极和第二电极以及绝缘栅电极。 半导体本体具有用于中间氧化物层中的第一电极的接触槽。 第一导电类型的高掺杂区域位于源极连接区域的边缘区域。 在第一导电类型的高掺杂区之下,存在具有互补导电类型的体区的高掺杂区。 在源极连接区域的中心区域,体区具有互补导电类型的净电荷载流子浓度,该互补导电类型低于源极连接区域的边缘区域中的载流子浓度。

    Semiconductor component
    20.
    发明申请
    Semiconductor component 有权
    半导体元件

    公开(公告)号:US20050194635A1

    公开(公告)日:2005-09-08

    申请号:US11027293

    申请日:2004-12-30

    申请人: Frank Pfirsch

    发明人: Frank Pfirsch

    摘要: A semiconductor component (10) is proposed in which a control resistance element (NTC) is provided in electrical contact between a control region (G) for setting operating properties and a first input/output region (S), the control resistance element (NTC) having an operating temperature range in which the nonreactive resistance falls monotonically as the operating temperature increases.

    摘要翻译: 提出了一种半导体元件(10),其中在用于设置操作属性的控制区域(G)和第一输入/输出区域(S)之间电连接控制电阻元件(NTC),控制电阻元件(NTC) )具有工作温度范围,其中非反应电阻随着工作温度的升高而单调下降。