公开(公告)号：US20130236837A1

公开(公告)日：2013-09-12

申请号：US13852641

申请日：2013-03-28

Applicant: FUJIFILM CORPORATION

Inventor： Soichiro HONDA ,  Tadashi OMATSU ,  Hideaki TSUBAKI

IPC: G03F7/20 ,  G03F7/26

CPC classification number: G03F7/20 ,  G03F7/0392 ,  G03F7/0751 ,  G03F7/0752 ,  G03F7/16 ,  G03F7/26 ,  G11B5/855

Abstract: Collapse of resist patterns in the formation of resist patterns that employ chemically amplified resist material is suppressed. A method for forming a resist pattern includes the steps of: coating a substrate with a chemically amplified resist material; exposing the resist material; and developing the exposed resist material, to form a resist pattern having an aspect ratio AR of 1.5 or greater in a resist film formed by the resist material. A close contact process that improves close contact properties between the substrate and the resist film is controlled such that the thickness of residual film of the resist film is greater than or equal to 1 nm and less than or equal to 1.83·AR+1.73 nm.

Abstract translation: 抑制了使用化学放大抗蚀剂材料的抗蚀剂图案的形成中的抗蚀剂图案的崩溃。 形成抗蚀剂图案的方法包括以下步骤：用化学放大的抗蚀剂材料涂覆基材; 曝光抗蚀材料; 并使曝光的抗蚀剂材料显影，以形成抗蚀剂材料形成的抗蚀剂膜中的纵横比AR为1.5以上的抗蚀剂图案。 控制提高基板和抗蚀剂膜之间的紧密接触性能的紧密接触处理，使得抗蚀剂膜的残留膜的厚度大于或等于1nm且小于或等于1.83A·AR + 1.73nm。

公开(公告)号：US20130032971A1

公开(公告)日：2013-02-07

申请号：US13647849

申请日：2012-10-09

Applicant: FUJIFILM CORPORATION

Inventor： Tadashi OMATSU ,  Satoshi WAKAMATSU

IPC: B29C59/02

CPC classification number: C08F2/46 ,  B82Y10/00 ,  B82Y40/00 ,  C08F2/54 ,  G03F7/0002 ,  H01L21/3086

Abstract: A resist layer constituted by a resist composition (which may include unavoidable impurities) including a polymerizable compound that includes polyfunctional monomers that become polymers having three dimensional structures by cross linking when polymerized and a polymerization initiating agent which is activated by one of light and an electron beam is formed on a substrate. A surface of a mold having a predetermined pattern of protrusions and recesses is pressed against the resist layer. Light is irradiated onto the resist layer to cure the resist layer. The mold is separated from the resist layer under conditions that the temperature of the resist layer is 40° C. or greater.

Abstract translation: 由抗蚀剂组合物（其可包括不可避免的杂质）构成的抗蚀剂层包括可聚合化合物，该可聚合化合物包括当聚合时成为具有交联的三维结构的聚合物的多官能单体和由光和电子之一激活的聚合引发剂 光束形成在基板上。 具有预定图案的突起和凹陷的模具的表面被压靠在抗蚀剂层上。 光照射到抗蚀剂层上以固化抗蚀剂层。 在抗蚀剂层的温度为40℃以上的条件下，将模具与抗蚀剂层分离。

公开(公告)号：US20140285550A1

公开(公告)日：2014-09-25

申请号：US14034339

申请日：2013-09-23

Applicant: FUJIFILM CORPORATION

Inventor： Kenichi KODAMA ,  Kunihiko KODAMA ,  Tadashi OMATSU

IPC: B41J2/045

CPC classification number: B41J2/04501 ,  B05C5/02 ,  B05D1/26 ,  B41J2/04571 ,  B41J2/04581 ,  B41J2/04591 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

Abstract: A nozzle ejects a functional liquid having a viscosity of not less than 5 millipascal·second and not more than 20 millipascal·second, onto a substrate. The functional liquid inside a pressure chamber connected to the nozzle is pressurized. A drive voltage having a pull waveform element which causes the pressure chamber to expand from a steady state and a push waveform element which causes the expanded pressure chamber to contract, is generated with a relationship between a slope γ1 representing voltage change per unit time in the pull waveform element, the viscosity η of the functional liquid, a resonance period Tc of the head, and a slope γ2 representing voltage change per unit time in the push waveform element satisfying (2/Tc)≦γ1≦(η/10) and γ2≦γ1.

