公开(公告)号：US20080028259A1

公开(公告)日：2008-01-31

申请号：US11867785

申请日：2007-10-05

Applicant: Tzu-How Lin ,  Sung-Yen Chang

Inventor： Tzu-How Lin ,  Sung-Yen Chang

IPC: G06F11/20

CPC classification number: G06F11/1458 ,  Y10S707/99953 ,  Y10S707/99955

Abstract: Provided are a system and method for using a plurality of virtual backup service paths to dynamically switch between storage devices based on a plurality of scenarios. In one example multiple backup service groups are defined. Multiple scenarios that each reference at least one virtual backup service path are also defined. Each virtual backup service path may be defined by at least one network address identifying a storage device. One of the scenarios is selected based on a service level of one or more storage devices, and the virtual backup service path identified by the selected scenario is chosen as a backup destination for at least one of the service groups.

Abstract translation: 提供了一种基于多个场景使用多个虚拟备份服务路径来动态地在存储设备之间切换的系统和方法。 在一个示例中，定义了多个备份服务组。 每个引用至少一个虚拟备份服务路径的多个场景也被定义。 每个虚拟备份服务路径可以由标识存储设备的至少一个网络地址来定义。 基于一个或多个存储设备的服务级别选择其中一个场景，并且选择由所选场景识别的虚拟备份服务路径作为至少一个服务组的备份目的地。

公开(公告)号：US20070139977A1

公开(公告)日：2007-06-21

申请号：US11305073

申请日：2005-12-19

Applicant: Subahu Desai ,  John Lauffer ,  How Lin ,  Voya Markovich ,  Ronald Smith

Inventor： Subahu Desai ,  John Lauffer ,  How Lin ,  Voya Markovich ,  Ronald Smith

IPC: H02M3/315

CPC classification number: H05K3/4069 ,  H05K1/0293 ,  H05K3/105 ,  H05K2201/096 ,  H05K2203/105

Abstract: A method of improving conductive paste connections in a circuitized substrate in which at least one and preferably a series of high voltage pulses are applied across the paste and at least one and preferably a series of high current pulses are applied, both series of pulses applied separately. The result is an increase in the number of conductive paths through the paste connections from those present prior to the pulse applications and a corresponding resistance reduction in said connections.

Abstract translation: 一种改进电路化基板中的导电糊料连接的方法，其中施加至少一个并且优选一系列高压脉冲施加在该糊料上并且至少一个并且优选地一系列高电流脉冲，两个脉冲串分别施加 。 结果是通过粘合连接的导电路径的数量从在脉冲应用之前存在的导电路径的数量增加以及所述连接中相应的电阻减小。

公开(公告)号：US07142121B2

公开(公告)日：2006-11-28

申请号：US10860071

申请日：2004-06-04

Applicant: Benson Chan ,  William Kimler ,  How Lin ,  William Maines ,  Voya Markovich

Inventor： Benson Chan ,  William Kimler ,  How Lin ,  William Maines ,  Voya Markovich

IPC: G08B13/14

CPC classification number: G06K19/07749 ,  G06K2017/0045 ,  G06Q10/087

Abstract: A radio frequency (RF) device (or “tag”) for containing specific information relating to a particular good being shipped from one location (e.g., warehouse) to another (e.g., customer). The device includes a circuitized substrate (e.g., a printed circuit board), a semiconductor chip, an antenna and a power regulator, and is designed in one embodiment to be partly inserted within a good (e.g., a cardboard box) containing one or more of the goods being shipped and tracked. Alternatively, the device may be attached by other means (e.g., adhesive). A shipper can simply track the goods containing such devices using wireless communication devices (e.g., satellites) to quickly and readily ascertain the specific location of the goods at any time as well as the appropriate desired information relating to such goods (e.g., quantity, weight, type, etc.).

Abstract translation: 用于包含与从一个位置（例如，仓库）运送到另一个位置（例如客户）的特定商品相关的特定信息的射频（RF）设备（或“标签”）。 该装置包括电路化基板（例如，印刷电路板），半导体芯片，天线和功率调节器，并且在一个实施例中设计成部分地插入到包含一个或多个 的货物被运输和跟踪。 或者，该装置可以通过其他方式（例如，粘合剂）附接。 托运人可以使用无线通信设备（例如，卫星）轻松跟踪含有此类设备的货物，以便随时快速确定货物的具体位置以及与此类货物相关的适当的所需信息（例如数量，重量 ，类型等）。

公开(公告)号：US20060213973A1

公开(公告)日：2006-09-28

申请号：US11086324

申请日：2005-03-23

Applicant: Benson Chan ,  How Lin ,  Voya Markovich ,  Ronald Smith

Inventor： Benson Chan ,  How Lin ,  Voya Markovich ,  Ronald Smith

IPC: G06K5/00 ,  G06K19/06

CPC classification number: G06K19/005 ,  G06K7/084 ,  G06K17/00 ,  G06K19/07354 ,  G06K2017/0064

Abstract: An electronic card assembly is provided which includes a protective housing having a movable card therein. The card, in one example one having a magnetic stripe, has its information erased when being inserted into the housing and re-written back onto its information portion (magnetic stripe) during card withdrawal, provided appropriate human information (e.g., from a fingerprint) is received by the assembly's reader component.

