公开(公告)号：US20120157804A1

公开(公告)日：2012-06-21

申请号：US12968637

申请日：2010-12-15

申请人： John A. ROGERS ,  Dae Hyeong KIM ,  Joshua D. MOSS ,  David J. CALLANS ,  Brian LITT ,  Jonathan VIVENTI

发明人： John A. ROGERS ,  Dae Hyeong KIM ,  Joshua D. MOSS ,  David J. CALLANS ,  Brian LITT ,  Jonathan VIVENTI

IPC分类号： A61B5/145 ,  A61B6/00 ,  A61N1/36 ,  A61N1/365 ,  A61N5/06 ,  A61B18/00 ,  A61M37/00 ,  A61N2/00 ,  A61B5/04 ,  A61F7/12

CPC分类号： A61N1/36 ,  A61B5/0422 ,  A61B5/076 ,  A61B5/6867 ,  A61B2562/02 ,  A61B2562/066 ,  A61B2562/12 ,  A61B2562/164 ,  A61N1/0472 ,  A61N1/05 ,  A61N1/0587 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/3192 ,  H01L24/24 ,  H01L24/50 ,  H01L24/82 ,  H01L24/86 ,  H01L27/1218 ,  H01L29/78603 ,  H01L29/7869 ,  H01L2221/6835 ,  H01L2221/68386 ,  H01L2224/24137 ,  H01L2224/793 ,  H01L2224/86203 ,  H01L2224/8685 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0283 ,  H05K1/147 ,  H05K3/323 ,  H05K2201/09263 ,  H01L2924/00

摘要： Provided herein are biomedical devices and methods of making and using biomedical devices for sensing and actuation applications. For example, flexible and/or stretchable biomedical devices are provided including electronic devices useful for establishing in situ conformal contact with a tissue in a biological environment. The invention includes implantable electronic devices and devices administered to the surfaces(s) of a target tissue, for example, for obtaining electrophysiology data from a tissue such as cardiac, brain tissue or skin.

摘要翻译： 本文提供了用于制造和使用用于感测和致动应用的生物医学装置的生物医学装置和方法。 例如，提供了柔性和/或可拉伸的生物医学装置，包括用于在生物环境中建立与组织的原位保形接触有用的电子装置。 本发明包括施用于目标组织表面的可植入电子装置和装置，例如用于从诸如心脏，脑组织或皮肤的组织获得电生理学数据。

公开(公告)号：US07880277B2

公开(公告)日：2011-02-01

申请号：US11485194

申请日：2006-07-12

申请人： Alvin Seah ,  Elstan Anthony Fernandez

发明人： Alvin Seah ,  Elstan Anthony Fernandez

IPC分类号： H01L23/495

CPC分类号： H01L25/50 ,  H01L23/49572 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/86 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/48145 ,  H01L2224/49171 ,  H01L2224/50 ,  H01L2224/73265 ,  H01L2224/86203 ,  H01L2224/86205 ,  H01L2224/92247 ,  H01L2225/06579 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T29/49155 ,  Y10T29/49162 ,  Y10T29/49169 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a substrate, a die assembly attachable to the substrate and a flexible strip extending over the substrate and the die assembly. The flexible strip has one or more routing circuits carried thereon. The die assembly and the substrate are arranged to be electrically connected through the one or more routing circuits carried on the flexible strip.

摘要翻译： 半导体器件包括衬底，可附着于衬底的模具组件和在衬底和模具组件上延伸的柔性条带。 柔性条具有一个或多个在其上承载的路由电路。 芯片组件和基板被布置成通过柔性条带上承载的一个或多个路由电路电连接。

公开(公告)号：US09842832B2

公开(公告)日：2017-12-12

申请号：US15183179

申请日：2016-06-15

申请人： Intel Corporation

发明人： Omkar G. Karhade ,  John S. Guzek ,  Johanna M. Swan ,  Christopher J. Nelson ,  Nitin A. Deshpande ,  William J. Lambert ,  Charles A. Gealer ,  Feras Eid ,  Islam A. Salama ,  Kemal Aygun ,  Sasha N. Oster ,  Tyler N. Osborn

IPC分类号： H01L25/16 ,  H01L23/538 ,  H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  H05K1/18

