公开(公告)号：US20050156310A1

公开(公告)日：2005-07-21

申请号：US10757206

申请日：2004-01-14

申请人： Alan Benner ,  How Lin ,  Frank Pompeo ,  Subhash Shinde

发明人： Alan Benner ,  How Lin ,  Frank Pompeo ,  Subhash Shinde

IPC分类号： H01L31/0232

CPC分类号： G02B6/4249 ,  G02B6/4212 ,  G02B6/4214 ,  G02B6/4231 ,  G02B6/4246 ,  G02B6/4269 ,  G02B6/4292 ,  H01L2224/16225 ,  H01L2224/73253

摘要： An optoelectronic assembly for an electronic system includes a transparent substrate having a first surface and an opposite second surface, the transparent substrate being thermally conductive and being metallized on the surface. A support electronic chip set is configured for at least one of providing multiplexing, demultiplexing, coding, decoding and optoelectronic transducer driving and receive functions and is bonded to the second surface of the transparent substrate. A first substrate having a first surface and an opposite second surface, is in communication with the transparent substrate via the metallized second surface and support chip set therebetween. A second substrate is in communication with the second surface of the first substrate and is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support electronic chip set; and an optical signaling medium defined with one end having an optical fiber array aligned with the optoelectronic transducer is substantially normal to the first surface of the transparent substrate, wherein an electrical signal from the support electronic chip set is communicated to the optoelectronic transducer via the metallized second surface of the transparent substrate, and wherein the support electronic chip set and the optoelectronic transducer share a common thermal path for cooling.

摘要翻译： 一种用于电子系统的光电组件包括具有第一表面和相对的第二表面的透明衬底，该透明衬底是导热的并且在表面上被金属化。 支持电子芯片组被配置用于提供多路复用，解复用，编码，解码和光电转换器驱动和接收功能中的至少一个并且被结合到透明基板的第二表面。 具有第一表面和相对的第二表面的第一基板经由金属化的第二表面和其间的支撑芯片与透明基板连通。 第二基板与第一基板的第二表面连通并且被配置用于安装数据处理，数据切换和数据存储芯片中的至少一个。 光电子传感器与支持电子芯片组进行信号通信; 并且限定有具有与光电换能器对准的光纤阵列的一端的光信号介质基本上垂直于透明基板的第一表面，其中来自支撑电子芯片组的电信号通过金属化的 所述透明基板的第二表面，并且其中所述支撑电子芯片组和所述光电转换器共享用于冷却的公共热路径。

公开(公告)号：US20050025434A1

公开(公告)日：2005-02-03

申请号：US10631933

申请日：2003-07-31

申请人： Alan Benner ,  Evan Colgan ,  How Lin ,  John Magerlein ,  Frank Pompeo ,  Subhash Shinde ,  Daniel Stigliani

发明人： Alan Benner ,  Evan Colgan ,  How Lin ,  John Magerlein ,  Frank Pompeo ,  Subhash Shinde ,  Daniel Stigliani

IPC分类号： G02B6/36 ,  G02B6/42 ,  G06F1/20 ,  G06F3/00

CPC分类号： G02B6/4201 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4268 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292

摘要： An optoelectronic assembly for a computer system includes an electronic chip(s), a substrate, an electrical signaling medium, an optoelectronic transducer, and an optical coupling guide. The electronic chip(s) is in communication with the substrate, which is in communication with a first end of the electrical signaling medium. A second end of the electrical signaling medium is in communication with the optoelectronic transducer, and includes the optical coupling guide for aligning an optical signaling medium with the optoelectronic transducer. An electrical signal from the electronic chip is communicated to the optoelectronic transducer via the substrate and the electrical signaling medium. The optical transducer and electronic chip(s) share a common heat spreader, and communication to other groups of electronic chip(s) is done without the need for communication via a second level electrical package.

