-
公开(公告)号：US10211970B2
公开(公告)日：2019-02-19
申请号：US15475827
申请日：2017-03-31
Applicant: INTEL CORPORATION
Inventor： Telesphor Kamgaing , Georgios C. Dogiamis , Sasha N. Oster
IPC: H04B10/00 , H04L7/00 , H04L7/033 , H04B10/61 , H04B10/548
Abstract: The present disclosure is directed to systems and methods for communicating between rack mounted devices disposed in the same or different racks separated by distances of less than a meter to a few tens of meters. The system includes a CMOS first mm-wave engine that includes mm-wave transceiver circuitry, mm-wave MODEM circuitry, power distribution and control circuitry, and a mm-wave waveguide connector. The CMOS first mm-wave engine communicably couples to a CMOS second mm-wave engine that also includes mm-wave transceiver circuitry, mm-wave MODEM circuitry, power distribution and control circuitry, and a mm-wave waveguide connector. In some implementations, at least a portion of the mm-wave transceiver circuitry may be fabricated using III-V semiconductor manufacturing methods. The use of mm-wave communication techniques beneficially improves data integrity and increases achievable datarates, and reduces power costs.
-
公开(公告)号：US20180191049A1
公开(公告)日：2018-07-05
申请号：US15394990
申请日：2016-12-30
Applicant: INTEL CORPORATION
Inventor： Telesphor Kamgaing , Georgios C. Dogiamis , Sasha N. Oster
Abstract: Radio frequency (RF) data transfer between components in rack mounted systems is facilitated through the use of dielectric waveguides and millimeter Wave (mm-Wave) transceivers. A signal generator provides one or more data signals to a serializer/deserializer (SERDES) which serializes a plurality of parallel data signals to produce a single, serialized, signal containing data from each of the input signals to the SERDES. A mm-Wave die upconverts the serialized signal to a mm-Wave signal and a mm-Wave launcher launches the signal into the dielectric waveguide. At the receiving end the process is reversed such that the mm-Wave signal is first downconverted and passed through a SERDES to provide the original one or more signals to a recipient signal generator. Some or all of the components may be formed directly in the semiconductor package.
-
公开(公告)号：US20180182736A1
公开(公告)日：2018-06-28
申请号：US15388906
申请日：2016-12-22
Applicant: Intel Corporation
Inventor： Feras Eid , Nader N. Abazarnia , Johanna M. Swan , Taesha D. Beasley , Sasha N. Oster , Tannaz Harirchian , Shawna M. Liff
IPC: H01L25/065 , H01L23/31 , H01L23/373 , H01L23/29 , H01L23/48 , H01L23/498 , H01L21/56
Abstract: An embodiment includes an apparatus comprising: a semiconductor die; package molding that is molded onto and conformal with a first die surface of the semiconductor die and at least two sidewalls of the semiconductor die, the package molding including: (a)(i) a first surface contacting the semiconductor die, (a)(ii) a second surface opposite the first surface, and (a)(iii) an aperture that extends from the first surface to the second surface; and a polymer substantially filling the aperture; wherein the package molding includes a first thermal conductivity (watts per meter kelvin (W/(m·K)) and the polymer includes a second thermal conductivity that is greater than the first thermal conductivity. Other embodiments are described herein.
-
公开(公告)号：US20170288290A1
公开(公告)日：2017-10-05
申请号：US15087802
申请日：2016-03-31
Applicant: Intel Corporation
Inventor： Sasha N. Oster , Adel A. Elsherbini , Kemal Aygun , Robert L. Sankman
CPC classification number: H01P3/06 , G06F1/16 , H01B11/1891 , H01P3/02
Abstract: Electrical cable technology is disclosed. In one example, an electrical cable can include a transmission line conductor, a ground conductor, and a dielectric material. The dielectric material can have at least a portion with a thickness separating the transmission line conductor and the ground conductor that is variable along a length of the electrical cable. Such a non-uniform cable (e.g., a cable having components or features that vary in size and/or geometry along the length of the cable) can provide high IO density with acceptable conductive losses and cross-talk while maintaining a desired impedance.
-
15.发明申请公开(公告)号：US20160280535A1
公开(公告)日：2016-09-29
申请号：US14671549
申请日：2015-03-27
Applicant: Intel Corporation
Inventor： Kyu Oh Lee , Zheng Zhou , Islam A. Salama , Feras Eid , Sasha N. Oster , Lay Wai Kong , Javier Soto Gonzalez
CPC classification number: B81B7/0077 , B81C2203/0109
Abstract: Methods of forming sensor integrated package devices and structures formed thereby are described. An embodiment includes providing a substrate core, wherein a first conductive trace structure and a second conductive trace structure are disposed on the substrate core, forming a cavity between the first conductive trace structure and the second conductive trace structure, and placing a magnet on a resist material disposed on a portion of each of the first and second conductive trace structures, wherein the resist material does not extend over the cavity.