CPC分类号： H01L25/16 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5387 ,  H01L24/50 ,  H01L24/86 ,  H01L25/00 ,  H01L25/0655 ,  H01L2224/0405 ,  H01L2224/04105 ,  H01L2224/05568 ,  H01L2224/056 ,  H01L2224/05647 ,  H01L2224/29078 ,  H01L2224/86203 ,  H01L2224/86815 ,  H05K1/185 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/014

摘要： A microelectronic package of the present description may comprises a first microelectronic device having at least one row of connection structures electrically connected thereto and a second microelectronic device having at least one row of connection structures electrically connected thereto, wherein the connection structures within the at least one first microelectronic device row are aligned with corresponding connection structures within the at least one second microelectronic device row in an x-direction. An interconnect comprising an interconnect substrate having a plurality of electrically isolated conductive traces extending in the x-direction on a first surface of the interconnect substrate may be attached to the at least one first microelectronic device connection structure row and the at least one second microelectronic device connection structure row, such that at least one interconnect conductive trace forms a connection between a first microelectronic device connection structure and its corresponding second microelectronic device connection structure.

公开(公告)号：US20160300824A1

公开(公告)日：2016-10-13

申请号：US15183179

申请日：2016-06-15

申请人： Intel Corporation

发明人： Omkar G. Karhade ,  John S. Guzek ,  Johanna M. Swan ,  Christopher J. Nelson ,  Nitin A. Deshpande ,  William J. Lambert ,  Charles A. Gealer ,  Feras Eid ,  Islam A. Salama ,  Kemal Aygun ,  Sasha N. Oster ,  Tyler N. Osborn

IPC分类号： H01L25/16 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L25/16 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5387 ,  H01L24/50 ,  H01L24/86 ,  H01L25/00 ,  H01L25/0655 ,  H01L2224/0405 ,  H01L2224/04105 ,  H01L2224/05568 ,  H01L2224/056 ,  H01L2224/05647 ,  H01L2224/29078 ,  H01L2224/86203 ,  H01L2224/86815 ,  H05K1/185 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/014

摘要： A microelectronic package of the present description may comprises a first microelectronic device having at least one row of connection structures electrically connected thereto and a second microelectronic device having at least one row of connection structures electrically connected thereto, wherein the connection structures within the at least one first microelectronic device row are aligned with corresponding connection structures within the at least one second microelectronic device row in an x-direction. An interconnect comprising an interconnect substrate having a plurality of electrically isolated conductive traces extending in the x-direction on a first surface of the interconnect substrate may be attached to the at least one first microelectronic device connection structure row and the at least one second microelectronic device connection structure row, such that at least one interconnect conductive trace forms a connection between a first microelectronic device connection structure and its corresponding second microelectronic device connection structure.

公开(公告)号：US09397071B2

公开(公告)日：2016-07-19

申请号：US14102757

申请日：2013-12-11

申请人： Intel Corporation

发明人： Omkar G. Karhade ,  John S. Guzek ,  Johanna M. Swan ,  Christopher J. Nelson ,  Nitin A. Deshpande ,  William J. Lambert ,  Charles A. Gealer ,  Feras Eid ,  Islam A. Salama ,  Kemal Aygun ,  Sasha N. Oster ,  Tyler N. Osborn

IPC分类号： H05K7/00 ,  H01L25/00 ,  H01L23/00 ,  H01L25/065 ,  H01L23/538 ,  H05K1/18

CPC分类号： H01L25/16 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5387 ,  H01L24/50 ,  H01L24/86 ,  H01L25/00 ,  H01L25/0655 ,  H01L2224/0405 ,  H01L2224/04105 ,  H01L2224/05568 ,  H01L2224/056 ,  H01L2224/05647 ,  H01L2224/29078 ,  H01L2224/86203 ,  H01L2224/86815 ,  H05K1/185 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/014

摘要： A microelectronic package of the present description may comprises a first microelectronic device having at least one row of connection structures electrically connected thereto and a second microelectronic device having at least one row of connection structures electrically connected thereto, wherein the connection structures within the at least one first microelectronic device row are aligned with corresponding connection structures within the at least one second microelectronic device row in an x-direction. An interconnect comprising an interconnect substrate having a plurality of electrically isolated conductive traces extending in the x-direction on a first surface of the interconnect substrate may be attached to the at least one first microelectronic device connection structure row and the at least one second microelectronic device connection structure row, such that at least one interconnect conductive trace forms a connection between a first microelectronic device connection structure and its corresponding second microelectronic device connection structure.