摘要翻译： 用于计算机系统的光电组件包括电子芯片，基板，电信号介质，光电转换器和光耦合引导件。 电子芯片与基板通信，该基板与电信号介质的第一端连通。 电信令介质的第二端与光电换能器通信，并且包括用于使光信号介质与光电换能器对准的光耦合引导件。 来自电子芯片的电信号通过衬底和电信令介质传送到光电换能器。 光学传感器和电子芯片共享共同的散热器，并且完成与其他电子芯片组的通信，而不需要通过第二级电气封装进行通信。

公开(公告)号：US20060182397A1

公开(公告)日：2006-08-17

申请号：US11279276

申请日：2006-04-11

申请人： Alan Benner ,  How Lin ,  Frank Pompeo ,  Subhash Shinde

发明人： Alan Benner ,  How Lin ,  Frank Pompeo ,  Subhash Shinde

IPC分类号： G02B6/36

CPC分类号： G02B6/4249 ,  G02B6/4212 ,  G02B6/4214 ,  G02B6/4231 ,  G02B6/4246 ,  G02B6/4269 ,  G02B6/4292 ,  H01L2224/16225 ,  H01L2224/73253

摘要： An optoelectronic assembly for an electronic system includes a thermally conductive, metallized transparent substrate having a first surface and an opposite second surface. A support chip set is bonded to the second surface of the transparent substrate. A first substrate is in communication with the transparent substrate via the metallized second surface and support chip set therebetween. A second substrate is in communication with the second surface of the first substrate and is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support chip set, and an optical signaling medium having one end with an optical fiber array aligned with the transducer is substantially normal to the first surface of the transparent substrate. The support chip set and the transducer share a common thermal path for cooling.

摘要翻译： 用于电子系统的光电组件包括具有第一表面和相对的第二表面的导热金属化透明基板。 支撑芯片组结合到透明基板的第二表面。 第一衬底经由金属化的第二表面和其间的支撑芯片与透明衬底连通。 第二基板与第一基板的第二表面连通并且被配置用于安装数据处理，数据切换和数据存储芯片中的至少一个。 光电子传感器与支持芯片组进行信号通信，并且具有与换能器对准的光纤阵列的一端的光信号介质基本上垂直于透明基板的第一表面。 支撑芯片组和传感器共享一个共同的冷却路径。

公开(公告)号：US20080020566A1

公开(公告)日：2008-01-24

申请号：US11902976

申请日：2007-09-27

申请人： Frank Egitto ,  How Lin

发明人： Frank Egitto ,  How Lin

IPC分类号： H01L21/44

CPC分类号： H05K3/4007 ,  G01R1/06711 ,  G01R1/0735 ,  H05K1/0393 ,  H05K3/365 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09627 ,  H05K2201/09745 ,  H05K2201/10378

摘要： A method of making an interposer in which at least two dielectric layers are bonded to each other to sandwich a plurality of conductors there-between. The conductors each electrically couple a respective pair of opposed electrical contacts which are formed within and protrude from openings which are also formed within the dielectric layers as part of this method. The resulting interposer is ideally suited for use as part of a test apparatus to interconnect highly dense patterns of solder ball contacts of a semiconductor chip to lesser dense arrays of contacts on the apparatus's printed circuit board.

摘要翻译： 一种制造其中至少两个电介质层彼此结合以夹在其间的多个导体的插入件的方法。 这些导体各自电耦合相应的一对相对的电触点，其形成在也作为该方法的一部分的电介质层内形成的开口内并从其中突出。 所得到的内插器非常适合用作测试装置的一部分，以将半导体芯片的高密度图案的焊球接触件与装置的印刷电路板上的较小致密的触点阵列相互连接。

公开(公告)号：US20060022310A1

公开(公告)日：2006-02-02

申请号：US10900386

申请日：2004-07-28

申请人： Frank Egitto ,  John Lauffer ,  How Lin ,  Voya Markovich ,  David Thomas

发明人： Frank Egitto ,  John Lauffer ,  How Lin ,  Voya Markovich ,  David Thomas

IPC分类号： H01L23/58

CPC分类号： G11C5/06 ,  B82Y10/00 ,  G02B6/43 ,  H01L23/48 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/16 ,  H05K1/181 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/0166 ,  H05K2201/0179 ,  H05K2201/09763 ,  H05K2201/10159 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An electrical assembly which includes a circuitized substrate comprised of an organic dielectric material having a first electrically conductive pattern thereon. At least part of the dielectric layer and pattern form the first, base portion of an organic memory device, the remaining portion being a second, polymer layer formed over the part of the pattern and a second conductive circuit formed on the polymer layer. A second dielectric layer if formed over the second conductive circuit and first circuit pattern to enclose the organic memory device. The device is electrically coupled to a first electrical component through the second dielectric layer and this first electrical component is electrically coupled to a second electrical component. A method of making the electrical assembly is also provided, as is an information handling system adapted for using one or more such electrical assemblies as part thereof.

