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公开(公告)号：US06602440B2
公开(公告)日：2003-08-05
申请号：US09885422
申请日：2001-08-13
IPC分类号： C09K1300
CPC分类号： H05K3/383 , C23F1/18 , H05K3/4611 , H05K2203/0796 , H05K2203/121 , H05K2203/124 , Y10T428/12354 , Y10T428/12361 , Y10T428/12389 , Y10T428/12472 , Y10T428/12479 , Y10T428/12514 , Y10T428/12993 , Y10T428/24273 , Y10T428/31663 , Y10T428/31678
摘要： This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate. The method also includes the step of 3) treating the substrate with a coating composition and/or 4) applying a stripping composition to the substrate. The invention also relates to copper articles, having surface porosity, including multilayer articles such as printed circuit boards and compositions used in the method. The present invention provides microporous copper or copper alloy substrates which have improved adhesion properties to organic material.
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12.发明授权Method of controlling orthophosphite ion concentration in hyphophosphite-based electroless plating baths 失效基于次磷酸盐的化学镀浴控制正磷酸根离子浓度的方法
公开(公告)号：US5221328A
公开(公告)日：1993-06-22
申请号：US800596
申请日：1991-11-27
CPC分类号： C23C18/1617 , C23C18/1683 , C23C18/36
摘要： This invention relates to a method of controlling orthophosphite ion concentration in a hypophosphite-based electroless metal plating bath, comprising the steps of contacting the plating bath with a yttrium or a lanthanide series metal salt, and removing orthophosphite ions from the bath. The methods of the present invention provide effective means for controlling phosphite ion concentration in electroless metal plating baths and especially electroless nickel plating baths. The methods of the present invention provide means for increasing pH and removing orthophosphite ions from the plating bath.
摘要翻译： 本发明涉及一种在次亚磷酸盐基化学镀金属浴中控制正磷酸根离子浓度的方法，包括以下步骤：使镀浴与钇或镧系金属盐接触，并从浴中除去正磷酸根离子。 本发明的方法提供了用于控制无电金属电镀浴中的亚磷酸根离子浓度，特别是化学镀镍浴的有效手段。 本发明的方法提供了用于提高pH和从电镀浴除去正磷酸根离子的方法。
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公开(公告)号：US4326940A
公开(公告)日：1982-04-27
申请号：US40505
申请日：1979-05-21
CPC分类号： G01N35/1097 , C25D21/14
摘要： The invention provides an on-stream method and apparatus for analyzing of the concentrations of chemical components in a bath, especially in an electroplating bath, contained in one or more processing tanks. Moreover, the information obtained by such analysis of a single bath or of multiple baths may be efficiently employed to control such concentrations in the bath or respective baths, for example, by controlling the addition of one or more additives. The apparatus comprises a multi-steam sampling value and a computer for controlling the operation of said value. The computer also controls means for adding material to the baths in order to maintain the parameters thereof.
摘要翻译： 本发明提供了一种用于分析包含在一个或多个处理罐中的浴中，特别是电镀浴中的化学成分浓度的流动方法和装置。 此外，通过单浴或多浴的分析得到的信息可以有效地用于控制浴或各浴中的这种浓度，例如通过控制添加一种或多种添加剂。 该装置包括多蒸汽采样值和用于控制所述值的操作的计算机。 计算机还控制用于向浴中添加材料以便保持其参数的装置。
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公开(公告)号：US08187448B2
公开(公告)日：2012-05-29
申请号：US12244327
申请日：2008-10-02
申请人： Agnes Rousseau , Craig V. Bishop
发明人： Agnes Rousseau , Craig V. Bishop
摘要： An electrodeposited crystalline functional chromium deposit which is nanogranular as deposited, and the deposit may be both TEM and XRD crystalline or may be TEM crystalline and XRD amorphous. In various embodiments, the deposit includes one or any combination of two or more of an alloy of chromium, carbon, nitrogen, oxygen and sulfur; a {111} preferred orientation; an average crystal grain cross-sectional area of less than about 500 nm2; and a lattice parameter of 2.8895+/−0.0025 A. A process and an electrodeposition bath for electrodepositing the nanogranular crystalline functional chromium deposit on a substrate, including providing the electrodeposition bath including trivalent chromium, a source of divalent sulfur, a carboxylic acid, a source of nitrogen and being substantially free of hexavalent chromium; immersing a substrate in the bath; and applying an electrical current to electrodeposit the deposit on the substrate.
