公开(公告)号：US20170018494A1

公开(公告)日：2017-01-19

申请号：US15211332

申请日：2016-07-15

Applicant: IBIDEN CO., LTD.

Inventor： Kota NODA ,  Takema ADACHI

IPC: H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L21/48

CPC classification number: H01L23/49838 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49894 ,  H01L23/562 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: An interposer includes an insulating plate including insulating layers and having first, second, third and fourth surfaces such that the second surface is on the opposite side of the first surface, the third surface is perpendicular to the first surface, the fourth surface is on the opposite side of the third surface, and the insulating layers are laminated on the third surface, and conductor layers formed in the insulating plate such that each conductor layer is interposed between adjacent insulating layers and includes straight conductors having first electrodes exposed from the first surface and second electrodes exposed from the second surface, respectively. The insulating layers include second insulating layers each sandwiched by adjacent conductor layers such that each second insulating layer integrally has an inter-conductor-layer insulating layer portion formed between the adjacent conductor layers and inter-conductor insulating layer portions formed between adjacent straight conductors in a respective conductor layer.

Abstract translation: 插入件包括绝缘板，该绝缘板包括绝缘层并且具有第一表面，第二表面，第三表面和第四表面，使得第二表面位于第一表面的相反侧，第三表面垂直于第一表面， 绝缘层层压在第三表面上，导体层形成在绝缘板上，使得每个导体层插入在相邻的绝缘层之间，并且包括具有从第一表面露出的第一电极的直导体和 第二电极分别从第二表面暴露。 绝缘层包括由相邻的导体层夹着的第二绝缘层，使得每个第二绝缘层一体地具有形成在相邻的导体层之间的导体间绝缘层部分和形成在相邻的直导体之间的导体间绝缘层部分 各导体层。

公开(公告)号：US20160044780A1

公开(公告)日：2016-02-11

申请号：US14820978

申请日：2015-08-07

Applicant: IBIDEN CO., LTD.

Inventor： Yasushi INAGAKI ,  Kota NODA

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/18 ,  H05K3/20 ,  H05K3/06 ,  H05K3/40 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K1/111 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/09 ,  H05K1/115 ,  H05K3/007 ,  H05K3/06 ,  H05K3/061 ,  H05K3/188 ,  H05K3/202 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4069 ,  H05K2201/0302 ,  H05K2201/0341 ,  H05K2201/0367 ,  H05K2201/09563 ,  H05K2201/098 ,  H05K2203/06 ,  Y02P70/611

Abstract: A printed wiring board includes an insulating layer, a first conductor layer embedded into a first surface of the insulating layer and including connecting portions to connect an electronic component, a second conductor layer projecting from a second surface of the insulating layer, a solder resist layer covering the first conductor layer and having an opening structure exposing the connecting portions, a barrier metal layer formed on the connecting portions such that the barrier layer is projecting from the first surface of the insulating layer, and metal posts formed on the barrier layer such that the metal posts are positioned on the connecting portions, respectively. Each metal post has width which is greater than width of a respective connecting portion, and the barrier metal layer includes a metal material which is different from a metal material forming the metal posts and a metal material forming the first conductor layer.

Abstract translation: 印刷布线板包括绝缘层，第一导体层，其嵌入绝缘层的第一表面中，并且包括用于连接电子部件的连接部分，从绝缘层的第二表面突出的第二导体层，阻焊层 覆盖第一导体层并具有露出连接部分的开口结构，形成在连接部分上的阻挡金属层，使得阻挡层从绝缘层的第一表面突出，以及形成在阻挡层上的金属柱，使得 金属柱分别位于连接部分上。 每个金属柱的宽度大于相应连接部分的宽度，并且阻挡金属层包括与形成金属柱的金属材料不同的金属材料和形成第一导体层的金属材料。

公开(公告)号：US20140353017A1

公开(公告)日：2014-12-04

申请号：US14268553

申请日：2014-05-02

Applicant: IBIDEN CO., LTD.

Inventor： Kota NODA ,  Nobuhisa KURODA

IPC: H05K1/18 ,  H05K3/30 ,  H05K1/03

CPC classification number: H05K1/185 ,  H01L23/49822 ,  H01L23/50 ,  H01L2924/0002 ,  H05K3/4602 ,  H05K2201/0191 ,  H05K2203/0191 ,  H05K2203/1469 ,  Y10T29/49139 ,  H01L2924/00

Abstract: A wiring board includes a core substrate including an insulative substrate and a first inner conductive-circuit layer formed on first surface of the insulative substrate, an electronic component positioned in a penetrating hole formed in the insulative substrate and having a positive electrode terminal on first end portion and a negative electrode terminal on second end portion on the opposite side, a first interlayer insulative resin layer formed on first surface of the core such that the first insulative layer is positioned over the core and component in the penetrating hole, and an outer conductive-circuit layer formed on surface of the first insulative layer such that thicknesses of the first insulative layer between the outer conductive-circuit layer and the terminals are less than thickness of the first insulative layer between the first inner conductive-circuit layer and the outer conductive-circuit layer.

Abstract translation: 布线基板包括：芯基板，包括绝缘基板和形成在所述绝缘基板的第一表面上的第一内导电电路层;电子元件，位于形成在所述绝缘基板上的贯通孔中，并且在第一端部具有正极端子 部分和相对侧的第二端部上的负极端子，形成在所述芯的第一表面上的第一层间绝缘树脂层，使得所述第一绝缘层位于所述芯上的所述贯通孔中的部件和外部导电 形成在第一绝缘层的表面上的电路层，使得外部导电电路层和端子之间的第一绝缘层的厚度小于第一内部导电电路层和外部导电层之间的第一绝缘层的厚度 电路层。