公开(公告)号：US06759722B2

公开(公告)日：2004-07-06

申请号：US09820671

申请日：2001-03-30

申请人： Eiji Yanagawa ,  Akihiko Nakano ,  Toshinori Ohmi ,  Hironori Matsumoto ,  Tadao Takeda ,  Hideyuki Unno ,  Hiroshi Ban

发明人： Eiji Yanagawa ,  Akihiko Nakano ,  Toshinori Ohmi ,  Hironori Matsumoto ,  Tadao Takeda ,  Hideyuki Unno ,  Hiroshi Ban

IPC分类号： H01L2982

CPC分类号： H01L23/573 ,  H01L23/58 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L29/0657 ,  H01L2224/13144 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07811 ,  H01L2924/10158 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19043 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： In the present semiconductor device, a chip with an LSI circuit is secured to a board 3 (with the chip flipped) so as to be level. The LSI circuit on the chip is specified to operate normally only when the chip is level. Further, the back of the chip is processed so as to give stress to the chip. The chip has a reduced thickness of 50 &mgr;m or less (alternatively 30 &mgr;m to 50 &mgr;m). Therefore, when the chip is detached from the board, it deforms and is no longer level due to the stress, which prohibits the LSI circuit from operating normally. This way, the present semiconductor device ensures that no analysis can be conducted on the LSI circuit once the chip is detached.

摘要翻译： 在本半导体器件中，具有LSI电路的芯片被固定在板3上（芯片翻转）以使其水平。 指定芯片上的LSI电路只在芯片处于电平状态时正常工作。 此外，芯片的背面被加工成对芯片施加压力。 该芯片具有减小的厚度为50μm或更小（或者30μm至50μm）。 因此，当芯片与板分离时，其变形并且由于应力而不再水平，这阻止了LSI电路正常工作。 这样，本半导体装置确保一旦芯片脱离就不能对LSI电路进行分析。

公开(公告)号：US06545371B1

公开(公告)日：2003-04-08

申请号：US09834605

申请日：2001-04-16

申请人： Hironori Matsumoto ,  Akihiko Nakano ,  Toshinori Ohmi ,  Eiji Yanagawa ,  Hideyuki Unno ,  Hiroshi Ban ,  Tadao Takeda

发明人： Hironori Matsumoto ,  Akihiko Nakano ,  Toshinori Ohmi ,  Eiji Yanagawa ,  Hideyuki Unno ,  Hiroshi Ban ,  Tadao Takeda

IPC分类号： H01L2358

CPC分类号： H01L23/576 ,  H01L23/573 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device includes, on a protective film laminated on a circuit principal part, (i) a light blocking film provided so as to cover the circuit principal part, (ii) an aluminum oxide film provided so as to completely cover the light blocking film, and (iii) a light-blocking upper wiring provided on the aluminum oxide film. An attempt to exfoliate the light blocking film or the light blocking upper wiring causes the resistance-detection-use upper wiring to break or thin, thereby resulting in an increase in the resistance of the resistance-detection-use wiring. The increase in the resistance is detected by the resistance detecting circuit part, and malfunction or inoperativeness of the circuit principal part is caused in response of detection. By so doing, the circuit principal part can be protected from analysis.

摘要翻译： 半导体器件包括在层叠在电路主要部分上的保护膜上，（i）设置成覆盖电路主要部分的遮光膜，（ii）设置成完全覆盖遮光膜的氧化铝膜 ，和（iii）设置在氧化铝膜上的遮光上层布线。 剥离遮光膜或遮光上布线的尝试使得电阻检测用上层布线断裂或变薄，从而导致电阻检测用布线的电阻增加。 通过电阻检测电路部分检测电阻的增加，并且响应于检测而引起电路主要部分的故障或不能操作。 通过这样做，可以保护电路主要部分免受分析。

公开(公告)号：US06472730B1

公开(公告)日：2002-10-29

申请号：US09551741

申请日：2000-04-18

申请人： Eiji Yanagawa ,  Akihiko Nakano ,  Toshinori Ohmi ,  Tadao Takeda ,  Hideyuki Unno ,  Hiroshi Ban

发明人： Eiji Yanagawa ,  Akihiko Nakano ,  Toshinori Ohmi ,  Tadao Takeda ,  Hideyuki Unno ,  Hiroshi Ban

IPC分类号： H01L23495

CPC分类号： H01L23/573 ,  H01L23/49503 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L29/0657 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10157 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor device in accordance with the present invention includes a semiconductor element chip pressed and secured on a distortion die-pad so that the semiconductor element chip, sealed inside a package, is held in a predetermined distorted state. The predetermined distorted state is preferably downward or upward warping. The semiconductor element chip operates normally in the distorted state, and does not operate normally when the semiconductor element chip is separated from the semiconductor device, and thereby released from the distortion and laid alone. This ensures that the semiconductor element chip is protected from circuit analysis.

