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公开(公告)号：US06646081B2
公开(公告)日：2003-11-11
申请号：US10044366
申请日：2002-01-11
申请人： James P. Godschalx , Qing Shan J. Niu , Kenneth J. Bruza , Clark H. Cummins , Paul H. Townsend, III
发明人： James P. Godschalx , Qing Shan J. Niu , Kenneth J. Bruza , Clark H. Cummins , Paul H. Townsend, III
IPC分类号： C08F2606
CPC分类号： H01L23/5329 , C08G61/00 , C08G61/10 , C08G2261/46 , C08G2261/80 , C08L65/00 , C08L65/02 , H01L2924/0002 , C08L2666/04 , H01L2924/00
摘要： This invention is a polyarylene composition in which resin does not undergo a significant drop in modulus at temperatures above 300° C. during cure. This feature enables one to form porous films by avoiding pore collapse and/or using a wider variety of poragen materials.
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公开(公告)号：US06359091B1
公开(公告)日：2002-03-19
申请号：US09447012
申请日：1999-11-22
申请人： James P. Godschalx , Kenneth J. Bruza , Qing Shan J. Niu , Clark H. Cummins , Paul H. Townsend, III
发明人： James P. Godschalx , Kenneth J. Bruza , Qing Shan J. Niu , Clark H. Cummins , Paul H. Townsend, III
IPC分类号： C08F3800
CPC分类号： H01L23/5329 , C08G61/00 , C08G61/10 , C08G2261/46 , C08G2261/80 , C08L65/00 , C08L65/02 , H01L2924/0002 , C08L2666/04 , H01L2924/00
摘要： This invention is a polyarylene composition in which resin does not undergo a significant drop in modulus at temperatures above 300° C. during cure. This feature enables one to form porous films by avoiding pore collapse and/or using a wider variety of poragen materials.
摘要翻译： 本发明是聚酰亚胺组合物，其中树脂在固化期间在高于300℃的温度下不会发生显着的模量降低。 该特征使得能够通过避免孔塌陷和/或使用更多种类的成孔材料来形成多孔膜。
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公开(公告)号：US5965679A
公开(公告)日：1999-10-12
申请号：US834677
申请日：1997-04-01
申请人： James P. Godschalx , Duane R. Romer , Ying Hung So , Zenon Lysenko , Michael E. Mills , Gary R. Buske , Paul H. Townsend, III , Dennis W. Smith, Jr. , Steven J. Martin , Robert A. DeVries
发明人： James P. Godschalx , Duane R. Romer , Ying Hung So , Zenon Lysenko , Michael E. Mills , Gary R. Buske , Paul H. Townsend, III , Dennis W. Smith, Jr. , Steven J. Martin , Robert A. DeVries
CPC分类号： C08G61/10 , C08G2261/312
摘要： An oligomer, uncured polymer or cured polymer comprising the reaction product of one or more polyfunctional compounds containing two or more cyclopentadienone groups and at least one polyfunctional compound containing two or more aromatic acetylene groups wherein at least some of the polyfunctional compounds contain three or more reactive groups. Such oligomers and uncured polymers may be cured to form cured polymers which are useful as dielectrics in the microelectronics industry, especially for dielectrics in integrated circuits.
