公开(公告)号：US20190144410A1

公开(公告)日：2019-05-16

申请号：US16179296

申请日：2018-11-02

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Kuei-Yi CHUANG ,  Kuo-Chan CHIOU ,  Feng-Po TSENG

IPC: C07D307/52 ,  C08G18/02 ,  C08G18/83 ,  C08G65/331 ,  C08G61/04 ,  C08G61/12 ,  C08G61/10 ,  C07D307/42 ,  C07D407/06

Abstract: The invention provides a furan-modified compound or oligomer. The compound has a structure represented by Formula I: When formula I represents a compound, x is an integer of 1˜5; A including a group formed of ketone, amido, imide, imido, phenyl ether or enol ether group; G is a direct bond, —O—, —N—, —Ar—NH—(CH2)b—, —Ar—O—(CH2)b—, —Ar—O—(CH2)a—NH—(CH2)b—, —(CH2)a—NH—(CH2)b—, —(CH2)a—O—(CH2)b— or —(CH2)a—CH(OH)—(CH2)b—NH—; Ar is substituted or unsubstituted arylene group; a is an integer of 1 to 5; and b is an integer of 0 to 5.

公开(公告)号：US20210189057A1

公开(公告)日：2021-06-24

申请号：US16727285

申请日：2019-12-26

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Kuei-Yi CHUANG ,  Kuo-Chan CHIOU ,  Yen-Chun LIU

IPC: C08G59/14 ,  B01J23/08 ,  C08J11/16

Abstract: A degradation method of thermosetting resin is provided. The method includes the following steps, for example, a first resin composition is provided. The resin in the first resin composition includes a carbon-nitrogen bond, an ether bond, an ester bond or a combination thereof. The first resin composition and a catalyst composition are mixed to perform a degradation reaction to form a second resin composition. The catalyst composition includes a transition metal compound and a group IIIA metal compound. The second resin composition includes a resin monomer or an oligomer thereof having functional groups. The functional group includes an amine group, a hydroxyl group, an ester group, an acid group or a combination thereof. A catalyst composition used in the degradation method and a resin composition obtained by the degradation method are also provided.

公开(公告)号：US20170158934A1

公开(公告)日：2017-06-08

申请号：US15046973

申请日：2016-02-18

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yen-Chun LIU ,  Hui-Wen CHANG ,  Min-Chian WANG ,  Kuo-Chan CHIOU

IPC: C09K5/14 ,  C08G73/14

CPC classification number: C09K5/14 ,  C08G73/10 ,  C08G73/1035 ,  C08G73/1046 ,  C08G73/14 ,  C08K3/34 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2003/382 ,  C08L79/08

Abstract: A thermally conductive resin is provided. The thermally conductive resin has the formula In the formula, X1 is X2 is m is an integer ranging from 0 to 95, n is an integer ranging from 1 to 50, and o is an integer ranging from 1 to 80. A thermal interface material including the thermally conductive resin is also provided.

公开(公告)号：US20170158932A1

公开(公告)日：2017-06-08

申请号：US14974616

申请日：2015-12-18

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yen-Chun LIU ,  Hui-Wen CHANG ,  Hsiang-Yen TSAO ,  Kuo-Chan CHIOU

IPC: C09K5/14 ,  C08G59/50 ,  C08G59/22

CPC classification number: C09K5/14 ,  C08G59/22 ,  C08G59/226 ,  C08G59/24 ,  C08G59/245 ,  C08G59/50 ,  C08G59/5033 ,  H01L23/3737

Abstract: An epoxy resin composition is provided. The epoxy resin composition includes a first aromatic epoxy resin represented by formula (I), and an amino compound selected from a group that includes 4,4′-methylenedianiline, 4,4′-ethylenedianiline, 4,4′-bis(4-aminophenoxy)biphenyl and 1,4-bis(4-aminophenoxy)benzene, wherein the ratio between the epoxy groups of the first aromatic epoxy resin and the amino groups of the amino compound ranges from 1:1 to 2:1.

公开(公告)号：US20170145247A1

公开(公告)日：2017-05-25

申请号：US14982821

申请日：2015-12-29

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Shou-yi HO ,  Kuo-Chan CHIOU

IPC: C09D133/14 ,  C09D139/04 ,  H05K1/18 ,  C09D7/12

CPC classification number: C09D133/14 ,  C08G75/045 ,  C08K2003/2227 ,  C09D4/06 ,  C09D7/61 ,  C09D139/04 ,  C09D181/04 ,  H05K1/185 ,  H05K3/285 ,  H05K2201/0209 ,  H05K2201/10128

Abstract: A packaging composition and packaging structure employing the same are disclosed. The packaging composition includes: (a) 30-70 parts by weight of free radical polymerizable monomer, and (b) 30-70 parts by weight of prepolymer. In particular, the oligomer is a reaction product of polythiol compound and polyester oligomer having acrylate functional group.

公开(公告)号：US20150166347A1

公开(公告)日：2015-06-18

申请号：US14484430

申请日：2014-09-12

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chen-Lung LIN ,  Yen-Chun LIU ,  Hui-Wen CHANG ,  Kuo-Chan CHIOU ,  Hsien-Lin HU

IPC: C01B31/04 ,  C08G73/14

CPC classification number: C01B31/04 ,  C01B32/20 ,  C08G73/1035 ,  C08G73/1042 ,  C08G73/1053 ,  C08G73/1067 ,  C08G73/1071 ,  C08G73/14 ,  C09D179/08

Abstract: A polyamide-imide represented by the following formula is provided. A graphite film prepared by performing a thermal treatment process on the polyamide-imide represented by the above-mentioned formula is also provided. In the thermal treatment process, the temperature range of the thermal treatment process ranges from 25° C. to 2,900° C.

Abstract translation: 提供由下式表示的聚酰胺 - 酰亚胺。 还提供了通过对由上述式表示的聚酰胺 - 酰亚胺进行热处理工艺制备的石墨膜。 在热处理过程中，热处理工艺的温度范围为25℃至2900℃。

公开(公告)号：US20140178823A1

公开(公告)日：2014-06-26

申请号：US13908082

申请日：2013-06-03

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chen-Lung LIN ,  Fu-Shun HSU ,  Kuo-Chan CHIOU

IPC: G03F7/038

CPC classification number: G03F7/0387 ,  G03F7/027 ,  G03F7/0388

Abstract: A photosensitive polyimide and negative type photo-resist composition containing the same are provided. The photosensitive polyimide is represented by formula (I): wherein X1 and X3 are the same or different organic functional groups having four covalent bonds; X2 and X4 are the same or different organic functional groups having two covalent bonds, and X2 contains functional groups of OH or COOH and any one selected from the functional groups below: wherein R is H or CH3, p and q are integers of 1 to 20, and m and n in formula (I) are numbers of repeat units.

Abstract translation: 提供含有它们的光敏聚酰亚胺和负型光致抗蚀剂组合物。 光敏聚酰亚胺由式（I）表示：其中X1和X3是具有四个共价键的相同或不同的有机官能团; X 2和X 4是具有两个共价键的相同或不同的有机官能团，X 2包含OH或COOH的官能团和选自以下官能团的任何一个：其中R是H或CH 3，p和q是1至 20，式（I）中的m和n为重复单元数。