公开(公告)号：US20070010065A1

公开(公告)日：2007-01-11

申请号：US11352279

申请日：2006-02-13

Applicant: Rabindra Das ,  John Lauffer ,  How Lin ,  Voya Markovich

Inventor： Rabindra Das ,  John Lauffer ,  How Lin ,  Voya Markovich

IPC: H01L21/20 ,  H01L21/44

CPC classification number: H05K1/162 ,  H05K1/113 ,  H05K3/0023 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2203/013 ,  H05K2203/0568

Abstract: A method of forming a capacitive substrate in which at least one capacitive dielectric layer of material is screen or ink jet printed onto a conductor and the substrate is thereafter processed further, including the addition of thru-holes to couple selected elements within the substrate to form at least two capacitors as internal elements of the substrate. The capacitive substrate may be incorporated within a larger circuitized substrate, e.g., to form an electrical assembly. A method of making an information handling system including such substrates is also provided.

Abstract translation: 一种形成电容衬底的方法，其中材料的至少一个电容介电层被屏幕或喷墨印刷到导体上，然后进一步处理衬底，包括添加通孔以将所选择的元件耦合到衬底内以形成 至少两个电容器作为衬底的内部元件。 电容性衬底可以结合在更大的电路化衬底内，例如以形成电组件。 还提供了一种制造包括这种基板的信息处理系统的方法。

公开(公告)号：US20050289019A1

公开(公告)日：2005-12-29

申请号：US10860067

申请日：2004-06-04

Applicant: Benson Chan ,  How Lin ,  William Maines ,  Voya Markovich

Inventor： Benson Chan ,  How Lin ,  William Maines ,  Voya Markovich

IPC: B65G61/00 ,  G06K17/00 ,  G06Q10/00 ,  G06Q99/00

CPC classification number: G06K17/00 ,  G06Q10/08 ,  G06Q10/087

Abstract: A method and system for tracking goods, etc., food products, which involves identifying the received goods at a specified location and thereafter assigning an encoded readable code to each of the goods which can be only accessed by authorized personnel responsible for handling the goods on through to and including shipment, e.g., to customers. A host computer includes a database for encoding received identification data and thereafter encoding same to provide the readable codes. The method and system also allows the customer/recipient to access the codes to discern whether he/she has received the correct goods he purchased.

Abstract translation: 一种用于跟踪货物等的食品的方法和系统，其涉及在指定位置识别所接收的货物，然后将编码的可读代码分配给每个商品，所述商品只能由负责处理商品的授权人员访问 通过和包括装运，例如，给客户。 主计算机包括用于对接收到的标识数据进行编码的数据库，然后对其进行编码以提供可读代码。 该方法和系统还允许客户/接收者访问代码以辨别他/她是否已经收到他购买的正确商品。

公开(公告)号：US20050025434A1

公开(公告)日：2005-02-03

申请号：US10631933

申请日：2003-07-31

Applicant: Alan Benner ,  Evan Colgan ,  How Lin ,  John Magerlein ,  Frank Pompeo ,  Subhash Shinde ,  Daniel Stigliani

Inventor： Alan Benner ,  Evan Colgan ,  How Lin ,  John Magerlein ,  Frank Pompeo ,  Subhash Shinde ,  Daniel Stigliani

IPC: G02B6/36 ,  G02B6/42 ,  G06F1/20 ,  G06F3/00

CPC classification number: G02B6/4201 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4268 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292

Abstract: An optoelectronic assembly for a computer system includes an electronic chip(s), a substrate, an electrical signaling medium, an optoelectronic transducer, and an optical coupling guide. The electronic chip(s) is in communication with the substrate, which is in communication with a first end of the electrical signaling medium. A second end of the electrical signaling medium is in communication with the optoelectronic transducer, and includes the optical coupling guide for aligning an optical signaling medium with the optoelectronic transducer. An electrical signal from the electronic chip is communicated to the optoelectronic transducer via the substrate and the electrical signaling medium. The optical transducer and electronic chip(s) share a common heat spreader, and communication to other groups of electronic chip(s) is done without the need for communication via a second level electrical package.