摘要翻译： 电沉积的结晶功能铬沉积物是纳米颗粒沉积的，沉积物可以是TEM和XRD晶体，或者可以是TEM晶体和XRD无定形。 在各种实施方案中，沉积物包括铬，碳，氮，氧和硫的合金中的两种或多种的一种或任意组合; {111}优先取向; 平均晶粒截面积小于约500nm 2; 和晶格参数为2.8895 +/- 0.0025A。一种用于将纳米晶体功能性铬沉积物电沉积在基底上的方法和电沉积浴，包括提供包含三价铬的电沉积浴，二价硫源，羧酸， 氮源，基本上不含六价铬; 将基材浸入浴中; 并施加电流以将沉积物沉积在基底上。
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公开(公告)号：US20090114544A1
公开(公告)日：2009-05-07
申请号：US12244327
申请日：2008-10-02
申请人： Agnes Rousseau , Craig V. Bishop
发明人： Agnes Rousseau , Craig V. Bishop
摘要： An electrodeposited crystalline functional chromium deposit which is nanogranular as deposited, and the deposit may be both TEM and XRD crystalline or may be TEM crystalline and XRD amorphous. In various embodiments, the deposit includes one or any combination of two or more of an alloy of chromium, carbon, nitrogen, oxygen and sulfur; a {111} preferred orientation; an average crystal grain cross-sectional area of less than about 500 nm2; and a lattice parameter of 2.8895+/−0.0025 A. A process and an electrodeposition bath for electrodepositing the nanogranular crystalline functional chromium deposit on a substrate, including providing the electrodeposition bath including trivalent chromium, a source of divalent sulfur, a carboxylic acid, a source of nitrogen and being substantially free of hexavalent chromium; immersing a substrate in the bath; and applying an electrical current to electrodeposit the deposit on the substrate.
摘要翻译： 电沉积的结晶功能铬沉积物是纳米颗粒沉积的，沉积物可以是TEM和XRD晶体，或者可以是TEM晶体和XRD无定形。 在各种实施方案中，沉积物包括铬，碳，氮，氧和硫的合金中的两种或多种的一种或任意组合; {111}优先取向; 平均晶粒截面积小于约500nm 2; 和晶格参数为2.8895 +/- 0.0025A。一种用于将纳米晶体功能性铬沉积物电沉积在基底上的方法和电沉积浴，包括提供包含三价铬的电沉积浴，二价硫源，羧酸， 氮源，基本上不含六价铬; 将基材浸入浴中; 并施加电流以将沉积物沉积在基底上。
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16.发明授权Articles with electroplated zinc-nickel ternary and higher alloys, electroplating baths, processes and systems for electroplating such alloys 有权带有电镀锌镍三元及以上合金的制品，电镀浴，电镀这种合金的工艺和系统公开(公告)号：US07442286B2
公开(公告)日：2008-10-28
申请号：US10789175
申请日：2004-02-26
IPC分类号： C25D3/56
CPC分类号： C25D3/565
摘要： An electroplating bath, a system, a process for, and the article obtained from, depositing a zinc-nickel ternary or higher alloy, a) zinc ions; b) nickel ions; and c) one or more ionic species selected from ions of Te+4, Bi+3 and Sb+3, and in some embodiments, further including one or more additional ionic species selected from ions of Bi+3, Sb+3, Ag+1, Cd+2, Co+2, Cr+3, Cu+2, Fe+2, In+3, Mn+2, Mo+6, P+3, Sn+2 and W+6. In some embodiments, the system includes a divider forming a cathodic chamber and an anodic chamber, with the electroplating bath in the cathodic chamber only. In various embodiments, the zinc-nickel ternary and higher alloys may provide improved properties to the conductive substrates upon which the alloys are deposited.
摘要翻译： 电镀浴，系统，工艺和从沉积锌 - 镍三元或更高合金得到的制品，a）锌离子; b）镍离子; 和c）选自Te +4，Bi + 3和Sb + 3的离子中的一种或多种离子物质，并且在一些实施方案中， 还包括一种或多种另外的选自Bi +3 +，Sb + 3 +，+，+，+ 2 +，+ + + +， - + - ， - - - - - 在 +3 中，Mn +2，Mo +6，P +3，Sn +2 和W + 6。 在一些实施例中，系统包括形成阴极室和阳极室的分隔器，电镀浴仅在阴极室中。 在各种实施方案中，锌 - 镍三元和更高的合金可以为沉积合金的导电基底提供改进的性能。
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公开(公告)号：US06579591B2
公开(公告)日：2003-06-17
申请号：US09885353
申请日：2001-07-17
IPC分类号： B32B310
CPC分类号： H05K3/383 , C23F1/18 , H05K3/4611 , H05K2203/0796 , H05K2203/121 , H05K2203/124 , Y10T428/12354 , Y10T428/12361 , Y10T428/12389 , Y10T428/12472 , Y10T428/12479 , Y10T428/12514 , Y10T428/12993 , Y10T428/24273 , Y10T428/31663 , Y10T428/31678
摘要： This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate. The method also includes the step of 3) treating the substrate with a coating composition and/or 4) applying a stripping composition to the substrate. The invention also relates to copper articles, having surface porosity, including multilayer articles such as printed circuit boards and compositions used in the method. The present invention provides microporous copper or copper alloy substrates which have improved adhesion properties to organic material.