摘要翻译： 根据本发明的半导体器件包括被压紧并固定在失真裸片上的半导体元件芯片，使得密封在封装内的半导体元件芯片保持在预定的失真状态。 预定的扭曲状态优选为向下或向上翘曲。 半导体元件芯片在失真状态下正常工作，并且当半导体元件芯片与半导体器件分离时，其不能正常工作，从而从失真中释放并放置。 这确保半导体元件芯片免受电路分析。

公开(公告)号：US6060773A

公开(公告)日：2000-05-09

申请号：US74437

申请日：1998-05-07

申请人： Hiroshi Ban ,  Masaaki Tanno ,  Tadao Takeda

发明人： Hiroshi Ban ,  Masaaki Tanno ,  Tadao Takeda

IPC分类号： H01L21/306 ,  H01L23/58 ,  H01L23/02

CPC分类号： H01L23/573 ,  H01L21/30608 ,  H01L2924/0002 ,  Y10S257/922

摘要： A semiconductor chip has a nonvolatile memory formed on the upper surface side of a semiconductor substrate. The chip includes at least one recess portion formed in the lower surface of the semiconductor substrate. The recess portion is located in a region corresponding to the nonvolatile memory. A method of manufacturing the semiconductor chip is also disclosed.

摘要翻译： 半导体芯片具有在半导体衬底的上表面侧形成的非易失性存储器。 芯片包括形成在半导体衬底的下表面中的至少一个凹部。 凹部位于与非易失性存储器对应的区域中。 还公开了制造半导体芯片的方法。

公开(公告)号：US5512417A

公开(公告)日：1996-04-30

申请号：US388508

申请日：1995-02-14

申请人： Hiroshi Ban ,  Akinobu Tanaka ,  Fujio Yagihasi ,  Jun Watanabe ,  Minoru Takamizawa

发明人： Hiroshi Ban ,  Akinobu Tanaka ,  Fujio Yagihasi ,  Jun Watanabe ,  Minoru Takamizawa

IPC分类号： G03F7/004 ,  G03F7/029 ,  G03F7/039 ,  H01L21/027

CPC分类号： G03F7/0045 ,  Y10S430/106 ,  Y10S430/118 ,  Y10S430/119 ,  Y10S430/143 ,  Y10S430/167

摘要： A positive resist composition comprising a poly(p-hydroxystyrene) as matrix resin which is synthesized by an anionic polymerization method and has a weight average molecular weight of from 8,000 to 20,000, bis(p-t-butoxycarbonylmethyl)thymolphthalein as dissolution inhibitor, bis(p-t-butylphenyl)iodonium triflate as acid generator; a compound which contains one amino group and one carboxyl group to function as acid deactivator and propylene glycol monomethyl ether acetate as organic solvent.

摘要翻译： 一种正型抗蚀剂组合物，其包含作为基质树脂的聚（对羟基苯乙烯），其通过阴离子聚合法合成并具有8,000至20,000的重均分子量，双（对 - 丁氧基羰基甲基）百里酚酞作为溶解抑制剂，双（pt 丁基苯基）三氟甲磺酸碘酸盐; 含有一个氨基和一个羧基作为酸失活剂和丙二醇单甲醚乙酸酯作为有机溶剂的化合物。

公开(公告)号：US20130210150A1

公开(公告)日：2013-08-15

申请号：US13819235

申请日：2011-08-30

申请人： Hiroshi Ban ,  Yasuji Ueda ,  Noemi Fusaki ,  Koichi Saeki ,  Mamoru Hasegawa

发明人： Hiroshi Ban ,  Yasuji Ueda ,  Noemi Fusaki ,  Koichi Saeki ,  Mamoru Hasegawa