Abstract translation: 用于计算机系统的光电组件包括电子芯片，基板，电信号介质，光电转换器和光耦合引导件。 电子芯片与基板通信，该基板与电信号介质的第一端连通。 电信令介质的第二端与光电换能器通信，并且包括用于使光信号介质与光电换能器对准的光耦合引导件。 来自电子芯片的电信号通过衬底和电信令介质传送到光电换能器。 光学传感器和电子芯片共享共同的散热器，并且完成与其他电子芯片组的通信，而不需要通过第二级电气封装进行通信。

公开(公告)号：US20070249089A1

公开(公告)日：2007-10-25

申请号：US11808596

申请日：2007-06-12

Applicant: Subahu Desai ,  How Lin ,  John Lauffer ,  Voya Markovich ,  David Thomas

Inventor： Subahu Desai ,  How Lin ,  John Lauffer ,  Voya Markovich ,  David Thomas

IPC: H01L51/40

CPC classification number: G11C11/22 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H05K1/16 ,  H05K2201/0166 ,  H05K2201/0179 ,  H05K2201/09763 ,  H05K2201/10159 ,  H01L2224/0401

Abstract: A method of making circuitized substrate comprised of at least one dielectric material having an electrically conductive pattern thereon. At least part of the pattern is used as the first layer of an organic memory device which further includes at least a second dielectric layer over the pattern and a second pattern aligned with respect to the lower part for achieving several points of contact to thus form the device.

Abstract translation: 一种制造电路化衬底的方法，所述电路化衬底由其上具有导电图案的至少一种电介质材料组成。 图案的至少一部分被用作有机存储器件的第一层，该有机存储器件还包括在图案上方的至少第二介电层和相对于下部对准的第二图案，用于实现几个接触点，从而形成 设备。

公开(公告)号：US20070031084A1

公开(公告)日：2007-02-08

申请号：US11425392

申请日：2006-06-20

Applicant: David Wang ,  John Tsai ,  How Lin ,  Le-Heng Wang

Inventor： David Wang ,  John Tsai ,  How Lin ,  Le-Heng Wang

IPC: H04B10/08 ,  G02B6/34

CPC classification number: G01B11/18 ,  E01F11/00 ,  G01L1/246 ,  G02B6/022 ,  G08G1/02

Abstract: A system for monitoring traffic across a structure. A fiber Bragg grating (FBG) reflects a light wavelength. A mounting mechanism connects the FBG to the structure, such that physical change of the structure changes a stress to the FBG that changes the light wavelength. And optical fiber carries a first light beam to the FBG and carries a second light beam from the FGB. This permits first light beam including the light wavelength to be received from a light source, and permits the first light beam to be altered into the second light beam by passing the light wavelength through the FBG, and permits the second light beam to be provided to a detector to sense the light wavelength present in the second light beam. From this the stress in the structure and information about the traffic across a structure can be inferred.

Abstract translation: 用于监控跨结构的流量的系统。 光纤布拉格光栅（FBG）反射光波长。 安装机构将FBG连接到结构，使得结构的物理变化将改变光束波长的FBG的应力。 并且光纤将第一光束传送到FBG并携带来自FGB的第二光束。 这允许包括光波长的第一光束从光源接收，并且允许通过使光波长通过FBG将第一光束改变为第二光束，并且允许第二光束被提供到 用于感测存在于第二光束中的光波长的检测器。 从此可以推断结构中的压力和关于结构上的交通的信息。

公开(公告)号：US20070010064A1

公开(公告)日：2007-01-11

申请号：US11352276

申请日：2006-02-13

Applicant: Rabindra Das ,  John Lauffer ,  How Lin ,  Voya Markovich

Inventor： Rabindra Das ,  John Lauffer ,  How Lin ,  Voya Markovich

IPC: H01L21/20 ,  H01L21/44

CPC classification number: H05K1/162 ,  H05K1/113 ,  H05K3/0023 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2203/0568

Abstract: A method of forming a capacitive substrate in which at least one capacitive dielectric layer of material is screen or ink jet printed onto a conductor and the substrate is thereafter processed further, including the addition of thru-holes to couple selected elements within the substrate to form at least two capacitors as internal elements of the substrate. Photoimageable material is used to facilitate positioning of the capacitive dielectric being printed. The capacitive substrate may be incorporated within a larger circuitized substrate, e.g., to form an electrical assembly. A method of making an information handling system including such substrates is also provided.

