公开(公告)号：US11848146B2

公开(公告)日：2023-12-19

申请号：US17317902

申请日：2021-05-12

Applicant: CYNTEC CO., LTD.

Inventor： Da-Jung Chen ,  Chien Ming Chen

IPC: H01F27/29 ,  H01F27/28 ,  H01F41/04 ,  H01F27/24 ,  H01F27/02 ,  H01F27/26 ,  H01F41/00 ,  H01L25/16 ,  H01L49/02 ,  H01F27/36 ,  H01F41/02

CPC classification number: H01F27/29 ,  H01F27/022 ,  H01F27/24 ,  H01F27/266 ,  H01F27/2804 ,  H01F27/288 ,  H01F27/2823 ,  H01F27/363 ,  H01F41/005 ,  H01F41/02 ,  H01F41/04 ,  H01L25/16 ,  H01L28/10

Abstract: A stacked electronic module includes a magnetic device comprising a magnetic body with electrodes of the magnetic device being disposed on a top and bottom surface of the magnetic body, wherein a molding body encapsulates the magnetic body, wherein conductive layers are disposed on a top and bottom surface of the molding body for electrically connected to the electrodes of the magnetic device.

公开(公告)号：US10741531B2

公开(公告)日：2020-08-11

申请号：US16231966

申请日：2018-12-25

Applicant: CYNTEC CO., LTD.

Inventor： Chi-Feng Huang ,  Bau-Ru Lu ,  Da-Jung Chen

IPC: H01L25/16 ,  H05K1/18 ,  H05K3/34 ,  H05K3/28

Abstract: A stacked electronic structure comprises: a substrate and a magnetic device, wherein a plurality of electronic devices and a plurality of conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the plurality of electronic devices, wherein the magnetic device is disposed over the top surface of the molding body and the plurality of conductive pillars, wherein a first terminal of the magnetic device is disposed over and electrically connected to a first conductive pillar and a second terminal of the magnetic device is disposed over and electrically connected to a second conductive pillar without using any substrate.

公开(公告)号：US10593656B2

公开(公告)日：2020-03-17

申请号：US15409568

申请日：2017-01-19

Applicant: CYNTEC CO., LTD.

Inventor： Da-Jung Chen ,  Chun-Tiao Liu ,  Chau-Chun Wen

IPC: H01L25/16 ,  H01L23/495 ,  H01L23/552 ,  H01L23/04 ,  H01L23/498 ,  H01L23/64 ,  H01L23/00 ,  H01L25/10

Abstract: The present invention discloses a three-dimensional package structure. The first conductive element comprises a top surface, a bottom surface and a lateral surface. The conductive pattern disposed on the top surface of the first conductive element. A second conductive element is disposed on the conductive pattern. The first conductive element is electrically connected to the conductive pattern, and the second conductive element is electrically connected to the conductive pattern. In one embodiment, the shielding layer is a portion of the patterned conductive layer.

公开(公告)号：US09741590B2

公开(公告)日：2017-08-22

申请号：US15334307

申请日：2016-10-26

Applicant: CYNTEC CO., LTD.

Inventor： Bau-Ru Lu ,  Da-Jung Chen ,  Yi-Cheng Lin

IPC: H01L23/12 ,  H01L21/48 ,  H01L23/495 ,  H01L21/768 ,  H01L25/00 ,  H01L25/16 ,  H01L23/00

CPC classification number: H01L21/4825 ,  H01L21/4821 ,  H01L21/76877 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49527 ,  H01L23/49534 ,  H01L23/49558 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/215 ,  H01L2224/24011 ,  H01L2224/24247 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/49123 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer on the top surface of the plurality of metal parts; and forming a conductive pattern layer on the insulating layer for making electrical connections with at least one portion of the plurality of metal parts.

公开(公告)号：US20170133355A1

公开(公告)日：2017-05-11

申请号：US15409568

申请日：2017-01-19

Applicant: CYNTEC CO., LTD.

Inventor： Da-Jung Chen ,  Chun-Tiao Liu ,  Chau-Chun Wen

IPC: H01L25/16 ,  H01L23/498 ,  H01L23/552 ,  H01L23/64 ,  H01L23/04 ,  H01L23/495

CPC classification number: H01L25/162 ,  H01L23/04 ,  H01L23/495 ,  H01L23/49517 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49811 ,  H01L23/49861 ,  H01L23/552 ,  H01L23/645 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present invention discloses a three-dimensional package structure. The first conductive element comprises a top surface, a bottom surface and a lateral surface. The conductive pattern disposed on the top surface of the first conductive element. A second conductive element is disposed on the conductive pattern. The first conductive element is electrically connected to the conductive pattern, and the second conductive element is electrically connected to the conductive pattern. In one embodiment, the shielding layer is a portion of the patterned conductive layer.

公开(公告)号：US20150055315A1

公开(公告)日：2015-02-26

申请号：US14532021

申请日：2014-11-04

Applicant: CYNTEC CO., LTD.

