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    Slurry compositions and methods of polishing a layer using the slurry compositions
    12.
    发明授权
    Slurry compositions and methods of polishing a layer using the slurry compositions 有权
    浆料组合物和使用浆料组合物抛光层的方法

    公开(公告)号：US08314028B2

    公开(公告)日：2012-11-20

    申请号：US11853735

    申请日：2007-09-11

    申请人： Gi-Sik Hong ,  Dong-Jun Lee ,  Nam-Soo Kim ,  Kyoung-Moon Kang

    发明人： Gi-Sik Hong ,  Dong-Jun Lee ,  Nam-Soo Kim ,  Kyoung-Moon Kang

    IPC分类号： H01L21/461 ,  C09K13/00

    CPC分类号： C09K3/1463 ,  C09G1/02 ,  C09K3/1436 ,  H01L21/31053

    摘要： In a slurry composition and a method of polishing a layer using the slurry composition, the slurry composition includes from about 3 to 20 percent by weight of an abrasive, from about 0.1 to 3 percent by weight of an ionic surfactant, from about 0.01 to 0.1 percent by weight of a nonionic surfactant, from about 0.01 to 1 percent by weight of a polish accelerating agent including an amino acid compound, and a remainder of an aqueous solution including a basic pH-controlling agent and water. The slurry composition including the nonionic surfactant and the polish accelerating agent may be used for speedily polishing a stepped upper portion of a silicon oxide layer, and may also enable a lower portion of the silicon oxide layer to function as a polish stop layer.

    摘要翻译： 在浆料组合物和使用浆料组合物抛光层的方法中，浆料组合物包括约3-20重量％的研磨剂，约0.1-3重量％的离子表面活性剂，约0.01至0.1重量％ 重量百分比的非离子表面活性剂，约0.01至1％重量的包含氨基酸化合物的抛光促进剂，以及剩余的包含碱性pH控制剂和水的水溶液。 包括非离子表面活性剂和抛光促进剂的浆料组合物可以用于快速抛光氧化硅层的阶梯状上部，并且还可以使氧化硅层的下部用作抛光停止层。

    Slurry composition, method of polishing an object layer and method of manufacturing a non-volatile memory device using the slurry composition
    15.
    发明申请
    Slurry composition, method of polishing an object layer and method of manufacturing a non-volatile memory device using the slurry composition 审中-公开
    浆料组合物，抛光物体层的方法和使用该浆料组合物制造非易失性存储器件的方法

    公开(公告)号：US20070281486A1

    公开(公告)日：2007-12-06

    申请号：US11809672

    申请日：2007-06-01

    申请人： Eui-Jin Han ,  Nam-Soo Kim ,  Bong-Su Ahn ,  Dong-Jun Lee

    发明人： Eui-Jin Han ,  Nam-Soo Kim ,  Bong-Su Ahn ,  Dong-Jun Lee

    IPC分类号： H01L21/461 ,  H01L21/302

    CPC分类号： H01L21/76819 ,  C09G1/02 ,  H01L21/31053 ,  H01L27/115 ,  H01L27/11521

    摘要： Methods of polishing an object layer and for manufacturing a non-volatile memory device that incorporates such a polished object layer using a specially formulated slurry composition are disclosed. The slurry compositions include a ceria abrasive, a nonionic surfactant having a hydrophilic-lipophilic balance (HLB) value in a range of about 12 to about 17, and water. The nonionic surfactant is selected such that it may be adsorbed onto a hydrophobic layer to protect the hydrophobic layer from the ceria abrasive during a polishing operation. The slurry compositions may have a relatively high polishing rate for a hydrophilic layer and at the same time a relatively low polishing rate for a hydrophobic layer. Thus, the slurry compositions may be applied during a process for polishing the hydrophilic layer using the hydrophobic layer as a polishing stop layer.

    摘要翻译： 公开了抛光目标层和用于制造使用特别配制的浆料组合物并入这种抛光对象层的非易失性存储器件的方法。 浆料组合物包括二氧化铈磨料，亲水 - 亲油平衡（HLB）值在约12至约17的范围内的非离子表面活性剂和水。 选择非离子表面活性剂，使得其可以在抛光操作期间吸附到疏水层上以保护疏水层免受二氧化铈磨料的侵蚀。 该浆料组合物可以具有相对较高的抛光速率，对于亲水层，同时对疏水层具有较低的抛光速率。 因此，可以在使用疏水层作为抛光停止层的亲水层的抛光工艺期间施加浆料组合物。

    PAD CONDITIONER OF SEMICONDUCTOR WAFER POLISHING APPARATUS AND MANUFACTURING METHOD THEREOF
    17.
    发明申请
    PAD CONDITIONER OF SEMICONDUCTOR WAFER POLISHING APPARATUS AND MANUFACTURING METHOD THEREOF 审中-公开
    半导体波形抛光装置的PAD调节器及其制造方法

    公开(公告)号：US20090042494A1

    公开(公告)日：2009-02-12

    申请号：US12187007

    申请日：2008-08-06

    申请人： Sung-Taek Moon ,  Kyoung-Moon Kang ,  Bong-Su Ahn ,  Nam-Soo Kim ,  Gi-Sik Hong

    发明人： Sung-Taek Moon ,  Kyoung-Moon Kang ,  Bong-Su Ahn ,  Nam-Soo Kim ,  Gi-Sik Hong

    IPC分类号： B24B53/02 ,  B24D18/00 ,  C25D9/04 ,  B24B53/00

    CPC分类号： C25D7/00 ,  B24B53/017 ,  B24B53/02 ,  B24D18/0018 ,  C23C26/00 ,  C25D13/02

    摘要： A pad conditioner of semiconductor wafer polishing apparatus and a pad conditioner manufacturing method thereof are provided with a uniform conditioning for a polishing pad of a polishing apparatus, the polishing apparatus being for evenly planarizing a metal layer formed on the surface of wafer in a semiconductor device manufacturing processor. The pad conditioner may include a substrate constructed of a flat plate of disk shape, a coating part formed with a given thickness on the substrate, and a plurality of protrusion parts formed on the coating part, the plurality of protrusion parts having a plurality of polishing members based on the same size in a predetermined grouping or pattern.

    摘要翻译： 半导体晶片抛光装置的垫调节器及其垫调节器的制造方法为研磨装置的抛光垫设置均匀的调理装置，该抛光装置用于在半导体装置中均匀地平坦化形成在晶片表面上的金属层 制造处理器。 垫调节器可以包括由盘形平板，在基板上形成给定厚度的涂层部分和形成在涂层部分上的多个突起部分构成的基板，所述多个突出部分具有多个抛光 基于相同尺寸的成员以预定的分组或模式。