摘要翻译： 一种电气组件，其包括由其上具有第一导电图案的有机电介质材料构成的电路化衬底。 电介质层和图案的至少一部分形成有机存储器件的第一基底部分，其余部分是形成在图案部分上的第二聚合物层和形成在聚合物层上的第二导电电路。 如果形成在第二导电电路上的第二电介质层和第一电路图案以包围有机存储器件。 该器件通过第二介电层电耦合到第一电气部件，并且该第一电气部件电耦合到第二电气部件。 还提供了制造电气组件的方法，以及适于使用一个或多个这样的电气组件作为其一部分的信息处理系统。

公开(公告)号：US20060022303A1

公开(公告)日：2006-02-02

申请号：US10900385

申请日：2004-07-28

申请人： Subahu Desai ,  How Lin ,  John Lauffer ,  Voya Markovich ,  David Thomas

发明人： Subahu Desai ,  How Lin ,  John Lauffer ,  Voya Markovich ,  David Thomas

IPC分类号： H01L29/00 ,  H01L21/00

CPC分类号： G11C11/22 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H05K1/16 ,  H05K2201/0166 ,  H05K2201/0179 ,  H05K2201/09763 ,  H05K2201/10159 ,  H01L2224/0401

摘要： A circuitized substrate comprised of at least one dielectric material having an electrically conductive pattern thereon. At least part of the pattern is used as the first layer of an organic memory device which further includes at least a second dielectric layer over the pattern and a second pattern aligned with respect to the lower part for achieving several points of contact to thus form the device. The substrate is preferably combined with other dielectric-circuit layered assemblies to form a multilayered substrate on which can be positioned discrete electronic components (e.g., a logic chip) coupled to the internal memory device to work in combination therewith. An electrical assembly capable of using the substrate is also provided, as is an information handling system adapted for using one or more such electrical assemblies as part thereof.

摘要翻译： 一种电路化衬底，由至少一层具有导电图案的电介质材料构成。 图案的至少一部分被用作有机存储器件的第一层，该有机存储器件还包括在图案上方的至少第二介电层和相对于下部对准的第二图案，用于实现几个接触点，从而形成 设备。 衬底优选地与其它介电电路分层组件组合以形成多层衬底，在多层衬底上，可以将耦合到内部存储器件的分立电子部件（例如，逻辑芯片）放置在其上以与之组合工作。 还提供了能够使用基板的电气组件，以及适于使用一个或多个这样的电气组件作为其一部分的信息处理系统。

公开(公告)号：US20070139977A1

公开(公告)日：2007-06-21

申请号：US11305073

申请日：2005-12-19

申请人： Subahu Desai ,  John Lauffer ,  How Lin ,  Voya Markovich ,  Ronald Smith

发明人： Subahu Desai ,  John Lauffer ,  How Lin ,  Voya Markovich ,  Ronald Smith

IPC分类号： H02M3/315

CPC分类号： H05K3/4069 ,  H05K1/0293 ,  H05K3/105 ,  H05K2201/096 ,  H05K2203/105

摘要： A method of improving conductive paste connections in a circuitized substrate in which at least one and preferably a series of high voltage pulses are applied across the paste and at least one and preferably a series of high current pulses are applied, both series of pulses applied separately. The result is an increase in the number of conductive paths through the paste connections from those present prior to the pulse applications and a corresponding resistance reduction in said connections.