Inventor： Bau-Ru Lu ,  Kai-Peng Chiang ,  Da-Jung Chen ,  Tsung-Chan Wu

IPC: H01F27/30 ,  H01L23/495 ,  H01L23/64 ,  H01F27/29

CPC classification number: H01F27/306 ,  H01F27/29 ,  H01F2027/297 ,  H01L23/3121 ,  H01L23/495 ,  H01L23/49575 ,  H01L23/645 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  Y10T29/4913 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An inductive component is disclosed. The inductive component comprises a magnetic body and a coil in the magnetic body, wherein a first protrusion and a second protrusion are formed on the bottom surface of the magnetic body, wherein the first protrusion comprises a first electrode disposed on the peak surface of the first protrusion, and the second protrusion comprises a second electrode disposed on the peak surface of the second protrusion, wherein the first electrode and the second electrode are electrically connected to a first end and a second end of the coil, and a space is formed by the first protrusion, the second protrusion and the bottom surface of the magnetic body for accommodating electronic devices.

Abstract translation: 公开了一种电感元件。 感应部件包括磁体和磁体中的线圈，其中第一突起和第二突起形成在磁体的底表面上，其中第一突起包括设置在第一突起和第二突起的峰表面上的第一电极 并且所述第二突起包括设置在所述第二突起的峰表面上的第二电极，其中所述第一电极和所述第二电极电连接到所述线圈的第一端和第二端，并且由所述第二电极形成空间 第一突起，第二突起和用于容纳电子装置的磁体的底表面。

公开(公告)号：US12094644B2

公开(公告)日：2024-09-17

申请号：US18132365

申请日：2023-04-08

Applicant: CYNTEC CO., LTD.

Inventor： Da-Jung Chen ,  Chi-Feng Huang

IPC: H01F27/32 ,  H01F27/24 ,  H01F27/28 ,  H01F27/29 ,  H05K1/16

CPC classification number: H01F27/327 ,  H01F27/24 ,  H01F27/2804 ,  H01F27/292 ,  H05K1/165

Abstract: An electronic structure comprising: a circuit board, wherein electronic devices and a transformer are disposed on the circuit board, wherein the transformer comprises a first coil, a second coil, and a magnetic body comprising a pillar with at least one portion of the pillar being disposed in a through-opening of the circuit board, wherein the first coil is wound around an upper portion of the pillar and the second coil is wound around a lower portion of the pillar for forming the transformer.

公开(公告)号：US20190131286A1

公开(公告)日：2019-05-02

申请号：US16231966

申请日：2018-12-25

Applicant: CYNTEC CO., LTD.

Inventor： Chi-Feng Huang ,  Bau-Ru Lu ,  Da-Jung Chen

IPC: H01L25/16 ,  H05K1/18

Abstract: A stacked electronic structure comprises: a substrate and a magnetic device, wherein a plurality of electronic devices and a plurality of conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the plurality of electronic devices, wherein the magnetic device is disposed over the top surface of the molding body and the plurality of conductive pillars, wherein a first terminal of the magnetic device is disposed over and electrically connected to a first conductive pillar and a second terminal of the magnetic device is disposed over and electrically connected to a second conductive pillar without using any substrate.

公开(公告)号：US09978611B2

公开(公告)日：2018-05-22

申请号：US15654703

申请日：2017-07-20

Applicant: CYNTEC CO., LTD.

Inventor： Bau-Ru Lu ,  Da-Jung Chen ,  Yi-Cheng Lin

IPC: H01L23/00 ,  H01L21/48 ,  H01L23/495 ,  H01L21/768 ,  H01L25/00 ,  H01L25/16

CPC classification number: H01L21/4825 ,  H01L21/4821 ,  H01L21/76877 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49527 ,  H01L23/49534 ,  H01L23/49558 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/215 ,  H01L2224/24011 ,  H01L2224/24247 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/49123 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer over the top surface or the bottom surface of the plurality of metal parts; and forming a conductive pattern layer on the insulating layer for making electrical connections with at least one portion of the plurality of metal parts.

公开(公告)号：US09735091B2

公开(公告)日：2017-08-15

申请号：US14576199

申请日：2014-12-19

Applicant: CYNTEC CO., LTD.

Inventor： Han-Hsiang Lee ,  Yi-Cheng Lin ,  Da-Jung Chen

IPC: H01L23/02 ,  H01L23/495 ,  H01L23/31 ,  H01L23/552 ,  H01L25/07 ,  H01L25/16 ,  H01L23/00

CPC classification number: H01L23/49568 ,  H01L23/3107 ,  H01L23/49537 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49589 ,  H01L23/552 ,  H01L24/73 ,  H01L25/072 ,  H01L25/165 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The invention discloses a package structure for better heat-dissipation or EMI performance. A first conductive element and a second conductive element are both disposed between the top lead frame and the bottom lead frame. The first terminal of the first conductive element is electrically connected to the bottom lead frame, and the second terminal of the first conductive element is electrically connected to the top lead frame. The third terminal of the second conductive element is electrically connected to the bottom lead frame, and the fourth terminal of the second conductive element is electrically connected to the top lead frame. In one embodiment, a heat dissipation device is disposed on the top lead frame. In one embodiment, the molding compound is provided such that the outer leads of the top lead frame are exposed outside the molding compound.