IPC分类号： C12N15/86

CPC分类号： C12N15/86 ,  C12N5/0696 ,  C12N15/63 ,  C12N2501/602 ,  C12N2501/603 ,  C12N2501/604 ,  C12N2506/13 ,  C12N2510/00 ,  C12N2760/18843

摘要： The present invention provides Sendai virus vectors in which genes that encode reprograming factors for inducing pluripotent stem cells are incorporated in a specific order, compositions comprising these vectors for gene delivery to be used in the induction of pluripotent stem cells, and uses thereof. Incorporation of the KLF gene, OCT gene, and SOX gene in a specific order into a single Sendai virus vector successfully and significantly increased the efficiency of pluripotent stem cell induction. Loading multiple reprogramming factors into a single vector can further increase the induction efficiency of pluripotent stem cells while reducing the number of necessary vectors.

摘要翻译： 本发明提供仙台病毒载体，其中编码用于诱导多能干细胞的重编程因子的基因以特定顺序并入，包含用于诱导多能干细胞的基因递送的载体的组合物及其用途。 将KLF基因，OCT基因和SOX基因以特定顺序并入单一仙台病毒载体中，并显着提高多能干细胞诱导的效率。 将多个重编程因子加载到单个载体中可以进一步增加多能干细胞的诱导效率，同时减少必需载体的数量。

公开(公告)号：US06945574B2

公开(公告)日：2005-09-20

申请号：US09809068

申请日：2001-03-16

申请人： Shigeru Hayakawa ,  Hiroshi Ban ,  Norio Konomoto ,  Katsutoshi Fukunaga ,  Makoto Suzumura ,  Akira Muramatsu ,  Yasuhiko Sono

发明人： Shigeru Hayakawa ,  Hiroshi Ban ,  Norio Konomoto ,  Katsutoshi Fukunaga ,  Makoto Suzumura ,  Akira Muramatsu ,  Yasuhiko Sono

IPC分类号： E05B65/12 ,  E05B65/20 ,  E05C3/06

CPC分类号： E05B81/06 ,  E05B77/18 ,  E05B81/16 ,  E05B81/34 ,  E05B83/36 ,  E05B85/02 ,  Y10S292/23 ,  Y10T292/1047 ,  Y10T292/1082

摘要： A door lock system for a vehicle includes a) a latch mechanism which is adapted to a vehicle door and which holds the vehicle door to a vehicle body, b) an open link which is engagable and disengagable with the latch mechanism, c) a swing lever which is connected to the open link, d) an electric driving source having a gear member, and e) a rotary gear member which is arranged between the swing lever and the electric driving source so as to be meshed with the gear member of the electric driving source. The rotary gear member is directly and engagably connected to the swing lever.

摘要翻译： 一种用于车辆的门锁系统，包括：a）适于车门并将车门保持在车体上的闩锁机构，b）与所述闩锁机构可接合和分离的开放连杆; c）摆动 杠杆，其连接到所述开放连杆; d）具有齿轮构件的电动驱动源，以及e）旋转齿轮构件，其布置在所述摆动杆和所述电动驱动源之间，以便与所述齿轮构件 电动驱动源。 旋转齿轮构件直接和可接合地连接到摆动杆。

公开(公告)号：US06575506B2

公开(公告)日：2003-06-10

申请号：US09809051

申请日：2001-03-16

申请人： Shigeru Hayakawa ,  Hiroshi Ban ,  Norio Konomoto ,  Katsutoshi Fukunaga ,  Makoto Suzumura ,  Akira Muramatsu ,  Yasuhiko Sono

发明人： Shigeru Hayakawa ,  Hiroshi Ban ,  Norio Konomoto ,  Katsutoshi Fukunaga ,  Makoto Suzumura ,  Akira Muramatsu ,  Yasuhiko Sono

IPC分类号： E05C306

CPC分类号： E05B81/06 ,  E05B77/20 ,  E05B77/30 ,  E05B81/16 ,  E05B81/34 ,  Y10S292/23 ,  Y10T292/1047

摘要： A door lock system for a vehicle includes a latch mechanism, an open link, an inside lever and a cancel lever. The latch mechanism is adapted to a vehicle door and latches the vehicle door to a vehicle body. The open link is engagable and disengagable with the latch mechanism. The inside lever is adapted to an inside handle of the vehicle door and is engagable with the open link. The cancel lever is connected to the open link and is arranged between the inside lever and the open link so as to be engagable with the inside lever when the open link is disengaged from the latch mechanism.

