公开(公告)号：US11901618B2

公开(公告)日：2024-02-13

申请号：US17929907

申请日：2022-09-06

Applicant: InnoLux Corporation

Inventor： Chia-Ping Tseng ,  Ker-Yih Kao ,  Chia-Chi Ho ,  Ming-Yen Weng ,  Hung-I Tseng ,  Shu-Ling Wu ,  Huei-Ying Chen

IPC: H01Q1/38 ,  H01Q3/44 ,  H01Q9/04 ,  H01L27/12 ,  H01L21/04 ,  H01Q3/34 ,  G02F1/1343 ,  G02F1/1333

CPC classification number: H01Q1/38 ,  G02F1/13439 ,  H01L21/045 ,  H01L27/1237 ,  H01Q3/34 ,  H01Q3/44 ,  H01Q9/0407 ,  G02F1/133345 ,  G02F2201/07

Abstract: An electronic device is provided. The electronic device includes a first substrate, a multilayer structure, and a passivation layer. The multilayer structure is disposed on the first substrate. The multilayer structure includes a first conductive layer and a second conductive layer disposed on the first conductive layer. The passivation layer is disposed on the second conductive layer. In addition, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the passivation layer.

公开(公告)号：US20230352595A1

公开(公告)日：2023-11-02

申请号：US18186965

申请日：2023-03-21

Applicant: Innolux Corporation

Inventor： Shu-Ling Wu ,  Chia-Ping Tseng

IPC: H01L29/786 ,  H01L27/12 ,  H01L25/065

CPC classification number: H01L29/78663 ,  H01L27/124 ,  H01L25/0657 ,  H01L25/167

Abstract: A manufacturing method of an electronic device is provided, which includes following steps. A substrate is provided. A conductive layer is formed on the substrate. A circuit structure is formed on the conductive layer. The circuit structure is patterned to form at least one opening. The at least one opening has a stepped profile. An electronic device is also provided.

公开(公告)号：US20230335563A1

公开(公告)日：2023-10-19

申请号：US18183955

申请日：2023-03-15

Applicant: Innolux Corporation

Inventor： Chia-Ping Tseng

IPC: H01L27/12 ,  H01L23/00 ,  H01L25/18 ,  H01L25/16

CPC classification number: H01L27/124 ,  H01L24/13 ,  H01L24/16 ,  H01L25/18 ,  H01L25/16 ,  H01L2924/12034 ,  H01L2924/1426 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/13021 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2924/0132 ,  H01L2224/13582 ,  H01L2224/1357 ,  H01L27/1225 ,  H01L27/1255 ,  H01L2224/16145

Abstract: An electronic device including a substrate, a first conductive layer, a first insulating layer, a second conductive layer, a second insulating layer, a bonding structure, and a chip is provided. The first conductive layer is disposed on the substrate. The first insulating layer is disposed on the first conductive layer and has a first via. The second conductive layer is disposed on the first insulating layer, wherein the second conductive layer is electrically connected to the first conductive layer through the first via. The second insulating layer is disposed on the second conductive layer and has a second via. The bonding structure is disposed on the second insulating layer, wherein the bonding structure is electrically connected to the second conductive layer through the second via. The chip is disposed on the bonding structure.

公开(公告)号：US20230187594A1

公开(公告)日：2023-06-15

申请号：US17991779

申请日：2022-11-21

Applicant: Innolux Corporation

Inventor： Chia-Ping Tseng ,  Chia-Chi Ho

IPC: H01L33/62 ,  H01L33/56

CPC classification number: H01L33/62 ,  H01L33/56

Abstract: The disclosure provides an electronic device including a substrate, at least one conductive composite structure, and an electronic element. The at least one conductive composite structure is disposed on the substrate. The at least one conductive composite structure includes a first metal layer, a second metal layer, and a third metal layer. The second metal layer is located between the first metal layer and the third metal layer, and the thickness of the second metal layer ranges from 0.5 μm to 12 μm. The electronic element is disposed on the at least one conductive composite structure and bonded to the at least one conductive composite structure.

公开(公告)号：US20230170603A1

公开(公告)日：2023-06-01

申请号：US17975566

申请日：2022-10-27

Applicant: Innolux Corporation

Inventor： Chung-Chun Cheng ,  Chia-Chi Ho ,  Chia-Ping Tseng ,  Yan-Zheng Wu ,  Yao-Wen Hsu

IPC: H01Q1/22 ,  H01Q1/38

CPC classification number: H01Q1/2283 ,  H01Q1/38

Abstract: An electronic device including a substrate, a first metal pattern, a first insulating pattern, and a second metal pattern is provided. The first metal pattern is disposed on the substrate. The first insulating pattern is disposed on the first metal pattern. The second metal pattern is disposed on the first metal pattern and the first insulating pattern. The second metal pattern includes a first contact portion and a second contact portion. In a cross-sectional view, the first contact portion and the second contact portion are in contact with the first metal pattern, and the first insulating pattern is in contact with the first metal pattern and the second metal pattern between the first contact portion and the second contact portion.

