公开(公告)号：US10909914B2

公开(公告)日：2021-02-02

申请号：US16131123

申请日：2018-09-14

Applicant: InnoLux Corporation

Inventor： Geng-Fu Chang ,  Jui-Feng Ko ,  Tsau-Hua Hsieh ,  Chun-Hsien Lin ,  Jian-Jung Shih

IPC: G09G3/30 ,  G09G3/3225 ,  H01L27/15 ,  G09G3/20 ,  H01L27/32

Abstract: A semiconductor device includes a first display unit and a second display unit. The first display unit includes a first substrate, first light-emitting units, and a first gate driver circuit. The first substrate includes a first display region. The first substrate has a first side and a second side. The first light-emitting units are disposed in the first display region. The first gate driver circuit is disposed in the first display region. The second display unit is adjacent to the first display unit. The second display unit includes a second substrate. The second substrate includes a second display region, second light-emitting units, and a second gate driver circuit. The second substrate has a third side and a fourth side. The second light-emitting units are disposed in the second display region. A second gate driver circuit is disposed in the second display region.

公开(公告)号：US10446604B2

公开(公告)日：2019-10-15

申请号：US15629766

申请日：2017-06-22

Applicant: Innolux Corporation

Inventor： Kuo-Chang Chiang ,  Jui-Feng Ko ,  Tsau-Hua Hsieh

IPC: H01L27/15 ,  H01L33/62 ,  H01L25/07 ,  H01L33/00 ,  H01L33/06 ,  H01L25/075

Abstract: A display apparatus and a fabricating method for a display apparatus are provided. The fabricating method for the display apparatus includes the following steps. An array substrate having a first electrode and a second electrode is provided. A first light emitting diode is heated to soften a first bump between the first electrode and the first light emitting diode, the first light emitting diode is bonded onto the first electrode by the first bump. The first light emitting diode and a second light emitting diode are heated to soften the first bump and a second bump between the second electrode and the second light emitting diode, the second light emitting diode is bonded onto the second electrode by the second bump, and the first light emitting diode and the second light emitting diode are pressed.

公开(公告)号：US11949040B2

公开(公告)日：2024-04-02

申请号：US17725732

申请日：2022-04-21

Applicant: InnoLux Corporation

Inventor： Kai Cheng ,  Tsau-Hua Hsieh ,  Fang-Ying Lin ,  Tung-Kai Liu ,  Hui-Chieh Wang ,  Chun-Hsien Lin ,  Jui-Feng Ko

IPC: H01L33/00 ,  H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L33/32

CPC classification number: H01L33/0093 ,  H01L33/0095 ,  H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/0075 ,  H01L33/32 ,  H01L2933/0066

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of diodes on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of diodes from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of diodes from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of diodes from the third substrate to the fourth substrate. The pitch between the plurality of diodes on the first substrate is different from the pitch of the first pattern array.

公开(公告)号：US20240094787A1

公开(公告)日：2024-03-21

申请号：US18522044

申请日：2023-11-28

Applicant: Innolux Corporation

Inventor： Wan-Ling Huang ,  Jian-Jung Shih ,  Jui-Feng Ko ,  Tsau-Hua Hsieh

IPC: G06F1/18 ,  G09F9/302

CPC classification number: G06F1/189 ,  G06F1/182 ,  G09F9/3026

Abstract: A manufacturing method of a tiling electronic device includes the following steps. A first electronic panel is provided. The first electronic panel includes multiple first bumps and multiple first conducting lines, and the first bumps and the first conducting lines are disposed on a side surface of the first electronic panel. A second electronic panel is provided. The second electronic panel includes multiple second bumps and multiple second conducting lines, and the second bumps and the second conducting lines are disposed on a side surface of the second electronic panel. The first electronic panel and the second electronic panel are coupled through the first bumps and the second bumps. Multiple conducting elements are formed, so that the first conducting lines are electrically connected with the second conducting lines through the conducting elements after the first electronic panel and the second electronic panel are coupled.

公开(公告)号：US11528832B2

公开(公告)日：2022-12-13

申请号：US17180878

申请日：2021-02-22

Applicant: InnoLux Corporation

Inventor： Wan-Ling Huang ,  Tzu-Yuan Lin ,  Geng-Fu Chang ,  Chun-Hsien Lin ,  Shu-Ming Kuo ,  Jui-Feng Ko ,  Tsau-Hua Hsieh

IPC: H05K7/20 ,  H05K1/18 ,  H05K5/00 ,  H05K1/14

Abstract: An electronic device is provided, which is for coupling to another electronic device in a side-by-side manner, and the electronic device includes a substrate, a first thermal dissipation sheet and a thermal dissipation element. The substrate includes a first surface and a second surface. The first thermal dissipation sheet is disposed on the first surface. The thermal dissipation element is disposed on the substrate. The first thermal dissipation sheet is disposed between the thermal dissipation element and the substrate, and the thermal dissipation element at least partially overlaps the first thermal dissipation sheet.

公开(公告)号：US11527217B2

公开(公告)日：2022-12-13

申请号：US15631123

申请日：2017-06-23

Applicant: InnoLux Corporation

Inventor： Geng-Fu Chang ,  Tsau-Hua Hsieh ,  Jui-Feng Ko ,  Tung-Kai Liu ,  Hirofumi Watsuda

IPC: G09G5/10 ,  H01L31/16 ,  H01L27/02 ,  G09G3/32 ,  H01L25/16 ,  H01L33/62 ,  H01L27/12 ,  G09G3/3233 ,  G09G3/3283

Abstract: A display panel including a first current source and a first pixel unit is provided. The first pixel unit includes a first switch and a first light-emitting diode. The first switch is coupled to the first current source and receives a first scan signal. When the first scan signal is enabled, the first switch is turned on and receives a first current provided by the first current source. The first light-emitting diode is coupled to the first switch. When the first switch is turned on, the first current passes through the first light-emitting diode to turn on the first light-emitting diode.

公开(公告)号：US10651352B2

公开(公告)日：2020-05-12

申请号：US16129197

申请日：2018-09-12

Applicant: InnoLux Corporation

Inventor： Chun-Hsien Lin ,  Geng-Fu Chang ,  Jui-Feng Ko ,  Tsau-Hua Hsieh ,  Shu-Ming Kuo

IPC: H01L33/00 ,  H01L33/50 ,  H01L25/16 ,  H01L33/48 ,  H01L31/16 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/0352 ,  H01L31/12 ,  H01L31/0304 ,  H01L31/173 ,  H01L31/153 ,  H01L33/32 ,  H01L33/06

Abstract: A display device is provided. The display device includes a plurality of pixels. At least one of the pixels includes a semiconductor device having a light-emitting area, a first light conversion layer disposed on the semiconductor device and a first scattering layer disposed on the semiconductor device. The first scattering layer is disposed on the first light conversion layer.