公开(公告)号：US07042067B2

公开(公告)日：2006-05-09

申请号：US10393164

申请日：2003-03-19

Applicant: Giorgio Giaretta ,  Rudolf J. Hofmeister ,  The′ Linh Nguyen ,  Dev Kumar

Inventor： Giorgio Giaretta ,  Rudolf J. Hofmeister ,  The′ Linh Nguyen ,  Dev Kumar

IPC: H01L29/40 ,  H01L23/48

CPC classification number: G02B6/4201 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/48137 ,  H01L2224/49171 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/023 ,  H05K1/0243 ,  H05K1/189 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/09809 ,  H05K2201/10022 ,  H05K2201/10121 ,  H05K2201/10522 ,  H05K2201/2036 ,  H01L2924/00

Abstract: An optoelectronic assembly includes a circuit board having a set of signal traces, where one or more of the signal traces has a junction point that integrates a pad of a circuit element. Exemplary circuit elements include a resistor, capacitor, and an inductor. The junction point has a first width and a first thickness, and the one or more signal traces have a second width and a second thickness. The dimensions of the junction point and the dimensions of the one or more signal traces are configured such that the first width and the second width are substantially similar, and that the first thickness and the second thickness are substantially similar. In one embodiment, the first width is no greater than 125% of the second width.

公开(公告)号：US20050141819A1

公开(公告)日：2005-06-30

申请号：US10852991

申请日：2004-05-25

Applicant: Donald Ice ,  Dev Kumar ,  Rudy Hofmeister

Inventor： Donald Ice ,  Dev Kumar ,  Rudy Hofmeister

IPC: G02B6/42 ,  H05K3/32

CPC classification number: H05K3/325 ,  G02B6/4201 ,  G02B6/4246 ,  G02B6/428 ,  G02B6/4284 ,  H05K2201/0314 ,  H05K2201/10121 ,  H05K2201/10446

Abstract: A transceiver module is provided that includes an optical subassembly having an extension with traces corresponding to traces defined on an associated transceiver substrate. A connector element including a flexible, non-electrically conductive substrate within which is disposed an array of conductors is placed between overlapping portions of the extension and the transceiver substrate so that upper ends of some of the conductors contact the traces of the extension, while lower ends of those same conductors contact the corresponding traces of the transceiver substrate. In this way, the connector element provides electrical communication between the optical subassembly and transceiver substrate, while also accommodating misalignment that may be present, or develop, in the transceiver module components.

Abstract translation: 提供了一种收发器模块，其包括光学子组件，其具有对应于在相关收发器基板上限定的走线的走线的延伸部分。 包括柔性非导电基底的连接器元件被放置在导体阵列的内部，放置在延伸部和收发器基底的重叠部分之间，使得一些导体的上端与延伸部的迹线接触，而较低的 这些相同导体的端部与收发器基板的相应迹线接触。 以这种方式，连接器元件提供光学子组件和收发器基板之间的电连通，同时还适应在收发器模块组件中可能存在或发展的未对准。

公开(公告)号：US20050045374A1

公开(公告)日：2005-03-03

申请号：US10835832

申请日：2004-04-30

Applicant: Dev Kumar ,  Donald Ice ,  Kinya Nippa

Inventor： Dev Kumar ,  Donald Ice ,  Kinya Nippa

IPC: H01L23/055 ,  H01L23/10 ,  H01S5/022 ,  H01S5/024 ,  H01S5/183 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/118 ,  H01L23/055 ,  H01L23/10 ,  H01L2924/0002 ,  H05K2201/09145 ,  H05K2201/10121 ,  H05K2203/167 ,  H01L2924/00

Abstract: A flexible circuit comprises a flexible substrate having first and second opposing surfaces. The flexible substrate can include multiple layers. A plurality of electrical traces can be mounted on either or both surfaces of the flexible substrate. A plurality of electrical components can also be mounted on either or both surfaces of the flexible substrate. A plurality of tooling cutouts is recessed in the sides of the flexible circuit. The tooling cutouts can have various shapes, such as, but not limited to, semi-circular, multiple straight edges, a single or multiple curved edges, etc. The cutouts are used to position and hold the flexible circuit in at least one other device.