Abstract translation: 一种形成电容衬底的方法，其中材料的至少一个电容介电层被屏幕或喷墨印刷到导体上，然后进一步处理衬底，包括添加通孔以将所选择的元件耦合到衬底内以形成 至少两个电容器作为衬底的内部元件。 可光成像材料用于促进正在印刷的电容电介质的定位。 电容性衬底可以结合在更大的电路化衬底内，例如以形成电组件。 还提供了一种制造包括这种基板的信息处理系统的方法。

公开(公告)号：US20050156310A1

公开(公告)日：2005-07-21

申请号：US10757206

申请日：2004-01-14

Applicant: Alan Benner ,  How Lin ,  Frank Pompeo ,  Subhash Shinde

Inventor： Alan Benner ,  How Lin ,  Frank Pompeo ,  Subhash Shinde

IPC: H01L31/0232

CPC classification number: G02B6/4249 ,  G02B6/4212 ,  G02B6/4214 ,  G02B6/4231 ,  G02B6/4246 ,  G02B6/4269 ,  G02B6/4292 ,  H01L2224/16225 ,  H01L2224/73253

Abstract: An optoelectronic assembly for an electronic system includes a transparent substrate having a first surface and an opposite second surface, the transparent substrate being thermally conductive and being metallized on the surface. A support electronic chip set is configured for at least one of providing multiplexing, demultiplexing, coding, decoding and optoelectronic transducer driving and receive functions and is bonded to the second surface of the transparent substrate. A first substrate having a first surface and an opposite second surface, is in communication with the transparent substrate via the metallized second surface and support chip set therebetween. A second substrate is in communication with the second surface of the first substrate and is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support electronic chip set; and an optical signaling medium defined with one end having an optical fiber array aligned with the optoelectronic transducer is substantially normal to the first surface of the transparent substrate, wherein an electrical signal from the support electronic chip set is communicated to the optoelectronic transducer via the metallized second surface of the transparent substrate, and wherein the support electronic chip set and the optoelectronic transducer share a common thermal path for cooling.

Abstract translation: 一种用于电子系统的光电组件包括具有第一表面和相对的第二表面的透明衬底，该透明衬底是导热的并且在表面上被金属化。 支持电子芯片组被配置用于提供多路复用，解复用，编码，解码和光电转换器驱动和接收功能中的至少一个并且被结合到透明基板的第二表面。 具有第一表面和相对的第二表面的第一基板经由金属化的第二表面和其间的支撑芯片与透明基板连通。 第二基板与第一基板的第二表面连通并且被配置用于安装数据处理，数据切换和数据存储芯片中的至少一个。 光电子传感器与支持电子芯片组进行信号通信; 并且限定有具有与光电换能器对准的光纤阵列的一端的光信号介质基本上垂直于透明基板的第一表面，其中来自支撑电子芯片组的电信号通过金属化的 所述透明基板的第二表面，并且其中所述支撑电子芯片组和所述光电转换器共享用于冷却的公共热路径。

公开(公告)号：US07552091B2

公开(公告)日：2009-06-23

申请号：US10860067

申请日：2004-06-04

Applicant: Benson Chan ,  How Lin ,  William Maines ,  Voya Markovich

Inventor： Benson Chan ,  How Lin ,  William Maines ,  Voya Markovich

IPC: G06Q99/00

CPC classification number: G06K17/00 ,  G06Q10/08 ,  G06Q10/087

Abstract: A method and system for tracking goods, etc., food products, which involves identifying the received goods at a specified location and thereafter assigning an encoded readable code to each of the goods which can be only accessed by authorized personnel responsible for handling the goods on through to and including shipment, e.g., to customers. A host computer includes a database for encoding received identification data and thereafter encoding same to provide the readable codes. The method and system also allows the customer/recipient to access the codes to discern whether he/she has received the correct goods he purchased.

