公开(公告)号：US20250093413A1

公开(公告)日：2025-03-20

申请号：US18963838

申请日：2024-11-29

Applicant: Intel Corporation

Inventor： Zhen ZHOU ,  Renzhi LIU ,  Jong-Ru GUO ,  Kenneth P. FOUST ,  Jason A. MIX ,  Kai XIAO ,  Zuoguo WU ,  Daqiao DU

IPC: G01R31/302 ,  G01R31/28 ,  G01R31/303 ,  H01P3/08 ,  H01Q9/16 ,  H04B5/48

Abstract: A high volume manufacturing (HVM) test system including a test device defining an opening configured to receive a package under test, the test device including an external access agent (EAA) including: a first leaky surface wave launcher for near field wireless communication, the first leaky surface wave launcher configured to wirelessly provide sideband signals to and wirelessly receive the sideband signals from a silicon package agent physically positioned in a separate package as the EAA; and a first transceiver electrically coupled to the first leaky surface wave launcher, the first transceiver configured to: process the sideband signals received by the first leaky surface wave launcher; and generate the sideband signals for wireless transmission by the first leaky surface wave launcher.

公开(公告)号：US20250004121A1

公开(公告)日：2025-01-02

申请号：US18885758

申请日：2024-09-16

Applicant: INTEL CORPORATION

Inventor： Arnaud AMADJIKPE ,  Timo Sakari HUUSARI ,  Tae Young YANG ,  Hossein ALAVI ,  Steven CALLENDER ,  Bradley JACKSON ,  Ofer MARKISH ,  Woorim SHIN ,  Shengbo XU ,  Zhen ZHOU ,  Wei QIAN ,  Mengyuan HUANG

IPC: G01S13/42 ,  G01S7/35 ,  G01S13/89

Abstract: Disclosed herein is a lens antenna system that includes a reconfigurable aperture configured to receive a source beam. The reconfigurable aperture also provides an output beam based on a surface impedance distribution of the reconfigurable aperture and the received source beam. The control device is operatively coupled to the reconfigurable aperture, wherein the control device is configured to control the surface impedance distribution of the reconfigurable aperture to configure and reconfigure a beam pattern of the output beam. A plurality of antenna elements may be physically positioned proximate the reconfigurable aperture, wherein the plurality of antennas may be configured to generate the source beam.

公开(公告)号：US20240222859A1

公开(公告)日：2024-07-04

申请号：US18147768

申请日：2022-12-29

Applicant: Intel Corporation

Inventor： Tae Young YANG ,  Zhen ZHOU ,  Shuhei YAMADA ,  Tolga ACIKALIN ,  Kenneth P. FOUST ,  Bryce D. HORINE

IPC: H01Q1/52 ,  H01Q1/22 ,  H01Q17/00 ,  H01Q19/10

CPC classification number: H01Q1/526 ,  H01Q1/2291 ,  H01Q17/00 ,  H01Q19/10

Abstract: An apparatus may include a substrate including: a first antenna configured to form a first short range wireless interconnection with a first antenna of a further substrate, a second antenna spaced apart from the first antenna, the second antenna is configured to form a second short range wireless interconnection with a second antenna of the further substrate, and a metamaterial configured to form a surface with effective negative permeability within a space formed between a surface of the substrate and a surface of the further substrate for an established short range wireless interconnection of the first short range wireless interconnection and the second short range wireless interconnection.

公开(公告)号：US20240113438A1

公开(公告)日：2024-04-04

申请号：US17955551

申请日：2022-09-29

Applicant: Intel Corporation

Inventor： Zhen ZHOU ,  Shuhei YAMADA ,  Renzhi LIU ,  Tae Young YANG ,  Tolga ACIKALIN ,  Kenneth P. FOUST

IPC: H01Q9/16

CPC classification number: H01Q9/16

Abstract: A package-to-package communication system is provided including a first package having integrated on a first substrate a first antenna, a second antenna, and a first transceiver coupled to the first antenna and the second antenna. The first antenna is arranged along a first edge of the first substrate. The second antenna is arranged along a second edge of the first substrate. A second package having integrated on a second substrate a third antenna, a fourth antenna and a second transceiver coupled to the third antenna and the fourth antenna. The third antenna is arranged along a third edge of the second substrate. The fourth antenna is arranged along a fourth edge of the second substrate. The first antenna and the third antenna are configured to communicate signals of a vertical polarization. The second antenna and the fourth antenna are configured to communicate signals of a horizontal polarization.

公开(公告)号：US20190043796A1

公开(公告)日：2019-02-07

申请号：US16017710

申请日：2018-06-25

Applicant: Intel Corporation

Inventor： Zhen ZHOU ,  Jun LIAO ,  Xiang LI ,  Kevin STONE ,  Tom DU ,  Tae-Young YANG ,  Ling ZHENG ,  James A. McCALL

IPC: H01L23/498 ,  H01R12/71 ,  H01R12/52 ,  H01R43/20 ,  H01R43/16 ,  H01R12/57

Abstract: An apparatus is described. The apparatus includes an electro-mechanical interface having angled signal interconnects, wherein, the angling of the signal interconnects is to reduce noise coupling between the angled signal interconnects.

公开(公告)号：US20170187133A1

公开(公告)日：2017-06-29

申请号：US14757972

申请日：2015-12-23

Applicant: Intel Corporation

Inventor： Anne M. SEPIC ,  Zhen ZHOU ,  Evan M. FLEDELL

IPC: H01R12/70 ,  H05K3/30

CPC classification number: H05K7/1069 ,  G01R1/0466 ,  H01R12/7076 ,  H01R12/7082 ,  H01R23/6806 ,  H05K1/181 ,  H05K3/301 ,  H05K7/1023 ,  H05K7/1038 ,  H05K7/1061 ,  H05K2201/10325 ,  H05K2201/2018

Abstract: Techniques and mechanisms for providing socket connection to a substrate. In an embodiment, a socket device includes a first socket body portion that is to provide for signal exchanges as part of a socket connector including the first socket body portion and a second socket body portion. The first socket body portion and the second socket body portion comprise respective zones, wherein, of the two zones, only one such zone has a first electro-mechanical characteristic. The first electro-mechanical characteristic is selected from the group consisting of an interconnect dimension, an interconnect material, an interconnect structure, a socket body material, and a shielding structure. In another embodiment, modular socket sub-assemblies each comprise a respective one of the first zone and the second zone.