摘要翻译： 本说明书的微电子封装可以包括具有与其电连接的至少一行连接结构的第一微电子器件和具有与其电连接的至少一排连接结构的第二微电子器件，其中所述至少一个 第一微电子器件行与X方向上的至少一个第二微电子器件行内的对应连接结构对准。 包括具有在互连衬底的第一表面上沿x方向延伸的多个电隔离导电迹线的互连衬底的互连可以附接到所述至少一个第一微电子器件连接结构行和所述至少一个第二微电子器件 连接结构行，使得至少一个互连导电迹线形成第一微电子器件连接结构与其对应的第二微电子器件连接结构之间的连接。

公开(公告)号：US20130187259A1

公开(公告)日：2013-07-25

申请号：US13354089

申请日：2012-01-19

申请人： Ivan Nikitin ,  Joachim Mahler

发明人： Ivan Nikitin ,  Joachim Mahler

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/3185 ,  H01L24/32 ,  H01L24/50 ,  H01L24/86 ,  H01L2224/32245 ,  H01L2224/86203 ,  H01L2224/86801 ,  H01L2224/8685 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1461

摘要： An electronic device includes a semiconductor chip. A contact element, an electrical connector, and a dielectric layer are disposed on a first surface of a conductive layer facing the semiconductor chip. A first conductive member is disposed in a first recess of the dielectric layer. The first conductive member electrically connects the contact element of the semiconductor chip with the conductive layer. A second conductive member is disposed in a second recess of the dielectric layer. The second conductive member electrically connects the conductive layer with the electrical connector.

摘要翻译： 电子设备包括半导体芯片。 接触元件，电连接器和电介质层设置在面向半导体芯片的导电层的第一表面上。 第一导电构件设置在电介质层的第一凹部中。 第一导电构件将半导体芯片的接触元件与导电层电连接。 第二导电构件设置在电介质层的第二凹部中。 第二导电构件将导电层与电连接器电连接。

公开(公告)号：US08263438B2

公开(公告)日：2012-09-11

申请号：US12984090

申请日：2011-01-04

申请人： Alvin Seah ,  Elstan Anthony Fernandez

发明人： Alvin Seah ,  Elstan Anthony Fernandez

IPC分类号： H01L21/00 ,  H01L23/34 ,  H05K3/10 ,  H05K1/00

CPC分类号： H01L25/50 ,  H01L23/49572 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/86 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/48145 ,  H01L2224/49171 ,  H01L2224/50 ,  H01L2224/73265 ,  H01L2224/86203 ,  H01L2224/86205 ,  H01L2224/92247 ,  H01L2225/06579 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T29/49155 ,  Y10T29/49162 ,  Y10T29/49169 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a substrate, a die assembly attachable to the substrate and a flexible strip extending over the substrate and the die assembly. The flexible strip has one or more routing circuits carried thereon. The die assembly and the substrate are arranged to be electrically connected through the one or more routing circuits carried on the flexible strip.

摘要翻译： 半导体器件包括衬底，可附着于衬底的模具组件和在衬底和模具组件上延伸的柔性条带。 柔性条具有一个或多个在其上承载的路由电路。 芯片组件和基板被布置成通过柔性条带上承载的一个或多个路由电路电连接。

公开(公告)号：US20150163904A1

公开(公告)日：2015-06-11

申请号：US14102757

申请日：2013-12-11

申请人： Intel Corporation

发明人： Omkar G. Karhade ,  John S. Guzek ,  Johanna M. Swan ,  Christopher J. Nelson ,  Nitin A. Deshpande ,  William J. Lambert ,  Charles A. Gealer ,  Feras Eid ,  Islam A. Salama ,  Kemal Aygun ,  Sasha N. Oster ,  Tyler N. Osborn