公开(公告)号：US10952318B2

公开(公告)日：2021-03-16

申请号：US16504884

申请日：2019-07-08

Applicant: InnoLux Corporation

Inventor： Po-Yun Hsu ,  Ker-Yih Kao ,  Chia-Ping Tseng

IPC: H01K3/10 ,  H05K1/03 ,  H05K3/00 ,  H05K1/05

Abstract: An electronic device and a method for manufacturing the same are disclosed. The method for manufacturing the electronic device includes the following steps: providing a substrate; forming a metal layer on the substrate, wherein the metal layer has a first surface; forming a first insulating layer on the first surface of the metal layer; forming a second insulating layer on the first insulating layer; etching the first insulating layer and the second insulating layer to form a contact hole, wherein the contact hole exposes a portion of the first surface; cleaning the portion of the first surface exposed by the contact hole with a solution; and forming a transparent conductive layer on the second insulating layer, wherein the transparent conductive layer electrically connects with the metal layer.

公开(公告)号：US12166033B2

公开(公告)日：2024-12-10

申请号：US17513865

申请日：2021-10-28

Applicant: Innolux Corporation

Inventor： Chin-Lung Ting ,  Jen-Hai Chi ,  Chia-Ping Tseng ,  Chen-Lin Yeh ,  Chung-Kuang Wei ,  Cheng-Hsu Chou

IPC: H01L27/06 ,  H01L29/778 ,  H01L29/93

Abstract: The disclosure provides an electronic device. The electronic device includes a substrate, a transistor, and a variable capacitor. The transistor is disposed on the substrate. The variable capacitor is disposed on the substrate and adjacent to the transistor. A material of the transistor and a material of the variable capacitor both a include a III-V semiconductor material. The electronic device of an embodiment of the disclosure may simplify manufacturing process, reduce costs, or reduce dimensions.

公开(公告)号：US12125829B2

公开(公告)日：2024-10-22

申请号：US18093331

申请日：2023-01-05

Applicant: InnoLux Corporation

Inventor： Jen-Hai Chi ,  Chia-Ping Tseng ,  Chen-Lin Yeh ,  Yan-Zheng Wu

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H01L23/66 ,  H01L25/07

CPC classification number: H01L25/072 ,  H01L23/3121 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/66 ,  H01L24/16 ,  H01L2223/6677 ,  H01L2224/16227

Abstract: An electronic device includes a carrier, a plurality of electronic elements and a connecting terminal. The carrier has at least one bonding pad. The electronic elements are disposed on the carrier, and each of the electronic elements includes a substrate. A distance between two adjacent substrates of the electronic elements is not less than 300 μm. The connecting terminal is disposed between one of the substrate and the carrier. One of the electronic elements are electrically connected to the at least one bonding pad via the connecting terminal.

公开(公告)号：US20240297168A1

公开(公告)日：2024-09-05

申请号：US18663100

申请日：2024-05-14

Applicant: Innolux Corporation

Inventor： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC: H01L27/06 ,  H01L21/8234 ,  H01L23/522 ,  H01L23/538 ,  H01L29/93

CPC classification number: H01L27/0629 ,  H01L21/823475 ,  H01L23/5223 ,  H01L29/93 ,  H01L23/5385 ,  H01L27/0694

Abstract: The disclosure provides an electronic apparatus. The electronic apparatus includes an insulator, a driving unit, an electronic unit, and a circuit unit. The driving unit is overlapped with the insulator. The electronic unit is overlapped with the insulator. The circuit unit is electrically connected to the driving unit. The driving unit receives a signal from the circuit unit and drives the electronic unit.

公开(公告)号：US20230131442A1

公开(公告)日：2023-04-27

申请号：US17956846

申请日：2022-09-30

Applicant: Innolux Corporation

Inventor： Yi-Hung Lin ,  Hsiu-Yi Tsai ,  Chia-Ping Tseng ,  Chia-Chi Ho

IPC: H01L27/12

Abstract: An electronic device includes a substrate, a driving element, a conductive layer, and an electronic element is provided. The driving element is disposed on the substrate. The conductive layer is disposed on the substrate, wherein there is a first distance (B) between the driving element and an edge of the conductive layer. The electronic element is disposed on the conductive layer and is electrically connected to the driving element, wherein there is a second distance (A) between the electronic element and the edge of the conductive layer, and the first distance (B) is greater than the second distance (A).