Abstract translation: 喷嘴将粘度为5毫帕·秒以上20毫帕·秒以下的功能液喷射到基板上。 连接到喷嘴的压力室内的功能液体被加压。 产生具有使压力室从稳定状态膨胀的拉动波形元件的驱动电压和使膨胀压力室收缩的推压波形元件，表示在表示单位时间内的电压变化的斜率γ1之间的关系 拉波形元件，粘度＆eegr; （2 / Tc）＆nlE;γ1＆nlE;（＆eegr / 10）和γ2＆nlE;γ1的推压波形元件中的每单位时间的电压变化的斜率γ2。

公开(公告)号：US20140210140A1

公开(公告)日：2014-07-31

申请号：US14229410

申请日：2014-03-28

Applicant: FUJIFILM CORPORATION

Inventor： Tadashi OMATSU ,  Kazuharu Nakamura ,  Satoshi Wakamatsu

IPC: C09D133/22 ,  B29C59/02 ,  C09D133/08

CPC classification number: C09D133/22 ,  B29C59/026 ,  B82Y10/00 ,  B82Y40/00 ,  C08F2/48 ,  C08F220/18 ,  C08F220/30 ,  C08F222/1006 ,  C09D133/08 ,  G03F7/0002

Abstract: A nanoimprinting method employs a resist composition including polymerizable compounds and a polymerization initiating agent, each having absorption spectrum properties with absorption regions within a range from 250 nm to 500 nm. The polymerization initiating agent has an absorption region with a longer wavelength end wavelength longer than the longer wavelength end wavelength of the absorption region of the polymerizable compounds. Further, exposure of the resist composition is executed by light having spectral intensity properties that satisfy a predetermined relational formula. The present invention enables contamination of molds by adhered matter to be suppressed, and enables formation of resist patterns having sufficient etching resistance by nanoimprinting.

Abstract translation: 纳米压印方法采用包含可聚合化合物和聚合引发剂的抗蚀剂组合物，其各自具有吸收光谱性质，吸收区域在250nm至500nm的范围内。 聚合引发剂具有比聚合性化合物的吸收区域的长波长结束波长长的波长末端波长的吸收区域。 此外，抗蚀剂组合物的曝光由具有满足预定关系式的光谱强度特性的光进行。 本发明能够抑制由附着物污染模具，能够通过纳米压印形成具有足够耐蚀刻性的抗蚀剂图案。

公开(公告)号：US20130213930A1

公开(公告)日：2013-08-22

申请号：US13848461

申请日：2013-03-21

Applicant: FUJIFILM Corporation

Inventor： Satoshi WAKAMATSU ,  Tadashi OMATSU

IPC: B05D3/12

CPC classification number: B05D3/12 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

Abstract: Droplets of resist material are coated using the ink jet method under conditions that: the viscosity of the resist material is within a range from 8 cP to 20 cP, the surface energy of the resist material is within a range from 25 mN/m to 35 mN/m, the amount of resist material in each of the droplets is within a range from 1 pl to 10 pl, and the placement intervals among the droplets are within a range from 10 μm to 1000 μm. A mold is pressed against the surface of the substrate in a He and/or a depressurized atmosphere such that: an intersection angle formed between a main scanning direction of the ink jet method and the direction of the lines of the linear pattern of protrusions and recesses, which is an intersection angle when pressing the mold against the surface of the substrate, is within a range from 30° to 90°.

Abstract translation: 在抗蚀剂材料的粘度在8cP至20cP的范围内的条件下，使用喷墨法涂覆抗蚀剂材料的液滴，抗蚀剂材料的表面能在25mN / m至35的范围内 mN / m，每个液滴中的抗蚀剂材料的量在1pl至10pl的范围内，并且液滴之间的放置间隔在10μm至1000μm的范围内。 在He和/或减压气氛中将模具压在衬底表面上，使得：在喷墨方法的主扫描方向与突出和凹陷的线状图案的线的方向之间形成的交叉角 是将模具压靠在基板的表面上时的交叉角度，在30°〜90°的范围内。

公开(公告)号：US20200368692A1

公开(公告)日：2020-11-26

申请号：US16991225

申请日：2020-08-12

Applicant: FUJIFILM Corporation

Inventor： Tetsuya SHIMIZU ,  Tetsuya KAMIMURA ,  Tadashi OMATSU ,  Satomi TAKAHASHI