Abstract translation: 一种用于跟踪货物等的食品的方法和系统，其涉及在指定位置识别所接收的货物，然后将编码的可读代码分配给每个商品，所述商品只能由负责处理商品的授权人员访问 通过和包括装运，例如，给客户。 主计算机包括用于对接收到的标识数据进行编码的数据库，然后对其进行编码以提供可读代码。 该方法和系统还允许客户/接收者访问代码以辨别他/她是否已经收到他购买的正确商品。

公开(公告)号：US20060182397A1

公开(公告)日：2006-08-17

申请号：US11279276

申请日：2006-04-11

Applicant: Alan Benner ,  How Lin ,  Frank Pompeo ,  Subhash Shinde

Inventor： Alan Benner ,  How Lin ,  Frank Pompeo ,  Subhash Shinde

IPC: G02B6/36

CPC classification number: G02B6/4249 ,  G02B6/4212 ,  G02B6/4214 ,  G02B6/4231 ,  G02B6/4246 ,  G02B6/4269 ,  G02B6/4292 ,  H01L2224/16225 ,  H01L2224/73253

Abstract: An optoelectronic assembly for an electronic system includes a thermally conductive, metallized transparent substrate having a first surface and an opposite second surface. A support chip set is bonded to the second surface of the transparent substrate. A first substrate is in communication with the transparent substrate via the metallized second surface and support chip set therebetween. A second substrate is in communication with the second surface of the first substrate and is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support chip set, and an optical signaling medium having one end with an optical fiber array aligned with the transducer is substantially normal to the first surface of the transparent substrate. The support chip set and the transducer share a common thermal path for cooling.

Abstract translation: 用于电子系统的光电组件包括具有第一表面和相对的第二表面的导热金属化透明基板。 支撑芯片组结合到透明基板的第二表面。 第一衬底经由金属化的第二表面和其间的支撑芯片与透明衬底连通。 第二基板与第一基板的第二表面连通并且被配置用于安装数据处理，数据切换和数据存储芯片中的至少一个。 光电子传感器与支持芯片组进行信号通信，并且具有与换能器对准的光纤阵列的一端的光信号介质基本上垂直于透明基板的第一表面。 支撑芯片组和传感器共享一个共同的冷却路径。

公开(公告)号：US20050270160A1

公开(公告)日：2005-12-08

申请号：US10860071

申请日：2004-06-04

Applicant: Benson Chan ,  William Kimler ,  How Lin ,  William Maines ,  Voya Markovich

Inventor： Benson Chan ,  William Kimler ,  How Lin ,  William Maines ,  Voya Markovich

IPC: G06K17/00 ,  G06K19/077 ,  G06Q10/00 ,  G08B1/08

CPC classification number: G06K19/07749 ,  G06K2017/0045 ,  G06Q10/087

Abstract: A radio frequency (RF) device (or “tag”) for containing specific information relating to a particular good being shipped from one location (e.g., warehouse) to another (e.g., customer). The device includes a circuitized substrate (e.g., a printed circuit board), a semiconductor chip, an antenna and a power regulator, and is designed in one embodiment to be partly inserted within a good (e.g., a cardboard box) containing one or more of the goods being shipped and tracked. Alternatively, the device may be attached by other means (e.g., adhesive). A shipper can simply track the goods containing such devices using wireless communication devices (e.g., satellites) to quickly and readily ascertain the specific location of the goods at any time as well as the appropriate desired information relating to such goods (e.g., quantity, weight, type, etc.).

Abstract translation: 用于包含与从一个位置（例如，仓库）运送到另一个位置（例如客户）的特定商品相关的特定信息的射频（RF）设备（或“标签”）。 该装置包括电路化基板（例如，印刷电路板），半导体芯片，天线和功率调节器，并且在一个实施例中设计成部分地插入到包含一个或多个 的货物被运输和跟踪。 或者，该装置可以通过其他方式（例如，粘合剂）附接。 托运人可以使用无线通信设备（例如，卫星）轻松跟踪含有此类设备的货物，以便随时快速确定货物的具体位置以及与此类货物相关的适当的所需信息（例如数量，重量 ，类型等）。