公开(公告)号：US20190131345A1

公开(公告)日：2019-05-02

申请号：US16233787

申请日：2018-12-27

Applicant: Intel Corporation

Inventor： Khaled Ahmed ,  Kunjal Parikh ,  Peter L. Chang

IPC: H01L27/15 ,  H01L33/00 ,  H01L33/18

Abstract: A micro-light emitting diode (LED) display panel and a method of forming the display panel, the micro-LED display panel having a monolithically grown micro-structure including a first color micro-LED that is a first color nanowire LED, and a second color micro-LED that is a second color nanowire LED.

公开(公告)号：US10242892B2

公开(公告)日：2019-03-26

申请号：US15512342

申请日：2014-10-17

Applicant: Intel Corporation

Inventor： Peter L. Chang ,  Chytra Pawashe ,  Michael C. Mayberry ,  Jia-Hung Tseng

IPC: H01L21/67 ,  H01L23/00 ,  H01L21/683 ,  H01L25/075 ,  H01L33/00 ,  H01L33/36 ,  H01L33/44 ,  H01L33/62

Abstract: Micro pick-and-bond heads, assembly methods, and device assemblies. In, embodiments, micro pick-and-bond heads transfer micro device elements, such as (micro) LEDs, en masse from a source substrate to a target substrate, such as a LED display substrate. Anchor and release structures on the source substrate enable device elements to be separated from a source substrate, while pressure sensitive adhesive (PSA) enables device elements to be temporarily affixed to pedestals of a micro pick-and-bond head. Once the device elements are permanently affixed to a target substrate, the PSA interface may be defeated through peeling and/or thermal decomposition of an interface layer.

公开(公告)号：US10204808B2

公开(公告)日：2019-02-12

申请号：US15512342

申请日：2014-10-17

Applicant: Intel Corporation

Inventor： Peter L. Chang ,  Chytra Pawashe ,  Michael C. Mayberry ,  Jia-Hung Tseng

IPC: H01L21/67 ,  H01L23/00 ,  H01L21/683 ,  H01L25/075 ,  H01L33/00 ,  H01L33/36 ,  H01L33/44 ,  H01L33/62

Abstract: Micro pick-and-bond heads, assembly methods, and device assemblies. In, embodiments, micro pick-and-bond heads transfer micro device elements, such as (micro) LEDs, en masse from a source substrate to a target substrate, such as a LED display substrate. Anchor and release structures on the source substrate enable device elements to be separated from a source substrate, while pressure sensitive adhesive (PSA) enables device elements to be temporarily affixed to pedestals of a micro pick-and-bond head. Once the device elements are permanently affixed to a target substrate, the PSA interface may be defeated through peeling and/or thermal decomposition of an interface layer.

公开(公告)号：US10128307B2

公开(公告)日：2018-11-13

申请号：US15512526

申请日：2014-10-17

Applicant: Intel Corporation

Inventor： Peter L. Chang

IPC: H01L33/00 ,  H01L27/15 ,  H01L33/56 ,  H01L33/62 ,  H01L33/38

Abstract: Crystalline (micro)LED display assemblies, methods of fabricating such display assemblies, crystalline LED source substrates from which the (micro)LEDs may be transferred to the display assembly, and methods of fabricating such source substrates. LED elements may be prepared for transfer by pick-n-place or other means to a bonding substrate. Anchor and release structures enable LED elements to be affixed and electrically coupled to a bonding substrate with conductive polymer. LED elements may be prepared for transfer to a bonding substrate with self-aligned LED electrode metallization structures enabling the elements to be affixed to a bonding substrate with an adhesive and electrically coupled with a self-aligned local interconnect metallization. After affixing the LED elements, material may be built-up around the LED elements and the display assembly separated from the bonding substrate.

公开(公告)号：US09922592B2

公开(公告)日：2018-03-20

申请号：US14757637

申请日：2015-12-23

Applicant: Intel Corporation

Inventor： Kunjal Parikh ,  Khaled Ahmed ,  Prakash K. Radhakrishnan ,  Peter L. Chang ,  Ravi Ranganathan

IPC: G09G3/32 ,  G09G3/20

CPC classification number: G09G3/32 ,  G09G3/2003 ,  G09G2300/0404 ,  G09G2310/08 ,  G09G2320/0242

Abstract: In one example, a method for controlling a display with a digital signal includes detecting a binary value from a timing controller, the binary value corresponding to a portion of an image to be displayed. The method can also include determining a previous binary value from the timing controller and calculating a difference between the binary value from the timing controller and the previous binary value from the timing controller. Furthermore, the method can include generating an encoded signal based on the difference and transmitting the encoded signal to a display panel.