Abstract translation: 柔性电路包括具有第一和第二相对表面的柔性基板。 柔性基底可以包括多层。 多个电迹线可以安装在柔性基板的一个或两个表面上。 多个电气部件也可以安装在柔性基板的一个或两个表面上。 多个工具切口凹入柔性电路的侧面。 加工切口可以具有各种形状，例如但不限于半圆形，多直线边缘，单个或多个弯曲边缘等。切口用于将柔性电路定位和保持在至少一个其它装置中 。

公开(公告)号：US11420344B2

公开(公告)日：2022-08-23

申请号：US16392539

申请日：2019-04-23

Applicant: Robert Anderson ,  David Zito ,  Grant Stafford ,  William Werst ,  Dev Kumar

Inventor： Robert Anderson ,  David Zito ,  Grant Stafford ,  William Werst ,  Dev Kumar

IPC: B25J19/00 ,  B25J11/00 ,  B08B1/00 ,  B08B17/04 ,  B08B9/023 ,  B32B1/08 ,  B32B7/02 ,  B32B27/08

Abstract: A sleeve apparatus for protecting a robotic kitchen arm from contamination. The sleeve includes a proximal end, a distal end, a passageway extending from the proximal end to the distal end, and an exterior surface. The passageway has an effective diameter less than the effective diameter of the robotic kitchen arm such that the exterior surface of the sleeve apparatus is substantially fold-free when the robotic arm is in the extended configuration. Methods of cleaning a robotic kitchen arm are also described.

公开(公告)号：US20100202599A1

公开(公告)日：2010-08-12

申请号：US12368192

申请日：2009-02-09

Applicant: W. Daniel Hillis ,  Neal E. Chapman ,  Russel Howe ,  Dev Kumar ,  Randall Adam Yates

Inventor： W. Daniel Hillis ,  Neal E. Chapman ,  Russel Howe ,  Dev Kumar ,  Randall Adam Yates

IPC: H04M11/00

CPC classification number: H04M11/066 ,  H04L12/1818 ,  H04M1/2478 ,  H04M3/56 ,  H04M7/122

Abstract: In a communications system, after parties form a dial up voice telephone connection, the parties respective communications devices automatically create or leverage machine readable features or content of the telephone connection to identify the parties to each other or to a rendezvous server, and thereafter the communications devices and/or the rendezvous server automatically establishes a data link between the parties.

Abstract translation: 在通信系统中，在各方形成拨号语音电话连接之后，各方各自的通信设备自动创建或利用电话连接的机器可读特征或内容，以标识彼此或聚会服务器之间的各方，此后通信 设备和/或会合服务器自动建立双方之间的数据链路。

公开(公告)号：US20050025449A1

公开(公告)日：2005-02-03

申请号：US10929944

申请日：2004-08-30

Applicant: John Dirkson ,  James Douma ,  Rudolf Hofmeister ,  Samantha Bench ,  Dev Kumar

Inventor： John Dirkson ,  James Douma ,  Rudolf Hofmeister ,  Samantha Bench ,  Dev Kumar

IPC: G02B6/00 ,  H04B10/08

CPC classification number: H04B10/07

Abstract: An assembly and method for testing an optical subassembly by locally heating or cooling the optical subassembly. Locally heating or cooling the optical subassembly can include using a thermal transfer assembly. The thermal transfer assembly can include a thermoelectric cooler. A clamping assembly is provided to place the optical subassembly in electrical communication with a testing assembly. The thermal transfer assembly can be associated with the clamping assembly. After achieving the desired temperature, a data stream is transmitted through the optical subassembly and evaluated for compliance.

Abstract translation: 通过局部加热或冷却光学组件来测试光学组件的组件和方法。 局部加热或冷却光学组件可包括使用热转印组件。 热转印组件可以包括热电冷却器。 提供夹紧组件以将光学子组件放置成与测试组件电连通。 热转印组件可与夹紧组件相关联。 达到所需温度后，通过光学组件传输数据流并进行评估。