IPC: B01D61/58 ,  B01D65/02 ,  B01D61/18 ,  B01D61/08 ,  B01D69/02 ,  B01D69/12 ,  B01D71/36 ,  B01D71/26 ,  B01D71/56 ,  B01D3/14 ,  H01L21/67

Abstract: A filtering device is for obtaining a chemical liquid by purifying a liquid to be purified, and has an inlet portion, an outlet portion, a filter A, at least one filter B different from the filter A, and a flow path which includes the filter A and the filter B arranged in series between the inlet portion and the outlet portion and extends from the inlet portion to the outlet portion, in which the filter A includes at least one kind of porous membrane selected from the group consisting of a first porous membrane having a porous base material made of polytetrafluoroethylene and a non-crosslinked coating which is formed to cover the porous base material and contains a perfluorosulfonic acid polymer and a second porous membrane containing polytetrafluoroethylene blended with a perfluorosulfonic acid polymer.

公开(公告)号：US20140199472A1

公开(公告)日：2014-07-17

申请号：US14213939

申请日：2014-03-14

Applicant: FUJIFILM CORPORATION

Inventor： Kenichi KODAMA ,  Tadashi OMATSU

IPC: B41J2/12 ,  G01B15/02

CPC classification number: B41J2/12 ,  B82Y10/00 ,  B82Y40/00 ,  G01B15/02 ,  G03F7/0002

Abstract: An aspect of the present invention provides an ejection volume correction method for an inkjet head, including: an arranging step of ejecting functional ink as ink droplets from nozzles of an inkjet head so as to discretely arrange the ink droplets on a front surface of a substrate; a contacting step of filling the functional ink in between a mold and the substrate by causing the mold to contact the ink droplets arranged on the front surface of the substrate; a curing step of curing the filled functional ink so as to generate a functional film ; a separating step of separating the mold from the functional film; a measuring step of measuring a thickness of the functional film; and a correcting step of correcting an ejection volume from the nozzles based on the measured thickness.

Abstract translation: 本发明的一个方面提供了一种用于喷墨头的喷射量校正方法，包括：将作为墨滴从功能性墨水喷射到喷墨头的喷嘴的排列步骤，以将墨滴离散地布置在基板的前表面上 ; 接触步骤，通过使模具与布置在基板的前表面上的墨滴接触来将功能墨水填充在模具和基板之间; 固化步骤，使填充的功能性油墨固化以产生功能膜; 将模具与功能膜分离的分离步骤; 测量功能膜的厚度的测量步骤; 以及基于测量的厚度校正喷嘴的喷射量的校正步骤。

公开(公告)号：US20130113863A1

公开(公告)日：2013-05-09

申请号：US13730578

申请日：2012-12-28

Applicant: FUJIFILM CORPORATION

Inventor： Kenichi KODAMA ,  Tadashi OMATSU ,  Satoshi WAKAMATSU ,  Kunihiko KODAMA

IPC: B41J2/14

CPC classification number: B41J2/14209 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

Abstract: A liquid application device includes: a liquid discharge head having a structure in which nozzles for performing droplet ejection of a functional liquid onto a substrate are aligned in a row in a predetermined direction, and including liquid chambers connected to the nozzles respectively and piezoelectric elements which are provided correspondingly to the liquid chambers and serve to pressurize the liquid in the liquid chambers; a relative movement unit for causing relative movement between the substrate and the liquid discharge head; and a droplet ejection control unit for operating the piezoelectric elements so as to cause the liquid to land discretely on the substrate, and controlling operation of the piezoelectric elements according to each of groups formed by grouping the nozzles correspondingly to the structure of the liquid discharge head.

Abstract translation: 液体施加装置包括：液体排出头，其具有这样的结构，其中用于将功能液体的液滴喷射到基板上的喷嘴在预定方向上排成一行，并且包括分别连接到喷嘴的液体室和压电元件， 相应于液体室设置并用于对液体室中的液体加压; 相对移动单元，用于引起所述基板和所述液体排出头之间的相对移动; 以及液滴喷射控制单元，用于操作压电元件以使液体离散地落在基板上，并且根据与喷液头的结构对应地分组喷嘴形成的每个组，控制压电元件的操作 。