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公开(公告)号：US20150102475A1
公开(公告)日：2015-04-16
申请号：US14576199
申请日：2014-12-19
Applicant: CYNTEC CO., LTD.
Inventor： Han-Hsiang Lee , YI-CHENG LIN , DA-JUNG CHEN
IPC: H01L23/495 , H01L25/07 , H01L25/16 , H01L23/31 , H01L23/552
CPC classification number: H01L23/49568 , H01L23/3107 , H01L23/49537 , H01L23/49551 , H01L23/49562 , H01L23/49575 , H01L23/49589 , H01L23/552 , H01L24/73 , H01L25/072 , H01L25/165 , H01L2224/16245 , H01L2224/32245 , H01L2224/33181 , H01L2224/48247 , H01L2224/73253 , H01L2224/73265 , H01L2924/13055 , H01L2924/13091 , H01L2924/30107 , H01L2924/3011 , H01L2924/00012 , H01L2924/00
Abstract: The invention discloses a package structure for better heat-dissipation or EMI performance. A first conductive element and a second conductive element are both disposed between the top lead frame and the bottom lead frame. The first terminal of the first conductive element is electrically connected to the bottom lead frame, and the second terminal of the first conductive element is electrically connected to the top lead frame. The third terminal of the second conductive element is electrically connected to the bottom lead frame, and the fourth terminal of the second conductive element is electrically connected to the top lead frame. In one embodiment, a heat dissipation device is disposed on the top lead frame. In one embodiment, the molding compound is provided such that the outer leads of the top lead frame are exposed outside the molding compound.
Abstract translation: 本发明公开了一种用于更好散热或EMI性能的封装结构。 第一导电元件和第二导电元件都设置在顶部引线框架和底部引线框架之间。 第一导电元件的第一端子电连接到底部引线框架，并且第一导电元件的第二端子电连接到顶部引线框架。 第二导电元件的第三端子电连接到底部引线框架，并且第二导电元件的第四端子电连接到顶部引线框架。 在一个实施例中，散热装置设置在顶部引线框架上。 在一个实施方案中，模塑料被设置成使得顶部引线框架的外部引线暴露在模塑料外部。
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Patent Agency Ranking
公开(公告)号：US20240049391A1
公开(公告)日：2024-02-08
申请号：US18229177
申请日：2023-08-02
Applicant: CYNTEC CO., LTD.
Inventor： Chien Ming Chen , DA-JUNG CHEN , SSU-LUNG HSU
CPC classification number: H05K1/144 , H05K5/0065 , H05K1/028 , H05K1/118 , H05K1/147 , H05K5/0069 , H05K2201/10939
Abstract: An electronic module, comprising: a first electronic device, a first circuit board disposed over the first top surface, and a second circuit board disposed under the bottom surface of the body of the first electronic device, wherein a plurality of conductors are disposed over a first lateral surface for electrically connecting the first circuit board and the second circuit board, wherein a plurality of electrodes of the electronic module are disposed on a bottom surface of the second circuit board.
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公开(公告)号：US20180233380A1
公开(公告)日：2018-08-16
申请号：US15955696
申请日：2018-04-18
Applicant: CYNTEC CO., LTD.
Inventor： BAU-RU LU , DA-JUNG CHEN , YI-CHENG LIN
IPC: H01L21/48 , H01L21/768 , H01L23/495 , H01L25/16 , H01L23/00 , H01L25/00
CPC classification number: H01L21/4825 , H01L21/4821 , H01L21/76877 , H01L23/49503 , H01L23/49524 , H01L23/49527 , H01L23/49534 , H01L23/49558 , H01L23/49575 , H01L23/49582 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/82 , H01L25/16 , H01L25/50 , H01L2224/215 , H01L2224/24011 , H01L2224/24247 , H01L2224/2929 , H01L2224/29339 , H01L2224/32245 , H01L2224/32257 , H01L2224/45144 , H01L2224/48247 , H01L2224/73253 , H01L2224/73265 , H01L2224/73267 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , Y10T29/49123 , H01L2924/00012 , H01L2924/00
Abstract: A package structure comprises: a plurality of metal parts, wherein each metal part is made of metal and each two adjacent metal parts are spaced apart by a gap being filled with an insulating material; a first insulating layer, disposed over a top of the plurality of metal parts and the top surface of a conductive element; and a first conductive layer, disposed over the first insulating layer, wherein a first conductive pattern electrically connects a first terminal of the conductive element to a first metal part through at least one first via disposed in the first insulating layer, wherein a bump is disposed in the first insulating layer and electrically connected to a second terminal of the conductive element.
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公开(公告)号：US20150116973A1
公开(公告)日：2015-04-30
申请号：US14594083
申请日：2015-01-10
Applicant: CYNTEC CO., LTD.
Inventor： DA-JUNG CHEN , Chun-Tiao Liu , BAU-RU LU
CPC classification number: H05K1/181 , H01F27/022 , H01F27/027 , H01F27/24 , H01F27/29 , H01F27/40 , H01L23/24 , H01L23/3121 , H01L23/552 , H01L23/645 , H01L24/73 , H01L25/16 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H05K3/3421 , H05K2201/1003 , H05K2201/10515 , H05K2201/10537 , H05K2201/10924 , Y02P70/611 , Y10T29/49146 , H01L2924/00012 , H01L2924/00
Abstract: The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.
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公开(公告)号：US20150116960A1
公开(公告)日：2015-04-30
申请号：US14594084
申请日：2015-01-10
Applicant: CYNTEC CO., LTD.
Inventor： DA-JUNG CHEN , Chun-Tiao Liu , BAU-RU LU
IPC: H05K1/18
CPC classification number: H05K1/181 , H01F27/022 , H01F27/027 , H01F27/24 , H01F27/29 , H01F27/40 , H01L23/24 , H01L23/3121 , H01L23/552 , H01L23/645 , H01L24/73 , H01L25/16 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H05K3/3421 , H05K2201/1003 , H05K2201/10515 , H05K2201/10537 , H05K2201/10924 , Y02P70/611 , Y10T29/49146 , H01L2924/00012 , H01L2924/00
Abstract: The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.
Abstract translation: 本发明公开了一种电子封装结构。 本体具有其上具有空腔的顶表面，第一导电元件设置在空腔中，并且第二导电元件设置在主体中。 电连接到第一导电元件的第一外部电极和与第二导电元件电连接的第二外部电极都设置在主体的顶表面上或由封装化合物的顶表面形成的第一表面和暴露部分 的未被封装化合物覆盖的身体的顶表面。
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公开(公告)号：US20130141886A1
公开(公告)日：2013-06-06
申请号：US13754910
申请日：2013-01-31
Applicant: Cyntec Co., Ltd.
Inventor： DA-JUNG CHEN , CHAU-CHUN WEN , CHUN-TIAO LIU
CPC classification number: H05K1/18 , H01F27/027 , H01F27/29 , H01L23/24 , H01L23/3121 , H01L23/552 , H01L23/645 , H01L24/73 , H01L25/16 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/19105 , H01L2924/30107 , H01L2924/3025 , H05K1/181 , H05K3/30 , H05K3/3421 , H05K9/00 , H05K2201/1003 , H05K2201/10515 , H05K2201/10537 , H05K2201/10924 , Y02P70/611 , Y10T29/49071 , Y10T29/49146 , H01L2924/00012 , H01L2924/00
Abstract: An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.
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