公开(公告)号：US20240154076A1

公开(公告)日：2024-05-09

申请号：US18053570

申请日：2022-11-08

Applicant: CreeLED, Inc.

Inventor： Andre Pertuit ,  Michael Check ,  David Suich ,  Colin Blakely ,  Robert Wilcox

IPC: H01L33/56 ,  H01L33/54 ,  H01L33/64

CPC classification number: H01L33/56 ,  H01L33/54 ,  H01L33/641

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly lumiphoric material structures for LED packages and related methods are disclosed. Cover structures with predefined color points for LED packages may include multiple lumiphoric material structures that are bonded together and arranged within LED packages. Lumiphoric material structures may include preformed and hardened structures, such as phosphor-in-glass or phosphor-in-ceramic, that are bonded together to form cover structures. Certain lumiphoric material structures include multiple sublayers of varying quantities and/or compositions of lumiphoric materials. Lumiphoric material structures with targeted color points may also be reduced to powder form and mixed within a binder for application in LED packages. Related methods include preforming cover structures of bonded lumiphoric material structures or assembling cover structures at a package level by separately arranging each lumiphoric material structure within LED packages.

公开(公告)号：US11233183B2

公开(公告)日：2022-01-25

申请号：US16545357

申请日：2019-08-20

Applicant: CreeLED, Inc.

Inventor： David Suich ,  Arthur F. Pun ,  Kenneth M. Davis

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/50

Abstract: Light-emitting diodes (LEDs), LED arrays, and related devices are disclosed. An LED device includes a first LED chip and a second LED chip mounted on a submount with a light-altering material in between. The light-altering material may include at least one of a light-reflective material and/or a light-absorbing material. Individual wavelength conversion elements may be arranged on each of the first and second LED chips. The light-altering material may improve the contrast between the first and second LED chips as well as between the individual wavelength conversion elements. The light-altering material may include at least one of nanoparticles, nanowires, mesowires, or combinations thereof. LED devices may include submounts in modular configurations where LED chips may be mounted on adjacent submounts to form an LED array.

公开(公告)号：US20250056933A1

公开(公告)日：2025-02-13

申请号：US18446656

申请日：2023-08-09

Applicant: CreeLED, Inc.

Inventor： David Suich ,  Michael Check ,  Colin Blakely ,  Andre Pertuit ,  Joseph G. Sokol ,  Robert Wilcox

IPC: H01L33/48 ,  H01L33/62

Abstract: Semiconductor devices and more particularly mounting structures for edge-emitting semiconductor devices are disclosed. Exemplary edge-emitting semiconductor devices include light-emitting diode (LED) edge emitters. Mounting structures include submounts with recesses configured to receive edge-emitting semiconductor devices such that emitting edges are positioned toward desired emission directions. Submount recesses are disclosed that include corresponding electrical connections for edge-emitting semiconductor devices. Multiple edge-emitting semiconductor devices are mechanically supported and electrically connected within a single recess or with multiple recesses. Corresponding devices are disclosed that include arrays of edge-emitting semiconductor devices in one or more recesses.

公开(公告)号：US20240401756A1

公开(公告)日：2024-12-05

申请号：US18800861

申请日：2024-08-12

Applicant: CreeLED, Inc.

Inventor： Robert Wilcox ,  Michael Check ,  Colin Blakely ,  David Suich ,  Joseph G. Sokol ,  Andre Pertuit

IPC: F21K9/237 ,  F21K9/90 ,  F21V19/00 ,  F21V29/71 ,  F21Y113/17 ,  F21Y115/10

Abstract: Solid-state lighting devices, and more particularly to a three-dimensional (3D) light-emitting diode (LED) device and a method of manufacture are disclosed. A submount of the LED can have several submount portions that are angled with respect to each other, and LED chips can be mounted on each submount portion, such that the LED chips of the device are angled at different angles with respect to each other. In an embodiment, the LED device can include a heatsink that is in contact with each of the submount portions to channel heat away from the LED chips. The LED chips can be mounted on the submount portions when all submount portions are laying flat, and then the submount portions can be pushed or punched into their respective angles.

公开(公告)号：US20230170445A1

公开(公告)日：2023-06-01

申请号：US17539685

申请日：2021-12-01

Applicant: CreeLED, Inc.

Inventor： David Suich ,  Christopher P. Hussell ,  Michael Check ,  Colin Blakely ,  Steven Wuester ,  Brian T. Collins

IPC: H01L33/48 ,  H01L33/00 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60

CPC classification number: H01L33/483 ,  H01L33/0095 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: Aspects disclosed herein relate to light-emitting diode (LED) chips and manufacturing processes thereof. In certain aspects, an LED chip includes an epitaxial layer with a first side and a second side, a first type contact proximate a second side of the epitaxial layer, and a wavelength conversion element including at least one lumiphore. In certain embodiments, in a flip-chip construction, a distance between the at least one lumiphore and the epitaxial layer is less than 5 microns and/or the first side of the epitaxial layer includes texturing. In certain embodiments, in a vertical stack construction, a transparent bonding layer between the epitaxial layer and the wavelength conversion element includes inorganic material. In certain embodiments, a ceramic layer is bonded to the second side of the epitaxial layer and positioned horizontally adjacent to the first type contact. Such configurations facilitate construction, decrease size, and/or increase performance of the LED chips.