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公开(公告)号：US06361823B1
公开(公告)日：2002-03-26
申请号：US09454023
申请日：1999-12-03
IPC分类号： B05D512
CPC分类号： H05K3/244 , C23C18/1651 , C23C18/1666 , C23C18/1669 , C23C18/31 , C23C18/48 , C23C18/54 , Y10T428/12701 , Y10T428/12708 , Y10T428/12722
摘要： A process of preserving solderability and inhibiting tin whisker growth of exposed copper or copper alloy surfaces on a substrate comprises the steps of preparing an immersion tin plating solution substantially free of other immersion-platable metals; applying the immersion tin plating solution to the substrate to form a tin coating on the surfaces; preparing an immersion alloy plating solution containing at least two immersion-platable metals; applying the immersion alloy plating solution to the substrate by immersing the substrate in the immersion alloy plating solution to form an alloy cap layer on the tin coating. The immersion platable metals in the immersion alloy plating solution may be at least two metals selected from tin, silver, bismuth, copper, nickel, lead, zinc, indium, palladium, platinum, gold, cadmium, ruthenium and cobalt. The immersion platable metals may be added to the solution in the form of metal salts
摘要翻译： 保护基材上暴露的铜或铜合金表面的可焊性和抑制锡晶须生长的方法包括以下步骤：制备基本上不含其它可浸镀金属的浸锡镀液; 将浸镀锡溶液施加到基底上以在表面上形成锡涂层; 制备含有至少两种可浸镀金属的浸没合金电镀溶液; 通过将浸渍合金电镀液浸渍在浸渍合金电镀液中，在锡涂层上形成合金盖层，将浸渍合金电镀液施加到基板上。 浸渍合金电镀液中的浸渍金属可以是选自锡，银，铋，铜，镍，铅，锌，铟，钯，铂，金，镉，钌和钴中的至少两种金属。 浸渍金属可以以金属盐的形式加入溶液中
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19.发明授权Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom 失效生产铜表面以改进粘合的方法，其中使用的组合物和由其制成的制品公开(公告)号：US06284309B1
公开(公告)日：2001-09-04
申请号：US08994184
申请日：1997-12-19
IPC分类号： B05D512
CPC分类号： H05K3/383 , C23F1/18 , H05K3/4611 , H05K2203/0796 , H05K2203/121 , H05K2203/124 , Y10T428/12354 , Y10T428/12361 , Y10T428/12389 , Y10T428/12472 , Y10T428/12479 , Y10T428/12514 , Y10T428/12993 , Y10T428/24273 , Y10T428/31663 , Y10T428/31678
摘要： This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate. The method also includes the step of 3) treating the substrate with a coating composition and/or 4) applying a stripping composition to the substrate. The invention also relates to copper articles, having surface porosity, including multilayer articles such as printed circuit boards and compositions used in the method. The present invention provides microporous copper or copper alloy substrates which have improved adhesion properties to organic material.
摘要翻译： 本发明涉及一种通过制备能够形成共连续键的表面来形成基底的方法，包括以下步骤：1）获得铜或铜合金基底; 2）施加蚀刻组合物，其包含（a）酸，（b ）氧化剂，（c）铜络合剂和（d）铜络合物，其中铜配合物以施加到铜或铜合金基材上时析出的量存在。 该方法还包括以下步骤：3）用涂料组合物处理基材和/或4）将剥离组合物施加到基材上。 本发明还涉及具有表面孔隙率的铜制品，包括多层制品如印刷电路板和用于该方法的组合物。 本发明提供了具有改善的对有机材料的粘合性能的微孔铜或铜合金基材。
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公开(公告)号：US6086779A
公开(公告)日：2000-07-11
申请号：US260169
申请日：1999-03-01
摘要： This invention relates to an aqueous etching composition for etching metallic copper comprising(a) an acid,(b) a copper complexing agent,(c) a metal capable of having a multiplicity of oxidation states which is present in one of its higher positive oxidation states and which metal forms a composition soluble salt, and(d) oxygen wherein the concentration of the higher positive oxidation state metal in the composition is greater than about 4 grams/liter of composition.The invention also relates to a process for etching metallic copper comprising contacting the surface of a copper substrate with the aqueous etching compositions of the invention. A method of regenerating a spent aqueous etching composition of the invention which has been used for etching metallic copper also is described.
摘要翻译： 本发明涉及一种用于蚀刻金属铜的水性蚀刻组合物，其包含（a）酸，（b）铜络合剂，（c）能够具有多种氧化态的金属，其存在于其较高的阳性氧化物之一 状态和哪种金属形成组合物可溶性盐，和（d）氧，其中组合物中较高阳性氧化态金属的浓度大于约4克/升组合物。 本发明还涉及一种用于蚀刻金属铜的方法，包括使铜基材的表面与本发明的水性蚀刻组合物接触。 还描述了已经用于蚀刻金属铜的本发明的废水性蚀刻组合物的再生方法。
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