摘要翻译： 一种改进电路化基板中的导电糊料连接的方法，其中施加至少一个并且优选一系列高压脉冲施加在该糊料上并且至少一个并且优选地一系列高电流脉冲，两个脉冲串分别施加 。 结果是通过粘合连接的导电路径的数量从在脉冲应用之前存在的导电路径的数量增加以及所述连接中相应的电阻减小。

公开(公告)号：US07142121B2

公开(公告)日：2006-11-28

申请号：US10860071

申请日：2004-06-04

申请人： Benson Chan ,  William Kimler ,  How Lin ,  William Maines ,  Voya Markovich

发明人： Benson Chan ,  William Kimler ,  How Lin ,  William Maines ,  Voya Markovich

IPC分类号： G08B13/14

CPC分类号： G06K19/07749 ,  G06K2017/0045 ,  G06Q10/087

摘要： A radio frequency (RF) device (or “tag”) for containing specific information relating to a particular good being shipped from one location (e.g., warehouse) to another (e.g., customer). The device includes a circuitized substrate (e.g., a printed circuit board), a semiconductor chip, an antenna and a power regulator, and is designed in one embodiment to be partly inserted within a good (e.g., a cardboard box) containing one or more of the goods being shipped and tracked. Alternatively, the device may be attached by other means (e.g., adhesive). A shipper can simply track the goods containing such devices using wireless communication devices (e.g., satellites) to quickly and readily ascertain the specific location of the goods at any time as well as the appropriate desired information relating to such goods (e.g., quantity, weight, type, etc.).

摘要翻译： 用于包含与从一个位置（例如，仓库）运送到另一个位置（例如客户）的特定商品相关的特定信息的射频（RF）设备（或“标签”）。 该装置包括电路化基板（例如，印刷电路板），半导体芯片，天线和功率调节器，并且在一个实施例中设计成部分地插入到包含一个或多个 的货物被运输和跟踪。 或者，该装置可以通过其他方式（例如，粘合剂）附接。 托运人可以使用无线通信设备（例如，卫星）轻松跟踪含有此类设备的货物，以便随时快速确定货物的具体位置以及与此类货物相关的适当的所需信息（例如数量，重量 ，类型等）。

公开(公告)号：US20060213973A1

公开(公告)日：2006-09-28

申请号：US11086324

申请日：2005-03-23

申请人： Benson Chan ,  How Lin ,  Voya Markovich ,  Ronald Smith

发明人： Benson Chan ,  How Lin ,  Voya Markovich ,  Ronald Smith

IPC分类号： G06K5/00 ,  G06K19/06

CPC分类号： G06K19/005 ,  G06K7/084 ,  G06K17/00 ,  G06K19/07354 ,  G06K2017/0064

摘要： An electronic card assembly is provided which includes a protective housing having a movable card therein. The card, in one example one having a magnetic stripe, has its information erased when being inserted into the housing and re-written back onto its information portion (magnetic stripe) during card withdrawal, provided appropriate human information (e.g., from a fingerprint) is received by the assembly's reader component.

摘要翻译： 提供了一种电子卡组件，其包括其中具有可移动卡的保护壳体。 在一个示例中具有磁条的卡在卡插入时被插入到壳体中被擦除并且在卡退出期间被重新写回到其信息部分（磁条）上，提供适当的人类信息（例如，从指纹） 被大会的阅读器组件接收。

公开(公告)号：US20050152650A1

公开(公告)日：2005-07-14

申请号：US10756782

申请日：2004-01-13

申请人： John Knickerbocker ,  How Lin

发明人： John Knickerbocker ,  How Lin

IPC分类号： G02B6/36 ,  G02B6/38

CPC分类号： G02B6/3672 ,  G02B6/3644 ,  G02B6/3692 ,  G02B6/3696 ,  G02B6/3885

摘要： A method is provided for making ferrules for connecting optical fibers to other optical fibers or to an optical input device such as an optical chip. The method utilizes ceramic greensheets or silicon wafers. In one method, the greensheets are stacked and laminated and then fiber optic through openings are provided in the laminate for holding the fibers. The laminate is then sintered forming the ferrule.

摘要翻译： 提供了一种用于制造用于将光纤连接到其它光纤或光输入装置（例如光学芯片）的套圈的方法。 该方法采用陶瓷片或硅片。 在一种方法中，将绿色纸堆叠并层压，然后在用于保持纤维的层压体中设置光纤通孔。 然后将层压体烧结形成套圈。