公开(公告)号：US20160336757A1

公开(公告)日：2016-11-17

申请号：US14712144

申请日：2015-05-14

Applicant: Intel Corporation

Inventor： Sreenivas Kasturi ,  Songnan Yang ,  Jonathan Rosenfeld ,  Isaac Sever ,  Trent D. Whitten ,  Shahar Porat

IPC: H02J5/00 ,  H02J7/02

CPC classification number: H02J7/025 ,  B60L1/00 ,  B60L3/00 ,  H01F27/16 ,  H02J1/10 ,  H02J5/005 ,  H02J7/16 ,  H02J50/12 ,  H04B3/00 ,  H04B15/00

Abstract: Techniques for voltage regulation in a system, method, and apparatus are described herein. An apparatus for voltage regulation in a wireless power receiver may include a rectifier having an output voltage. The apparatus may also include voltage compensation logic including at least one capacitor to reduce voltage variation of the output voltage from the rectifier.

Abstract translation: 本文描述了系统，方法和装置中的电压调节技术。 无线电力接收器中用于电压调节的装置可以包括具有输出电压的整流器。 该装置还可以包括电压补偿逻辑，其包括至少一个电容器以减小来自整流器的输出电压的电压变化。

公开(公告)号：US12094827B2

公开(公告)日：2024-09-17

申请号：US18216989

申请日：2023-06-30

Applicant: Intel Corporation

Inventor： Mathew J. Manusharow ,  Jonathan Rosenfeld

IPC: H01L23/48 ,  H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H01L23/64 ,  H01L25/00 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/5383 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/642 ,  H01L23/647 ,  H01L25/065 ,  H01L25/0655 ,  H01L25/50 ,  H01L23/49816 ,  H01L23/5385 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/15192

Abstract: An integrated circuit package is disclosed. The integrated circuit package includes a first integrated circuit die, a second integrated circuit die, an organic substrate, wherein both the first integrated circuit die and the second integrated circuit die are connected to the organic substrate, a multi-die interconnect bridge (EMIB) embedded within the organic substrate, and a termination resistor associated with a circuit in the first integrated circuit die, wherein the termination resistor is located within the multi-die interconnect bridge embedded within the organic substrate.

公开(公告)号：US10886228B2

公开(公告)日：2021-01-05

申请号：US15774091

申请日：2015-12-23

Applicant: Intel Corporation

Inventor： Mathew J. Manusharow ,  Jonathan Rosenfeld

IPC: H01L23/00 ,  H01L23/538 ,  H01L25/065 ,  H01L21/48 ,  H01L23/498 ,  H01L23/64 ,  H01L25/00

Abstract: An integrated circuit package is disclosed. The integrated circuit package includes a first integrated circuit die, a second integrated circuit die, an organic substrate, wherein both the first integrated circuit die and the second integrated circuit die are connected to the organic substrate, a multi-die interconnect bridge (EMIB) embedded within the organic substrate, and a termination resistor associated with a circuit in the first integrated circuit die, wherein the termination resistor is located within the multi-die interconnect bridge embedded within the organic substrate.

公开(公告)号：US10003218B2

公开(公告)日：2018-06-19

申请号：US14578422

申请日：2014-12-20

Applicant: Intel Corporation

Inventor： Songnan Yang ,  Janardhan Narayan ,  Jonathan Rosenfeld ,  Kerry Stevens ,  Patrick Chewning

IPC: H02J50/10 ,  H02J7/02 ,  G06F1/16 ,  H01F27/02 ,  H01F27/36 ,  H01F38/14 ,  H02J7/00

CPC classification number: H02J50/10 ,  G06F1/1613 ,  G06F1/1616 ,  G06F1/1635 ,  G06F1/1656 ,  G06F1/1698 ,  G06F1/263 ,  H01F27/02 ,  H01F27/362 ,  H01F27/365 ,  H01F38/14 ,  H02J7/0042 ,  H02J7/025

Abstract: This disclosure pertains to wireless power transfer systems, and in particular (but not exclusively), to techniques to improve the coupling efficiency between a power transmitting unit and a power receiving unit within a computing device. The present disclosure includes a system which comprises a computing unit which includes a power receiving unit and a conductive surface. The conductive surface has an opening that is adjacent to the power receiving unit and a slot extending from the opening towards the perimeter of the conductive surface. The computing unit further includes a system base coupled to the power receiving unit wherein the power receiving unit is to provide power to the system base. The system also includes a power transmitting unit adjacent to the computing unit.

