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公开(公告)号：US08883956B2
公开(公告)日：2014-11-11
申请号：US13662203
申请日：2012-10-26
Applicant: Industrial Technology Research Institute
Inventor： Hsueh-Yi Liao , Chyi-Ming Leu , Tzong-Ming Lee
IPC: C08G69/26
CPC classification number: C08G73/1007 , C08G73/1042 , C08G73/105 , C08G73/1067 , C08G73/1071
Abstract: Disclosed is a polyimide polymerized by x molar parts of a first diamine, y molar parts of a second diamine, and 100 molar parts of a first dianhydride, wherein the first diamine has a formula of the second diamine has a formula of the first dianhydride has a formula of a+b=100, 50≦x≦80, and 20≦y≦50.
Abstract translation: 公开了由x摩尔份的第一二胺，y摩尔份的第二种二胺和100摩尔份的第一种二酐聚合的聚酰亚胺，其中第一种二胺具有式Ⅱ的第二种二胺具有式 a + b = 100,50＆nlE; x＆nlE; 80和20＆amp; nlE; y＆nlE; 50的公式。
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公开(公告)号：US10995237B2
公开(公告)日：2021-05-04
申请号：US16234073
申请日：2018-12-27
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Dong-Sen Chen , Yu-Ju Kuo , Chyi-Ming Leu
Abstract: A polyimide precursor solution is provided. The polyimide precursor solution includes 100 parts by weight of a fully aromatic polyamic acid, from 5 to 20 parts by weight of silica particles, from 5 to 80 parts by weight of an alkoxysilane, and from 40 to 80 parts by weight of a solvent.
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13.发明授权公开(公告)号：US10007164B2
公开(公告)日：2018-06-26
申请号：US14978906
申请日：2015-12-22
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Yu-Ruei Kung , Li-Ting Huang , Chyi-Ming Leu
IPC: C07C233/43 , C07C233/62 , C07D209/50 , G02F1/153 , C09K9/02 , G02F1/15
CPC classification number: G02F1/153 , C07C233/43 , C07C233/62 , C07C2601/14 , C07D209/50 , C09K9/02 , C09K2211/1007 , C09K2211/1014 , C09K2211/1025 , C09K2211/1029 , G02F1/15165 , G02F2001/1502
Abstract: An organic compound, a light modulating composition and a light modulating device are provided. The organic compound has a chemical structure represented by formula (I): X—Ar—X (I) wherein X is Ar is The organic compound is transparent in its neutral state. The amide group or imide group introduced into the aromatic amine not only enhances the solubility of the organic compound in the solvent, but also enhances the electrochemical stability of the organic compound.
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公开(公告)号：US09982108B2
公开(公告)日：2018-05-29
申请号：US13900324
申请日：2013-05-22
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Chih-Cheng Lin , Chyi-Ming Leu
CPC classification number: C08K3/20 , C08J7/12 , C08J2379/08 , C08K3/22 , C08K3/36 , C08K2003/2227 , H05K1/0346 , H05K2201/0154 , H05K2201/0209 , H05K2203/0769 , H05K2203/0793 , Y10T428/259 , Y10T428/31721 , C08L79/08
Abstract: The disclosure provides a polyimide-containing layer suitable for being etched by an alkaline solution and a method for etching a polyimide-containing layer. The polyimide-containing layer suitable for being etched by an alkaline solution includes 20-50 parts by weight of a silica dioxide, and 50-80 parts by weight of a polyimide.
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公开(公告)号：US09707706B2
公开(公告)日：2017-07-18
申请号：US14627913
申请日：2015-02-20
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Chun-Wei Su , Chyi-Ming Leu , Yu-Ju Kuo , Hong-Ching Lin , Chun-An Lu , Chiung-Hsiung Chen
CPC classification number: B29C39/02 , B29C35/02 , B29C39/003 , B29K2027/16 , B29K2079/08 , B29K2505/00 , B29K2995/0005 , B29L2031/3425 , H05K3/207 , H05K2201/0154 , H05K2201/2072 , H05K2203/1131
Abstract: A flexible substrate embedded with wires includes a flexible substrate constituted by a polymer material, and a continuous wire pattern containing a plurality of pores embedded in the flexible substrate, wherein the polymer material fills the pores. A method for fabricating a flexible substrate embedded with wires providing a carrier; forming a continuous wire pattern on the carrier, the continuous wire pattern containing a plurality of pores; covering a polymer material over the continuous wire pattern and the carrier and to fill into the pores; and separating the polymer material and the carrier to form a flexible substrate embedded with the continuous wire pattern” where the only change is the addition of wires.