公开(公告)号：US20230083154A1

公开(公告)日：2023-03-16

申请号：US17471951

申请日：2021-09-10

Applicant: CreeLED, Inc.

Inventor： Michael Check ,  David Suich ,  Steven Wuester

IPC: G01N21/552 ,  H01L33/50 ,  H01L33/56

Abstract: Lumiphoric materials and corresponding light-emitting devices, and more particularly localized surface plasmon resonance for enhanced photoluminescence of lumiphoric materials are disclosed. Plasmonic materials are disclosed that are configured to induce localized surface plasmon resonance and excite a corresponding localized surface plasmon enhanced electric field in response to incident light. An increase in photoluminescence of lumiphoric materials may be realized when the lumiphoric materials are arranged within the localized surface plasmon enhanced electric field. Plasmonic materials are disclosed that include various arrangements of nanoparticles and/or patterned structures with corresponding dielectric materials that are collectively arranged in close proximity to lumiphoric materials.

公开(公告)号：US11405996B1

公开(公告)日：2022-08-02

申请号：US17383923

申请日：2021-07-23

Applicant: CreeLED, Inc.

Inventor： David Suich ,  Casey Lapoint ,  Guy Pickett

IPC: H05B45/40 ,  H05B45/10

Abstract: Light-emitting diode (LED) arrays, and more particularly high power LED arrays and related devices are disclosed. Exemplary lighting devices with arrangements of LED chips and/or lumiphoric materials are capable of dynamically providing different color points and/or light outputs. Devices include individually controllable LED chips arranged on a common submount that may include integrated control circuitry for controlling operation of the LED chips. LED chips may be arranged to form sub-arrays of like-colored LED chips and corresponding electrical connections may include one or more shared electrical contacts. Certain aspects relate to arrangements where electrical connections are provided on opposite faces of submounts from the LED chips such that an increased density of LED chips may be arranged along primary emission faces. Applications for such high-power LED arrays and related devices include various color-changing lighting fixtures with high light output that may benefit from dynamic spectral tuning with improved precision.

公开(公告)号：US20240372052A1

公开(公告)日：2024-11-07

申请号：US18312751

申请日：2023-05-05

Applicant: CreeLED, Inc.

Inventor： Robert Wilcox ,  David Suich ,  Colin Blakely

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/48

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly LED packages for environmental indication are disclosed. LED packages include one or more LED chips and reactive materials that preferentially react with environmental ingress. After sufficient reactant exposure, the reactive materials may degrade and exhibit reduced electrical conductivity. Reactive material arrangements relative to electrical connections are provided so that the one or more LED chips either turn on, turn off, or lose brightness to provide visual indication of environmental reactants. Reactive materials may form electrical shorting paths that bypass one or more LED chips until sufficient reactant exposure when the shorting paths fail and the one or more LED chips are electrically activated. Alternatively, reactive materials may form parts of electrically conductive paths for the one or more LED chips such that with sufficient reactant exposure, the electrically conductive paths fail and the one or more LED chips are electrically deactivated.

公开(公告)号：US12078300B1

公开(公告)日：2024-09-03

申请号：US18198339

申请日：2023-05-17

Applicant: CreeLED, Inc.

Inventor： Robert Wilcox ,  Michael Check ,  Colin Blakely ,  David Suich ,  Joseph G. Sokol ,  Andre Pertuit

IPC: F21V19/00 ,  F21K9/237 ,  F21K9/90 ,  F21V29/71 ,  F21Y113/17 ,  F21Y115/10

CPC classification number: F21K9/237 ,  F21K9/90 ,  F21V19/005 ,  F21V29/713 ,  F21Y2113/17 ,  F21Y2115/10

Abstract: Solid-state lighting devices, and more particularly to a three-dimensional (3D) light-emitting diode (LED) device and a method of manufacture are disclosed. A submount of the LED can have several submount portions that are angled with respect to each other, and LED chips can be mounted on each submount portion, such that the LED chips of the device are angled at different angles with respect to each other. In an embodiment, the LED device can include a heatsink that is in contact with each of the submount portions to channel heat away from the LED chips. The LED chips can be mounted on the submount portions when all submount portions are laying flat, and then the submount portions can be pushed or punched into their respective angles.

公开(公告)号：US20240266383A1

公开(公告)日：2024-08-08

申请号：US18165720

申请日：2023-02-07

Applicant: CreeLED, Inc.

Inventor： Colin Blakely ,  Michael Check ,  David Suich ,  Andre Pertuit ,  Robert Wilcox

IPC: H01L27/15 ,  H01L33/00 ,  H01L33/24 ,  H01L33/38 ,  H01L33/58

CPC classification number: H01L27/156 ,  H01L33/0016 ,  H01L33/24 ,  H01L33/382 ,  H01L33/58 ,  H01L33/0093 ,  H01L2933/0016

Abstract: Lighting-emitting devices and more particularly light-emitting diode (LED) chips with multiple wavelength emissions and related methods are disclosed. LED chips include separately formed active LED structures that are bonded together to form a single LED chip capable of emitting multiple wavelengths. Each active LED structure may be separately patterned into a number of individual light-emitting junctions such that after bonding, a single LED chip includes multiple light-emitting junctions from multiple active LED structures. Patterns of individual light-emitting junctions may be selected so that when bonded together, emissions from different active LED structures may pass through LED chips with reduced interactions with one another. Certain aspects include vertical and horizontal offset positions for light-emitting junctions formed from different active LED structures.