Abstract translation: 提供了一种电子卡组件，其包括其中具有可移动卡的保护壳体。 在一个示例中具有磁条的卡在卡插入时被插入到壳体中被擦除并且在卡退出期间被重新写回到其信息部分（磁条）上，提供适当的人类信息（例如，从指纹） 被大会的阅读器组件接收。

公开(公告)号：US20050152650A1

公开(公告)日：2005-07-14

申请号：US10756782

申请日：2004-01-13

Applicant: John Knickerbocker ,  How Lin

Inventor： John Knickerbocker ,  How Lin

IPC: G02B6/36 ,  G02B6/38

CPC classification number: G02B6/3672 ,  G02B6/3644 ,  G02B6/3692 ,  G02B6/3696 ,  G02B6/3885

Abstract: A method is provided for making ferrules for connecting optical fibers to other optical fibers or to an optical input device such as an optical chip. The method utilizes ceramic greensheets or silicon wafers. In one method, the greensheets are stacked and laminated and then fiber optic through openings are provided in the laminate for holding the fibers. The laminate is then sintered forming the ferrule.

Abstract translation: 提供了一种用于制造用于将光纤连接到其它光纤或光输入装置（例如光学芯片）的套圈的方法。 该方法采用陶瓷片或硅片。 在一种方法中，将绿色纸堆叠并层压，然后在用于保持纤维的层压体中设置光纤通孔。 然后将层压体烧结形成套圈。

公开(公告)号：US08198739B2

公开(公告)日：2012-06-12

申请号：US12836612

申请日：2010-08-13

Applicant: How Lin ,  Frank Egitto ,  Voya Markovich

Inventor： How Lin ,  Frank Egitto ,  Voya Markovich

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H01L23/3157 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/72 ,  H01L2224/0226 ,  H01L2224/02335 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73251 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81901 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/16 ,  H01L2224/72

Abstract: A method of forming a compressible contact structure on a semi-conductor chip which comprises bonding a compressible polymer layer to the chip's surface, forming a plurality of openings within the layer, depositing electrically conductive material within the openings to form electrical connections with the chip's contacts, forming a plurality of electrically conductive line elements on the polymer layer extending from a respective opening and each including an end portion, and forming a plurality of contact members each on a respective one of the line segment end portions. The compressible polymer layer allows the contact members to deflect toward (compress) the chip when the contact members are engaged by an external force or forces. A semi-conductor chip including such a compressible contact structure is also provided.

Abstract translation: 一种在半导体芯片上形成可压缩接触结构的方法，包括将可压缩的聚合物层粘合到芯片的表面，在该层内形成多个开口，在开口内沉积导电材料以形成与芯片的触点的电连接 在聚合物层上形成多个导电线元件，所述多个导电线元件从相应的开口延伸并且各自包括端部，并且在所述线段端部中的相应一个上形成多个接触元件。 当可接触构件通过外力或力接合时，可压缩聚合物层允许接触构件偏转（压缩）芯片。 还提供了包括这种可压缩接触结构的半导体芯片。

公开(公告)号：US07299326B2

公开(公告)日：2007-11-20

申请号：US10864776

申请日：2004-06-09

Applicant: Tzu-How Lin ,  Sung-Yen Chang

Inventor： Tzu-How Lin ,  Sung-Yen Chang

IPC: G06F12/00

CPC classification number: G06F11/1458 ,  Y10S707/99953 ,  Y10S707/99955

Abstract: Provided are a system and method for using a plurality of virtual backup service paths to dynamically switch between storage devices based on a plurality of scenarios. In one example multiple backup service groups are defined. Multiple scenarios that each reference at least one virtual backup service path are also defined. Each virtual backup service path may be defined by at least one network address identifying a storage device. One of the scenarios is selected based on a service level of one or more storage devices, and the virtual backup service path identified by the selected scenario is chosen as a backup destination for at least one of the service groups.