摘要翻译： 包含含有两个或多个环戊二烯酮基团的一种或多种多官能化合物与至少一种含有两个或多个芳族乙炔基团的多官能化合物的反应产物的低聚物，未固化聚合物或固化聚合物，其中至少一些多官能化合物含有三个或更多个反应性 团体 这种低聚物和未固化的聚合物可以固化以形成固化聚合物，其可用作微电子工业中的电介质，特别是用于集成电路中的电介质。
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14.发明授权
公开(公告)号：US5668210A
公开(公告)日：1997-09-16
申请号：US459055
申请日：1995-06-02
IPC分类号： C09D165/00 , C09D183/04 , C09D183/06 , C09D183/08 , C08L83/00 , H01L21/312
CPC分类号： C09D183/04 , C09D183/06 , C09D183/08
摘要： A coating composition comprising:a hydrolyzed or partially hydrolyzed alkoxysilane,a solvent,and an arylcyclobutene;is useful in a variety of applications, including coatings for multichip modules, flat panel displays and integrated circuits. The preferred alkoxysilanes correspond to the formula: ##STR1## wherein R is C.sub.1 -C.sub.6 alkylidene, C.sub.1 -C.sub.6 alkylene, arylene, or a direct bond; Y is C.sub.1 -C.sub.6 alkyl, C.sub.2 -C.sub.6 alkenyl, aryl, 3-methacryloxy, 3-acryloxy, 3-aminoethylamino, or 3-amino; R' is independently in each occurrence C.sub.1 -C.sub.6 alkyl; and Z is C.sub.1 -C.sub.6 alkyl, C.sub.2 -C.sub.6 alkenyl or OR'.
摘要翻译： 一种涂料组合物，包括：水解或部分水解的烷氧基硅烷，溶剂和芳基环丁烯; 可用于各种应用，包括多芯片模块，平板显示器和集成电路的涂层。 优选的烷氧基硅烷对应于下式：其中R是C1-C6亚烷基，C1-C6亚烷基，亚芳基或直接键; Y是C1-C6烷基，C2-C6烯基，芳基，3-甲基丙烯酰氧基，3-丙烯酰氧基，3-氨基乙基氨基或3-氨基; R'在每次出现时独立地为C1-C6烷基; Z为C1-C6烷基，C2-C6烯基或OR'。
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15.发明授权公开(公告)号：US06946382B2
公开(公告)日：2005-09-20
申请号：US10505511
申请日：2003-04-01
IPC分类号： H01L23/522 , H01L21/027 , H01L21/311 , H01L21/312 , H01L21/316 , H01L21/762 , H01L21/768 , H01L23/532 , H01L21/4763
CPC分类号： H01L21/02118 , H01L21/02203 , H01L21/0271 , H01L21/0274 , H01L21/31144 , H01L21/312 , H01L21/3122 , H01L21/31695 , H01L21/76289 , H01L21/7682 , H01L23/5222 , H01L23/5329 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： A method of forming at least a partial air gap within a semiconducting device and the resulting devices, said method comprising the steps of: (a) depositing a sacrificial polymeric composition in one or more layers of the device during its formation; (b) coating the device with one or more layers of a relatively non-porous, organic, polymeric, insulating dielectric material (hardmask) having a density less than 2.2 g/cm3; and (c) decomposing the sacrificial polymeric composition such that the decomposition products permeate at least partially through the one or more hardmask layers, thereby forming at least a partial air gap within the device.
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公开(公告)号：US5196103A
公开(公告)日：1993-03-23
申请号：US729525
申请日：1991-07-12
IPC分类号： C08G61/06 , C23C14/02 , C23C14/20 , H01L23/498
CPC分类号： C23C14/20 , C08G61/06 , C23C14/022 , H01L23/49894 , H01L2924/0002
摘要： The present invention refers to an electrical interconnection device having conductive metal layers separated by a dielectric cyclobutarene polymer layer. The adhesion of the conductive metal layer to the dielectric cyclobutarene polymer layer is promoted by a carbide-forming metal interface layer. Further disclosed is a method of making such electrical interconnection device by ion sputtering the dielectric cyclobutarene polymer surface, vapor depositing a carbide-forming metal interface layer onto the sputtered polymer surface, and then vapor depositing the superior conductive metal layer onto the carbide-forming metal interface layer.
摘要翻译： 本发明涉及一种具有由介电环丁烯聚合物层分离的导电金属层的电互连装置。 通过碳化物形成金属界面层促进导电金属层与电介质环丁烯聚合物层的粘附。 进一步公开的是通过离子溅射介电环丁烯聚合物表面，将碳化物形成金属界面层气相沉积到溅射的聚合物表面上，然后将上导电金属层气相沉积到碳化物形成金属上的方法 界面层
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