Abstract translation: 描述形成传感器集成封装器件和由此形成的结构的方法。 一个实施例包括提供衬底芯，其中第一导电迹线结构和第二导电迹线结构设置在衬底芯上，在第一导电迹线结构和第二导电迹线结构之间形成空腔，并将磁体放置在抗蚀剂上 设置在第一和第二导电迹线结构中的每一个的一部分上的材料，其中抗蚀剂材料不在空腔上延伸。
-
Patent Agency Ranking
公开(公告)号：US09397071B2
公开(公告)日：2016-07-19
申请号：US14102757
申请日：2013-12-11
Applicant: Intel Corporation
Inventor： Omkar G. Karhade , John S. Guzek , Johanna M. Swan , Christopher J. Nelson , Nitin A. Deshpande , William J. Lambert , Charles A. Gealer , Feras Eid , Islam A. Salama , Kemal Aygun , Sasha N. Oster , Tyler N. Osborn
IPC: H05K7/00 , H01L25/00 , H01L23/00 , H01L25/065 , H01L23/538 , H05K1/18
CPC classification number: H01L25/16 , H01L23/5383 , H01L23/5386 , H01L23/5387 , H01L24/50 , H01L24/86 , H01L25/00 , H01L25/0655 , H01L2224/0405 , H01L2224/04105 , H01L2224/05568 , H01L2224/056 , H01L2224/05647 , H01L2224/29078 , H01L2224/86203 , H01L2224/86815 , H05K1/185 , Y10T29/49155 , H01L2924/00014 , H01L2924/014
Abstract: A microelectronic package of the present description may comprises a first microelectronic device having at least one row of connection structures electrically connected thereto and a second microelectronic device having at least one row of connection structures electrically connected thereto, wherein the connection structures within the at least one first microelectronic device row are aligned with corresponding connection structures within the at least one second microelectronic device row in an x-direction. An interconnect comprising an interconnect substrate having a plurality of electrically isolated conductive traces extending in the x-direction on a first surface of the interconnect substrate may be attached to the at least one first microelectronic device connection structure row and the at least one second microelectronic device connection structure row, such that at least one interconnect conductive trace forms a connection between a first microelectronic device connection structure and its corresponding second microelectronic device connection structure.
Abstract translation: 本说明书的微电子封装可以包括具有与其电连接的至少一行连接结构的第一微电子器件和具有与其电连接的至少一排连接结构的第二微电子器件，其中所述至少一个 第一微电子器件行与X方向上的至少一个第二微电子器件行内的对应连接结构对准。 包括具有在互连衬底的第一表面上沿x方向延伸的多个电隔离导电迹线的互连衬底的互连可以附接到所述至少一个第一微电子器件连接结构行和所述至少一个第二微电子器件 连接结构行，使得至少一个互连导电迹线形成第一微电子器件连接结构与其对应的第二微电子器件连接结构之间的连接。
-
公开(公告)号：US11430751B2
公开(公告)日：2022-08-30
申请号：US16465132
申请日：2016-12-30
Applicant: Intel Corporation
Inventor： Aleksandar Aleksov , Georgios C. Dogiamis , Telesphor Kamgaing , Sasha N. Oster
IPC: H01L23/66 , H01L23/31 , H01L23/538 , H01L23/552 , H01L25/16 , H01Q1/22 , H01Q1/24 , H01Q1/52
Abstract: Embodiments of the invention include a microelectronic device that includes a first ultra thin substrate formed of organic dielectric material and conductive layers, a first mold material to integrate first radio frequency (RF) components with the first substrate, and a second ultra thin substrate being coupled to the first ultra thin substrate. The second ultra thin substrate formed of organic dielectric material and conductive layers. A second mold material integrates second radio frequency (RF) components with the second substrate.
-
公开(公告)号：US11360512B2
公开(公告)日：2022-06-14
申请号：US16567479
申请日：2019-09-11
Applicant: Intel Corporation
Inventor： Nadine L. Dabby , Sasha N. Oster , Aleksandar Aleksov , Braxton Lathrop , Racquel L Fygenson
Abstract: Systems and methods describe herein provide a solution to the technical problem of creating a wearable electronic devices. In particular, these systems and methods enable electrical and mechanical attachment of stretchable or flexible electronics to fabric. A stretchable or flexible electronic platform is bonded to fabric using a double-sided fabric adhesive, and conductive adhesive is used to join pads on the electronic platform to corresponding electrical leads on the fabric. An additional waterproofing material may be used over and beneath the electronic platform to provide a water-resistant or waterproof device This stretchable or flexible electronic platform integration process allows the platform to bend and move with the fabric while protecting the conductive connections. By using flexible and stretchable conductive leads and adhesives, the platform is more flexible and stretchable than traditional rigid electronics enclosures.
-
公开(公告)号：US20210376437A1
公开(公告)日：2021-12-02
申请号：US17403571
申请日：2021-08-16
Applicant: Intel Corporation
Inventor： Aleksandar Aleksov , Georgios C. Dogiamis , Telesphor Kamgaing , Sasha N. Oster , Adel A. Elsherbini , Shawna M. Liff , Johanna M. Swan , Brandon M. Rawlings , Richard J. Dischler
Abstract: A method of forming a waveguide comprises forming an elongate waveguide core including a dielectric material; and arranging a conductive sheet around an outside surface of the dielectric core to produce a conductive layer around the waveguide core.
-
公开(公告)号：US11095012B2
公开(公告)日：2021-08-17
申请号：US16329587
申请日：2016-09-30
Applicant: Intel Corporation
Inventor： Aleksandar Aleksov , Georgios C. Dogiamis , Telesphor Kamgaing , Sasha N. Oster , Adel A. Elsherbini , Shawna M. Liff , Johanna M. Swan , Brandon M. Rawlings , Richard J. Dischler
Abstract: A method of forming a waveguide comprises forming an elongate waveguide core including a dielectric material; and arranging a conductive sheet around an outside surface of the dielectric core to produce a conductive layer around the waveguide core.
-
-
-
-
-
-
-
-
-
Search Results
102
records
(took 0.02 seconds)