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Patent Agency Ranking
16.发明申请公开(公告)号：US20170183476A1
公开(公告)日：2017-06-29
申请号：US15144013
申请日：2016-05-02
Applicant: Industrial Technology Research Institute
Inventor： Chyi-Ming Leu , Chih-Jen Yang , Li-Ting Huang
IPC: C08K3/34 , C09D7/12 , C08J3/11 , C09D179/08
CPC classification number: C08K3/346 , C08G73/105 , C08G73/1078 , C08G73/14 , C08J3/11 , C08J2379/08 , C08K2201/011 , C09D7/61 , C09D179/08
Abstract: The present disclosure provides a dispersion solution, including: a first solvent; a second solvent miscible with the first solvent; an inorganic nano sheet material dispersed in the first solvent; and a polymer dissolved in the second solvent, wherein the boiling point of the first solvent is different from that of the second solvent. The present disclosure also provides a method for preparing the dispersion solution and an organic/inorganic hybrid material having a lower coefficient of thermal expansion.
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17.发明申请公开(公告)号：US20160181553A1
公开(公告)日：2016-06-23
申请号：US14578705
申请日：2014-12-22
Applicant: Industrial Technology Research Institute
Inventor： Yueh-Chuan Huang , Chyi-Ming Leu
CPC classification number: H01L51/0097 , B32B3/30 , B32B27/08 , B32B2457/206 , H01L2251/5338 , Y02E10/549
Abstract: The present disclosure provides a substrate structure for an electronic element, which includes a supporting carrier; a release layer having a first microstructure on a surface thereof, and the release layer having first adhesion to the supporting carrier; and a flexible substrate for disposing the supporting carrier and the release layer thereon, wherein the flexible substrate has second adhesion to the release layer, the first adhesion is greater than the second adhesion, and the surface of the flexible substrate in contact with the surface of the release layer has a second microstructure opposing to the first microstructure. The present disclosure further provides a method for fabricating the substrate structure.
Abstract translation: 本公开提供了一种用于电子元件的衬底结构，其包括支撑载体; 释放层，其表面上具有第一微结构，并且所述释放层具有对所述支撑载体的第一粘附; 以及用于在其上设置支撑载体和释放层的柔性基板，其中柔性基板具有对剥离层的第二粘附，第一粘合力大于第二粘合力，并且柔性基板的与表面接触的表面 释放层具有与第一微结构相对的第二微结构。 本公开还提供了一种用于制造衬底结构的方法。
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18.发明授权公开(公告)号：US10689488B2
公开(公告)日：2020-06-23
申请号：US16229008
申请日：2018-12-21
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Hsin-Chung Wu , Chyi-Ming Leu , Sheng-Yen Shen , Jiang-Jen Lin
Abstract: Provided are a method for manufacturing polycarbonate polyol and a composition including the polycarbonate polyol. The composition includes polycarbonate polyol; a plurality of nanoscale silicate platelets having 10,000 to 20,000 (units/per platelet) of metal cations on surfaces thereof, wherein the polycarbonate polyol has a viscosity of from 265 to 1520 cps.
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公开(公告)号：US20200052243A1
公开(公告)日：2020-02-13
申请号：US16379815
申请日：2019-04-10
Inventor： Yung-Hui Yeh , Jui-Chang Chuang , Li-Ching Wang , Cheng-Yueh Chang , Chyi-Ming Leu , Shih-Ming Chen
Abstract: Provided is a protective structure including an auxiliary layer and a hard coating layer. The auxiliary layer has a first surface and a second surface opposite to the first surface. The hard coating layer is located on the second surface of the auxiliary layer. The Young's modulus of the auxiliary layer is gradually increased from the second surface to the first surface. An electronic device with the same is also provided.
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20.发明申请公开(公告)号：US20190202981A1
公开(公告)日：2019-07-04
申请号：US16229008
申请日：2018-12-21
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Hsin-Chung Wu , Chyi-Ming Leu , Sheng-Yen Shen , Jiang-Jen Lin
Abstract: Provided are a method for manufacturing polycarbonate polyol and a composition including the polycarbonate polyol. The composition includes polycarbonate polyol; a plurality of nanoscale silicate platelets having 10,000 to 20,000 (units/per platelet) of metal cations on surfaces thereof, wherein the polycarbonate polyol has a viscosity of from 265 to 1520 cps.
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