摘要翻译： 用于车辆的门锁系统包括闩锁机构，开放连杆，内侧杆和取消杆。 闩锁机构适用于车门并将车门锁定到车体。 开启链接与闩锁机构可接合并可脱开。 内侧杠杆适用于车门的内侧手柄，并可与开启连杆接合。 取消杆连接到开启连杆，并且当打开连杆从闩锁机构脱离时，设置在内侧杠杆和开放连杆之间，以便与内侧杠杆接合。

公开(公告)号：US06492446B1

公开(公告)日：2002-12-10

申请号：US09594788

申请日：2000-06-16

申请人： Yuichiro Kajiwara ,  Masaaki Tsuji ,  Shigeo Suzuki ,  Takashi Suetsugu ,  Hiroshi Ban

发明人： Yuichiro Kajiwara ,  Masaaki Tsuji ,  Shigeo Suzuki ,  Takashi Suetsugu ,  Hiroshi Ban

IPC分类号： C08L904

CPC分类号： C08K5/09 ,  C08K5/42 ,  C08L21/02

摘要： A latex compound for dip molding, which can be used for production of a high-quality dip-molded product that is excellent in oil resistance and mechanical strength, has uniform film thickness and soft feeling to the skin and is free of pinholes, as is required for gloves etc. especially in the medical fields, and assumes no stickiness on the surface of the molded product after molding. This object is attained by a latex compound for dip molding which comprises a copolymer latex (L) obtained by emulsion polymerization of a monomer mixture and 0.05 to 5.0 parts by weight of a bubble breaker (A) consisting of a C8-22 fatty acid or a salt thereof, and if necessary, 0.1 to 5.0 parts by weight of a di C5-12 alkyl sulfosuccinate salt (B) and/or 0.5 to 10.0 parts by weight of a C13-20 alkyl benzene sulfonate (C) per 100 parts by weight of the monomer mixture.

摘要翻译： 用于浸渍成型的胶乳化合物，其可用于生产耐油性和机械强度优异的高品质浸渍成型产品，具有均匀的膜厚度和对皮肤的柔软感觉，并且没有针孔 需要手套等，特别是在医疗领域，并且在成型后在成型品的表面上不发粘。 该目的通过用于浸渍成型的胶乳化合物来实现，该胶乳化合物包括通过单体混合物的乳液聚合获得的共聚物胶乳（L）和0.05-5.0重量份由C8-22脂肪酸或 其盐，如果需要，将0.1至5.0重量份的二-C 12-12烷基磺基琥珀酸盐（B）和/或0.5至10.0重量份C 13-20烷基苯磺酸盐（C）/ 100份 单体混合物的重量。

公开(公告)号：US4262788A

公开(公告)日：1981-04-21

申请号：US947102

申请日：1978-09-29

申请人： Yasunobu Yamamoto ,  Hiroshi Ban ,  Katumi Nakavishi ,  Ryoichi Tomikawa ,  Katumi Nakanishi ,  Ryoichi Tomikawa ,  Toshitake Kato

发明人： Yasunobu Yamamoto ,  Hiroshi Ban ,  Katumi Nakavishi ,  Ryoichi Tomikawa ,  Katumi Nakanishi ,  Ryoichi Tomikawa ,  Toshitake Kato

IPC分类号： C08J5/14 ,  F16D69/02 ,  F16D11/00

CPC分类号： F16D69/026 ,  F16D2200/0095 ,  Y10S428/935 ,  Y10S428/936 ,  Y10T428/256 ,  Y10T428/294 ,  Y10T428/298 ,  Y10T428/2982 ,  Y10T442/2344 ,  Y10T442/692 ,  Y10T442/696

摘要： A friction member is a clutch facing, a brake pad, or a brake lining which comprises a phenolic fiber, a plated organic fiber, and/or mixed fiber thereof, which may or may not comprise the other fibers such as nonorganic fibers, as based material of the aforementioned friction member, wherein various difficulties of asbestos are improved.

摘要翻译： 摩擦构件是离合器面对，制动衬块或制动衬片，其包括酚醛纤维，镀有机纤维和/或其混合纤维，其可以或可以不包含其它纤维如无机纤维作为基础 上述摩擦构件的材料，其中石棉的各种困难得到改善。