公开(公告)号：US20170131469A1

公开(公告)日：2017-05-11

申请号：US15352520

申请日：2016-11-15

Applicant: Intel Corporation

Inventor： Mauro J. Kobrinsky ,  Henning Braunisch ,  Shawna M. Liff ,  Peter L. Chang ,  Bruce A. Block ,  Johanna M. Swan

IPC: G02B6/12 ,  H01L25/16 ,  H04B10/25 ,  H01L23/498 ,  G02B6/42 ,  H04B10/40

CPC classification number: G02B6/12004 ,  G02B6/12 ,  G02B6/30 ,  G02B6/4214 ,  G02B6/4257 ,  G02B6/428 ,  G02B2006/12061 ,  G02B2006/12121 ,  G02B2006/12123 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/167 ,  H01L2224/13025 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/83048 ,  H01L2224/83102 ,  H01L2224/83986 ,  H01L2224/92125 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/15311 ,  H01L2924/15312 ,  H04B10/25 ,  H04B10/40 ,  H04B10/801 ,  H01L2924/00014 ,  H01L2924/014

Abstract: Photonic components are placed on the processor package to bring the optical signal close to the processor die. The processor package includes a substrate to which the processor die is coupled, and which allows the processor die to connect to a printed circuit board. The processor package also includes transceiver logic, electrical-optical conversion circuits, and an optical coupler. The electrical-optical conversion circuits can include laser(s), modulator(s), and photodetector(s) to transmit and receive and optical signal. The coupler interfaces to a fiber that extends off the processor package. Multiple fibers can be brought to the processor package allowing for a scalable high-speed, high-bandwidth interconnection to the processor.

公开(公告)号：US11569293B2

公开(公告)日：2023-01-31

申请号：US17316288

申请日：2021-05-10

Applicant: INTEL CORPORATION

Inventor： Khaled Ahmed ,  Kunjal Parikh ,  Peter L. Chang

IPC: H01L27/15 ,  H01L33/00 ,  H01L33/18

Abstract: A micro-light emitting diode (LED) display panel and a method of forming the display panel, the micro-LED display panel having a monolithically grown micro-structure including a first color micro-LED that is a first color nanowire LED, and a second color micro-LED that is a second color nanowire LED.

公开(公告)号：US10886153B2

公开(公告)日：2021-01-05

申请号：US16224550

申请日：2018-12-18

Applicant: Intel Corporation

Inventor： Peter L. Chang ,  Chytra Pawashe ,  Michael C. Mayberry ,  Jia-Hung Tseng

IPC: H01L21/67 ,  H01L23/00 ,  H01L33/00 ,  H01L21/683 ,  H01L25/075 ,  H01L33/36 ,  H01L33/44 ,  H01L33/62

Abstract: Micro pick-and-bond heads, assembly methods, and device assemblies. In, embodiments, micro pick-and-bond heads transfer micro device elements, such as (micro) LEDs, en masse from a source substrate to a target substrate, such as a LED display substrate. Anchor and release structures on the source substrate enable device elements to be separated from a source substrate, while pressure sensitive adhesive (PSA) enables device elements to be temporarily affixed to pedestals of a micro pick-and bond head. Once the device elements are permanently affixed to a target substrate, the PSA interface may be defeated through peeling and/or thermal decomposition of an interface layer.

公开(公告)号：US20190148188A1

公开(公告)日：2019-05-16

申请号：US16224550

申请日：2018-12-18

Applicant: Intel Corporation

Inventor： Peter L. Chang ,  Chytra Pawashe ,  Michael C. Mayberry ,  Jia-Hung Tseng

IPC: H01L21/67 ,  H01L23/00 ,  H01L33/36 ,  H01L21/683 ,  H01L25/075 ,  H01L33/00 ,  H01L33/62 ,  H01L33/44

Abstract: Micro pick-and-bond heads, assembly methods, and device assemblies. In, embodiments, micro pick-and-bond heads transfer micro device elements, such as (micro) LEDs, en masse from a source substrate to a target substrate, such as a LED display substrate. Anchor and release structures on the source substrate enable device elements to be separated from a source substrate, while pressure sensitive adhesive (PSA) enables device elements to be temporarily affixed to pedestals of a micro pick-and bond head. Once the device elements are permanently affixed to a target substrate, the PSA interface may be defeated through peeling and/or thermal decomposition of an interface layer.

公开(公告)号：US10054737B2

公开(公告)日：2018-08-21

申请号：US15352520

申请日：2016-11-15

Applicant: Intel Corporation

Inventor： Mauro J Kobrinsky ,  Henning Braunisch ,  Shawna M. Liff ,  Peter L. Chang ,  Bruce A. Block ,  Johanna M. Swan

IPC: G02B6/12 ,  G02B6/42 ,  H04B10/40 ,  H04B10/25 ,  H01L23/498 ,  H01L25/16 ,  H01L23/00 ,  H01L21/56

CPC classification number: G02B6/12004 ,  G02B6/12 ,  G02B6/30 ,  G02B6/4214 ,  G02B6/4257 ,  G02B6/428 ,  G02B2006/12061 ,  G02B2006/12121 ,  G02B2006/12123 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/167 ,  H01L2224/13025 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/83048 ,  H01L2224/83102 ,  H01L2224/83986 ,  H01L2224/92125 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/15311 ,  H01L2924/15312 ,  H04B10/25 ,  H04B10/40 ,  H04B10/801 ,  H01L2924/00014 ,  H01L2924/014

Abstract: Photonic components are placed on the processor package to bring the optical signal close to the processor die. The processor package includes a substrate to which the processor die is coupled, and which allows the processor die to connect to a printed circuit board. The processor package also includes transceiver logic, electrical-optical conversion circuits, and an optical coupler. The electrical-optical conversion circuits can include laser(s), modulator(s), and photodetector(s) to transmit and receive and optical signal. The coupler interfaces to a fiber that extends off the processor package. Multiple fibers can be brought to the processor package allowing for a scalable high-speed, high-bandwidth interconnection to the processor.