Abstract translation: 提供了一种基于多个场景使用多个虚拟备份服务路径来动态地在存储设备之间切换的系统和方法。 在一个示例中，定义了多个备份服务组。 每个引用至少一个虚拟备份服务路径的多个场景也被定义。 每个虚拟备份服务路径可以由标识存储设备的至少一个网络地址来定义。 基于一个或多个存储设备的服务级别选择其中一个场景，并且选择由所选场景识别的虚拟备份服务路径作为至少一个服务组的备份目的地。

公开(公告)号：US20070010065A1

公开(公告)日：2007-01-11

申请号：US11352279

申请日：2006-02-13

Applicant: Rabindra Das ,  John Lauffer ,  How Lin ,  Voya Markovich

Inventor： Rabindra Das ,  John Lauffer ,  How Lin ,  Voya Markovich

IPC: H01L21/20 ,  H01L21/44

CPC classification number: H05K1/162 ,  H05K1/113 ,  H05K3/0023 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2203/013 ,  H05K2203/0568

Abstract: A method of forming a capacitive substrate in which at least one capacitive dielectric layer of material is screen or ink jet printed onto a conductor and the substrate is thereafter processed further, including the addition of thru-holes to couple selected elements within the substrate to form at least two capacitors as internal elements of the substrate. The capacitive substrate may be incorporated within a larger circuitized substrate, e.g., to form an electrical assembly. A method of making an information handling system including such substrates is also provided.

Abstract translation: 一种形成电容衬底的方法，其中材料的至少一个电容介电层被屏幕或喷墨印刷到导体上，然后进一步处理衬底，包括添加通孔以将所选择的元件耦合到衬底内以形成 至少两个电容器作为衬底的内部元件。 电容性衬底可以结合在更大的电路化衬底内，例如以形成电组件。 还提供了一种制造包括这种基板的信息处理系统的方法。

公开(公告)号：US20050289019A1

公开(公告)日：2005-12-29

申请号：US10860067

申请日：2004-06-04

Applicant: Benson Chan ,  How Lin ,  William Maines ,  Voya Markovich

Inventor： Benson Chan ,  How Lin ,  William Maines ,  Voya Markovich

IPC: B65G61/00 ,  G06K17/00 ,  G06Q10/00 ,  G06Q99/00

CPC classification number: G06K17/00 ,  G06Q10/08 ,  G06Q10/087

Abstract: A method and system for tracking goods, etc., food products, which involves identifying the received goods at a specified location and thereafter assigning an encoded readable code to each of the goods which can be only accessed by authorized personnel responsible for handling the goods on through to and including shipment, e.g., to customers. A host computer includes a database for encoding received identification data and thereafter encoding same to provide the readable codes. The method and system also allows the customer/recipient to access the codes to discern whether he/she has received the correct goods he purchased.

Abstract translation: 一种用于跟踪货物等的食品的方法和系统，其涉及在指定位置识别所接收的货物，然后将编码的可读代码分配给每个商品，所述商品只能由负责处理商品的授权人员访问 通过和包括装运，例如，给客户。 主计算机包括用于对接收到的标识数据进行编码的数据库，然后对其进行编码以提供可读代码。 该方法和系统还允许客户/接收者访问代码以辨别他/她是否已经收到他购买的正确商品。

公开(公告)号：US20050025434A1

公开(公告)日：2005-02-03

申请号：US10631933

申请日：2003-07-31

Applicant: Alan Benner ,  Evan Colgan ,  How Lin ,  John Magerlein ,  Frank Pompeo ,  Subhash Shinde ,  Daniel Stigliani

Inventor： Alan Benner ,  Evan Colgan ,  How Lin ,  John Magerlein ,  Frank Pompeo ,  Subhash Shinde ,  Daniel Stigliani

IPC: G02B6/36 ,  G02B6/42 ,  G06F1/20 ,  G06F3/00

CPC classification number: G02B6/4201 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4268 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292

Abstract: An optoelectronic assembly for a computer system includes an electronic chip(s), a substrate, an electrical signaling medium, an optoelectronic transducer, and an optical coupling guide. The electronic chip(s) is in communication with the substrate, which is in communication with a first end of the electrical signaling medium. A second end of the electrical signaling medium is in communication with the optoelectronic transducer, and includes the optical coupling guide for aligning an optical signaling medium with the optoelectronic transducer. An electrical signal from the electronic chip is communicated to the optoelectronic transducer via the substrate and the electrical signaling medium. The optical transducer and electronic chip(s) share a common heat spreader, and communication to other groups of electronic chip(s) is done without the need for communication via a second level electrical package.

Abstract translation: 用于计算机系统的光电组件包括电子芯片，基板，电信号介质，光电转换器和光耦合引导件。 电子芯片与基板通信，该基板与电信号介质的第一端连通。 电信令介质的第二端与光电换能器通信，并且包括用于使光信号介质与光电换能器对准的光耦合引导件。 来自电子芯片的电信号通过衬底和电信令介质传送到光电换能器。 光学传感器和电子芯片共享共同的散热器，并且完成与其他电子芯片组的通信，而不需要通过第二级电气封装进行通信。