公开(公告)号：US09954385B2

公开(公告)日：2018-04-24

申请号：US14757912

申请日：2015-12-24

Applicant: Intel Corporation

Inventor： Jonathan Rosenfeld ,  Geoffrey Jensen ,  Patrick W. Chewning ,  Sean L. Molloy ,  Hao-Han Hsu ,  Songnan Yang

IPC: H02J7/00 ,  H02J7/02 ,  H02J50/12

CPC classification number: H02J7/025 ,  H02J7/0042 ,  H02J50/12

Abstract: A computing device includes a charging coil for producing a charging current when placed in a magnetic field of a wireless power transmitter. A wireless charging operating frequency is associated with wireless charging of a battery of the computing device by the charging coil and the wireless power transmitter. An electrically conductive substrate has a plurality of gaps for reducing eddy currents when the electrically conductive substrate is disposed between the charging coil and the wireless power transmitter during charging of the battery. A plurality of filters each electrically bridge a respective one of the gaps. Each filter attenuates signals within a range of frequencies including the wireless charging operating frequency.

公开(公告)号：US09774211B2

公开(公告)日：2017-09-26

申请号：US14712144

申请日：2015-05-14

Applicant: Intel Corporation

Inventor： Sreenivas Kasturi ,  Songnan Yang ,  Jonathan Rosenfeld ,  Isaac Sever ,  Trent D. Whitten ,  Shahar Porat

IPC: H02J7/00 ,  H02J1/10 ,  H02J5/00 ,  H01F27/16 ,  B60L1/00 ,  B60L3/00 ,  H04B3/00 ,  H04B15/00 ,  H02J7/02 ,  H02J50/12 ,  H02J7/16

CPC classification number: H02J7/025 ,  B60L1/00 ,  B60L3/00 ,  H01F27/16 ,  H02J1/10 ,  H02J5/005 ,  H02J7/16 ,  H02J50/12 ,  H04B3/00 ,  H04B15/00

Abstract: Techniques for voltage regulation in a system, method, and apparatus are described herein. An apparatus for voltage regulation in a wireless power receiver may include a rectifier having an output voltage. The apparatus may also include voltage compensation logic including at least one capacitor to reduce voltage variation of the output voltage from the rectifier.

公开(公告)号：US09685792B2

公开(公告)日：2017-06-20

申请号：US14197598

申请日：2014-03-05

Applicant: INTEL CORPORATION

Inventor： Songnan Yang ,  Janardhan Koratikere Narayan ,  Anand Konanur ,  Jonathan Rosenfeld ,  Sreenivas Kasturi ,  Kwan Ho Lee ,  Ulun Karacaoglu

IPC: H01F27/42 ,  H02J5/00 ,  H01F27/28 ,  H01F38/14 ,  H02J7/02 ,  H02J17/00

CPC classification number: H01F27/28 ,  H01F38/14 ,  H02J5/005 ,  H02J7/025 ,  H02J17/00 ,  H02J50/10 ,  H02J50/12 ,  H02J50/40 ,  Y10T29/4902

Abstract: Techniques of magnetic field distribution are described herein. The techniques may include forming a wireless charging component including a driving coil to receive a driven current generating a magnetic field. An outer turn of a parasitic coil may be formed, wherein the outer turn is adjacent to the driving coil. An inner turn of the parasitic coil may be formed, wherein an inductive coupling between the driving coil and the parasitic coil generates a redistribution of a portion of the magnetic field at the inner turn.