摘要:
A semiconductor device in accordance with the present invention includes a semiconductor element chip pressed and secured on a distortion die-pad so that the semiconductor element chip, sealed inside a package, is held in a predetermined distorted state. The predetermined distorted state is preferably downward or upward warping. The semiconductor element chip operates normally in the distorted state, and does not operate normally when the semiconductor element chip is separated from the semiconductor device, and thereby released from the distortion and laid alone. This ensures that the semiconductor element chip is protected from circuit analysis.
摘要:
A positive resist composition comprising a poly(p-hydroxystyrene) as matrix resin which is synthesized by an anionic polymerization method and has a weight average molecular weight of from 8,000 to 20,000, bis(p-t-butoxycarbonylmethyl)thymolphthalein as dissolution inhibitor, bis(p-t-butylphenyl)iodonium triflate as acid generator; a compound which contains one amino group and one carboxyl group to function as acid deactivator and propylene glycol monomethyl ether acetate as organic solvent.
摘要:
A door lock system for a vehicle includes a) a latch mechanism which is adapted to a vehicle door and which holds the vehicle door to a vehicle body, b) an open link which is engagable and disengagable with the latch mechanism, c) a swing lever which is connected to the open link, d) an electric driving source having a gear member, and e) a rotary gear member which is arranged between the swing lever and the electric driving source so as to be meshed with the gear member of the electric driving source. The rotary gear member is directly and engagably connected to the swing lever.
摘要:
A door lock system for a vehicle includes a latch mechanism, an open link, an inside lever and a cancel lever. The latch mechanism is adapted to a vehicle door and latches the vehicle door to a vehicle body. The open link is engagable and disengagable with the latch mechanism. The inside lever is adapted to an inside handle of the vehicle door and is engagable with the open link. The cancel lever is connected to the open link and is arranged between the inside lever and the open link so as to be engagable with the inside lever when the open link is disengaged from the latch mechanism.
摘要:
A latex compound for dip molding, which can be used for production of a high-quality dip-molded product that is excellent in oil resistance and mechanical strength, has uniform film thickness and soft feeling to the skin and is free of pinholes, as is required for gloves etc. especially in the medical fields, and assumes no stickiness on the surface of the molded product after molding. This object is attained by a latex compound for dip molding which comprises a copolymer latex (L) obtained by emulsion polymerization of a monomer mixture and 0.05 to 5.0 parts by weight of a bubble breaker (A) consisting of a C8-22 fatty acid or a salt thereof, and if necessary, 0.1 to 5.0 parts by weight of a di C5-12 alkyl sulfosuccinate salt (B) and/or 0.5 to 10.0 parts by weight of a C13-20 alkyl benzene sulfonate (C) per 100 parts by weight of the monomer mixture.
摘要:
A friction member is a clutch facing, a brake pad, or a brake lining which comprises a phenolic fiber, a plated organic fiber, and/or mixed fiber thereof, which may or may not comprise the other fibers such as nonorganic fibers, as based material of the aforementioned friction member, wherein various difficulties of asbestos are improved.
摘要:
A lid lock apparatus for a vehicle includes a driving motor, a moving member causing a lid member provided at a vehicle body to be inhibited from opening in a state where the moving member projects from the housing to engage with the lid member, the moving member being retracted into the housing by the driving motor to release the engagement between the moving member and the lid member, and a pulling member connected to the moving member and pulled in a case where the moving member is inhibited from moving by the driving motor to cause the moving member to be retracted into the housing and to release the engagement between the moving member and the lid member. The moving member is movable relative to the pulling member in a moving direction of the moving member in a case where the pulling member is inhibited from operating.
摘要:
A semiconductor chip has a nonvolatile memory formed on the upper surface side of a semiconductor substrate. The chip includes at least one recess portion formed in the lower surface of the semiconductor substrate. The recess portion is located in a region corresponding to the nonvolatile memory. A method of manufacturing the semiconductor chip is also disclosed.
摘要:
A clutch assembly has a clutch cover secured to a flywheel, a diaphragm spring positioned outside the clutch cover, and an annular pressure plate positioned inside the clutch cover. The diaphragm spring is pivotally mounted on the clutch cover by rivets disposed in several openings formed in the diaphragm spring. The pressure plate is connected with the clutch cover by a suitable number of flexible drive straps which are disposed between the clutch cover and the pressure plate and extend chordally across the pressure plate. One end of each drive strap is secured to the pressure plate by a rivet. The other end of each drive strap is secured to the clutch cover by a rivet which is positioned radially inwardly of the inner periphery of the pressure plate and is aligned with an opening formed in the diaphragm spring. The rivet for securing each drive strap to the clutch cover may be riveted under the condition wherein one end of the drive strap is already secured to the pressure plate and the diaphragm spring is already secured to the cover plate.
摘要:
Embodiments of the present invention provide a probe card in which the positional shift of the tip of a probe can be compensated for in response to a change in the temperature, and a wafer test in a wide range of temperatures can be performed. More specifically, the probe card includes a substrate, a probe composed of a first metallic material having a first thermal expansion coefficient, a base of the probe being joined to the substrate, a tip of the probe coming into contact with a connection terminal of an electronic device, and a thermal compensation member composed of a second metallic material having a second thermal expansion coefficient that is higher than the first thermal expansion coefficient, a base of the thermal compensation member being fixed to the substrate, a tip of the thermal compensation member coming into contact with the probe at an intermediate portion between the base of the probe and the tip of the probe.