IPC分类号： H05K1/11 ,  H05K1/18 ,  H05K3/40 ,  G06F1/18

CPC分类号： H01L25/16 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5387 ,  H01L24/50 ,  H01L24/86 ,  H01L25/00 ,  H01L25/0655 ,  H01L2224/0405 ,  H01L2224/04105 ,  H01L2224/05568 ,  H01L2224/056 ,  H01L2224/05647 ,  H01L2224/29078 ,  H01L2224/86203 ,  H01L2224/86815 ,  H05K1/185 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/014

摘要： A microelectronic package of the present description may comprises a first microelectronic device having at least one row of connection structures electrically connected thereto and a second microelectronic device having at least one row of connection structures electrically connected thereto, wherein the connection structures within the at least one first microelectronic device row are aligned with corresponding connection structures within the at least one second microelectronic device row in an x-direction. An interconnect comprising an interconnect substrate having a plurality of electrically isolated conductive traces extending in the x-direction on a first surface of the interconnect substrate may be attached to the at least one first microelectronic device connection structure row and the at least one second microelectronic device connection structure row, such that at least one interconnect conductive trace forms a connection between a first microelectronic device connection structure and its corresponding second microelectronic device connection structure.

摘要翻译： 本说明书的微电子封装可以包括具有与其电连接的至少一行连接结构的第一微电子器件和具有与其电连接的至少一排连接结构的第二微电子器件，其中所述至少一个 第一微电子器件行与X方向上的至少一个第二微电子器件行内的对应连接结构对准。 包括具有在互连衬底的第一表面上沿x方向延伸的多个电隔离导电迹线的互连衬底的互连可以附接到所述至少一个第一微电子器件连接结构行和所述至少一个第二微电子器件 连接结构行，使得至少一个互连导电迹线形成第一微电子器件连接结构与其对应的第二微电子器件连接结构之间的连接。

公开(公告)号：US09018742B2

公开(公告)日：2015-04-28

申请号：US13354089

申请日：2012-01-19

申请人： Ivan Nikitin ,  Joachim Mahler

发明人： Ivan Nikitin ,  Joachim Mahler

IPC分类号： H01L23/495 ,  H01L23/528 ,  H01L23/532 ,  H01L21/60 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L23/3185 ,  H01L24/32 ,  H01L24/50 ,  H01L24/86 ,  H01L2224/32245 ,  H01L2224/86203 ,  H01L2224/86801 ,  H01L2224/8685 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1461

摘要： An electronic device includes a semiconductor chip. A contact element, an electrical connector, and a dielectric layer are disposed on a first surface of a conductive layer facing the semiconductor chip. A first conductive member is disposed in a first recess of the dielectric layer. The first conductive member electrically connects the contact element of the semiconductor chip with the conductive layer. A second conductive member is disposed in a second recess of the dielectric layer. The second conductive member electrically connects the conductive layer with the electrical connector.

摘要翻译： 电子设备包括半导体芯片。 接触元件，电连接器和电介质层设置在面向半导体芯片的导电层的第一表面上。 第一导电构件设置在电介质层的第一凹部中。 第一导电构件将半导体芯片的接触元件与导电层电连接。 第二导电构件设置在电介质层的第二凹部中。 第二导电构件将导电层与电连接器电连接。

公开(公告)号：US20070040251A1

公开(公告)日：2007-02-22

申请号：US11485194

申请日：2006-07-12

申请人： Alvin Seah ,  Elstan Fernandez

发明人： Alvin Seah ,  Elstan Fernandez

IPC分类号： H01L23/495

CPC分类号： H01L25/50 ,  H01L23/49572 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/86 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/48145 ,  H01L2224/49171 ,  H01L2224/50 ,  H01L2224/73265 ,  H01L2224/86203 ,  H01L2224/86205 ,  H01L2224/92247 ,  H01L2225/06579 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T29/49155 ,  Y10T29/49162 ,  Y10T29/49169 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a substrate, a die assembly attachable to the substrate and a flexible strip extending over the substrate and the die assembly. The flexible strip has one or more routing circuits carried thereon. The die assembly and the substrate are arranged to be electrically connected through the one or more routing circuits carried on the flexible strip.

摘要翻译： 半导体器件包括衬底，可附着于衬底的模具组件和在衬底和模具组件上延伸的柔性条带。 柔性条具有一个或多个在其上承载的路由电路。 芯片组件和基板被布置成通过柔性条带上承载的一个或多个路由电路电连接。