HEATED FLOOR PANELS
    13.
    发明申请
    HEATED FLOOR PANELS 审中-公开

    公开(公告)号:US20200011543A1

    公开(公告)日:2020-01-09

    申请号:US16453220

    申请日:2019-06-26

    Abstract: A heater panel includes a core and a heater/dielectric layer including a positive thermal coefficient (PTC) heater layer between a pair of dielectric layers. A structural facing is included, wherein the heater/dielectric layer is bonded directly between the core and the structural facing. A second structural facing can be bonded to the core opposite the heater/dielectric layer. An impact layer can be bonded to the structural facing, e.g., the first structural facing described above, opposite the heater/dielectric layer. The heater layer can be formed by direct writing a heating element pattern onto a dielectric layer bonded to the core.

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