Abstract:
A method of driving a nonvolatile memory device including applying a reset voltage to a unit memory cell, reading a reset current of the unit memory cell, confirming whether the reset current is within a first current range, if the reset current is not within the first current range, changing the reset voltage and applying a changed reset voltage or applying again the reset voltage to the unit memory cell after applying a set voltage to the unit memory cell, if the reset current is within the first current range, confirming whether a difference between the present reset current and an immediately previous set current is within a second current range, and, if the difference is not within the second current range, applying the reset voltage or applying again the reset voltage to the unit memory cell after applying a set voltage to the unit memory cell.
Abstract:
Disclosed are an optical line terminal in a gigabit passive optical network and a method for transmitting a broadcast frame using the same. The optical line terminal allocates second port identifiers to optical network units such that a broadcast frame is prevented from being retransmitted to an optical network unit which has transmitted the broadcast frame to the optical line terminal.
Abstract:
An apparatus for semiconductor die bonding includes a first bonding head and a second bonding head configured to respectively pickup a first semiconductor chip and a second semiconductor chip located at a pickup point. The apparatus for semiconductor die bonding may also include a first transfer device configured to transfer the first bonding head from the pickup point to a bonding point located on a substrate along a transfer path. The first transfer device may further be configured to return to the pickup point along a first return path after the first semiconductor chip is bonded to the substrate. Also, the apparatus for semiconductor die bonding may include a second transfer device configured to transfer the second bonding head from the pickup point to the bonding point located on the substrate along the transfer path. The second transfer device may further be configured to return to the pickup point along a second return path after the second semiconductor chip is bonded to the substrate. Additionally, the apparatus for semiconductor die bonding may include a controller configured to alternately apply a transfer signal and a return signal to the first transfer device and the second transfer device so the first bonding head and the second bonding head do not collide with each other.
Abstract:
Provided are an apparatus and method for efficiently and dynamically allocating a bandwidth on a Time Division Multiple Access-based Passive Optical Network (TDMA PON). The dynamic bandwidth allocation apparatus for uplink data transmission of a plurality of Optical Network Units (ONUs) including a plurality of class queues corresponding to Transmission Container (T-CONT) types, the plurality of ONUs connected to an Optical Line Terminal (OLT) on a Passive Optical Network (PON), includes: a class queue information storage unit storing information regarding a bandwidth allocation period and an allocatable bandwidth amount for each T-CONT type; an allocation check table unit checking the bandwidth allocation period for the T-CONT type received from the class queue information storage unit, and determining an allocatable bandwidth amount for the T-CONT type; and a bandwidth allocation unit allocating an uplink bandwidth to the T-CONT type with reference to the bandwidth allocation period and the allocatable bandwidth amount for the T-CONT type, and re-allocating to each ONU an uplink bandwidth remaining after allocating a total uplink bandwidths to all T-CONT types.
Abstract:
A burst mode optical repeater is provided. The burst mode optical repeater receives optical signals, which are transmitted from a plurality of optical network units (ONUs) in a passive optical network (PON) to a central office using a time division multiplexing access (TDMA) method, and relays the received optical signals using an optical-electrical-optical (OEO) method. Since the burst mode optical repeater can be installed anywhere between an optical line terminal (OLT) and the ONUs, the number of subscribers and transmission range that can be supported by a corresponding network can be increased.
Abstract:
A system for testing memory modules having a rotating-type board mounting portion with a plurality of mounting surfaces positioned at different planes and connected around an axis to form a rotatable structure, at least one circuit board mounted on each mounting surface, an input/output portion, a rotational motor coupled to a rotational shaft for rotating the rotatable structure, and a central controller electrically connected to the circuit boards.
Abstract:
An apparatus and method for on-line decomposition of a hydrogen peroxide solution, for use in fabricating a semiconductor device, includes a membrane tube having a porous plug inserted in each end, with the porous plugs defining a space where a platinum catalyst is disposed. A first coupling tube is inserted into one end of the membrane tube to supply a hydrogen peroxide sample to the membrane tube. The hydrogen peroxide contained in hydrogen peroxide sample is decomposed into water and oxygen gas according to an action of the platinum catalyst. A second coupling tube is inserted into a second end of the membrane tube to discharge a diluted hydrogen peroxide solution to an analytical instrument, where the decomposed hydrogen peroxide solution is analyzed on-line.
Abstract:
A game exposing method and system is provided. The game exposing method includes displaying a game web site in a first folder of a file manager application of a user terminal; and displaying a game provided from the game web site in a second folder of the file manager application. Accordingly, it is possible to easily access the game portal web site and the game pages to play the games while operating in the file manager application.
Abstract:
In one embodiment, the memory element may include a first electrode, a second electrode spaced apart from the first electrode, a memory layer between the first electrode and the second electrode, and an auxiliary layer between the memory layer and the second electrode. The auxiliary layer provides a multi-bit memory characteristic to the memory layer.
Abstract:
The present disclosure relates to a semiconductor device including an oxygen gettering layer between a group III-V compound semiconductor layer and a dielectric layer, and a method of fabricating the semiconductor device. The semiconductor device may include a compound semiconductor layer; a dielectric layer disposed on the compound semiconductor layer; and an oxygen gettering layer interposed between the compound semiconductor layer and the dielectric layer. The oxygen gettering layer includes a material having a higher oxygen affinity than a material of the compound semiconductor layer.