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公开(公告)号:US11004753B2
公开(公告)日:2021-05-11
申请号:US16244484
申请日:2019-01-10
Applicant: InnoLux Corporation
Inventor: Tung-Kai Liu , Tsau-Hua Hsieh , Wei-Cheng Chu , Chun-Hsien Lin , Chandra Lius , Ting-Kai Hung , Kuan-Feng Lee , Ming-Chang Lin , Tzu-Min Yan , Hui-Chieh Wang
IPC: G06F1/00 , H01L21/66 , H01L33/62 , H01L25/16 , H01L27/12 , H01L33/38 , H01L21/288 , H01L21/67 , B65G43/08 , G01R31/26 , H01L33/00 , G09G3/32 , H01L25/075 , H01L33/50
Abstract: A display device includes a substrate, a light-emitting element, and a transistor. The substrate has a top surface. The light-emitting element is disposed on the substrate. The transistor is disposed on the substrate, and includes a drain electrode, a gate electrode, and a semiconductor layer. The drain electrode is electrically connected to the light-emitting element. The semiconductor layer includes an overlapping portion overlapped with the gate electrode. The light-emitting element does not overlap with the overlapping portion along a direction perpendicular to the top surface of the substrate.
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公开(公告)号:US10886259B2
公开(公告)日:2021-01-05
申请号:US16410114
申请日:2019-05-13
Applicant: InnoLux Corporation
Inventor: Yuan-Lin Wu , Kuan-Feng Lee , Wei-Cheng Chu
IPC: H01L25/075 , H01L33/38 , H01L33/20 , H01L33/58 , H01L33/62
Abstract: A display device is provided. The display device includes a substrate having a surface including a display area and a non-display area adjacent to the display area; a plurality of light-emitting diodes disposed on the display area of the substrate, wherein the light-emitting diode includes a contact electrode; and an anisotropic conductive layer disposed between the substrate and the plurality of light-emitting diodes, wherein the anisotropic conductive layer has a cross-sectional sidewall profile, and at least a part of the cross-sectional sidewall profile of the anisotropic conductive layer is in a shape of curve.
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公开(公告)号:US10217678B2
公开(公告)日:2019-02-26
申请号:US15617191
申请日:2017-06-08
Applicant: InnoLux Corporation
Inventor: Tung-Kai Liu , Tsau-Hua Hsieh , Wei-Cheng Chu , Chun-Hsien Lin , Chandra Lius , Ting-Kai Hung , Kuan-Feng Lee , Ming-Chang Lin , Tzu-Min Yan , Hui-Chieh Wang
IPC: G02F1/00 , H01L21/66 , H01L33/62 , H01L25/16 , H01L27/12 , H01L33/38 , H01L21/288 , H01L33/00 , H01L21/67 , B65G43/08 , G01R31/26 , G09G3/32
Abstract: A display device includes a substrate, a first transistor, a second transistor and a conductive connection portion disposed on the substrate. The first transistor is electrically connected to the gate electrode of the second transistor through the conductive connection portion. An insulating layer is disposed on the conductive connection portion. A pixel electrode is disposed on the insulating layer and is electrically connected to the second transistor. The pixel electrode is at least partially overlapped with the conductive connection portion. A light-emitting element is disposed on the pixel electrode. The conductive connection portion and the pixel electrode form a capacitor. The capacitor has an equivalent permittivity and a thickness. The ratio of the equivalent permittivity to the thickness is in a range from 0.4*(1E+5)F/m^2 to 296.48*(1E+5)F/m^2.
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公开(公告)号:US20180270961A1
公开(公告)日:2018-09-20
申请号:US15917860
申请日:2018-03-12
Applicant: Innolux Corporation
Inventor: Wei-Cheng Chu , Chia-Cheng Liu , Chih-Yuan Lee , Chin-Lung Ting , Tong-Jung Wang
IPC: H05K3/32 , H05K1/02 , H05K1/11 , H05K1/18 , H05K3/06 , H05K3/46 , H05K3/36 , H05K1/14 , G02F1/1345
CPC classification number: H05K3/32 , G02F1/13452 , G02F1/13458 , H05K1/028 , H05K1/111 , H05K1/14 , H05K1/181 , H05K1/189 , H05K3/06 , H05K3/323 , H05K3/361 , H05K3/4644 , H05K2201/0367 , H05K2201/10378 , H05K2203/0502
Abstract: A display device is provided. The display device includes a display panel, a flexible circuit board, an integrated circuit, and a conductive layer. The flexible circuit board is electrically connected with the display panel and includes a plurality of conductive wires. The integrated circuit is disposed on the flexible circuit board and has a plurality of bumps. The conductive layer is disposed between the integrated circuit and the flexible circuit board and covers a periphery of the integrated circuit. In addition, the conductive layer includes an adhesive and a plurality of conductive particles distributed in the adhesive. Moreover, the bumps are electrically connected with the conductive wires through the conductive particles.
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公开(公告)号:US11978678B2
公开(公告)日:2024-05-07
申请号:US17817715
申请日:2022-08-05
Applicant: InnoLux Corporation
Inventor: Tung-Kai Liu , Tsau-Hua Hsieh , Wei-Cheng Chu , Chun-Hsien Lin , Chandra Lius , Ting-Kai Hung , Kuan-Feng Lee , Ming-Chang Lin , Tzu-Min Yan , Hui-Chieh Wang
IPC: G09G3/32 , B65G43/08 , G01R31/26 , H01L21/288 , H01L21/66 , H01L21/67 , H01L25/16 , H01L27/12 , H01L33/00 , H01L33/38 , H01L33/50 , H01L33/62 , H01L25/075
CPC classification number: H01L22/20 , B65G43/08 , G01R31/26 , H01L21/288 , H01L21/67144 , H01L25/167 , H01L27/124 , H01L27/1248 , H01L27/1255 , H01L27/1259 , H01L27/1262 , H01L33/0093 , H01L33/38 , H01L33/505 , H01L33/62 , G09G3/32 , G09G2300/0426 , H01L22/14 , H01L25/0753 , H01L33/50 , H01L2933/0066
Abstract: A display device includes a first substrate, a light-emitting element, a light conversion layer, and a color filter layer. The light-emitting element is disposed on the first substrate. The light conversion layer is disposed on the light-emitting element. In addition, the color filter layer is overlapped the light-emitting element and the light conversion layer.
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公开(公告)号:US11437288B2
公开(公告)日:2022-09-06
申请号:US17228911
申请日:2021-04-13
Applicant: InnoLux Corporation
Inventor: Tung-Kai Liu , Tsau-Hua Hsieh , Wei-Cheng Chu , Chun-Hsien Lin , Chandra Lius , Ting-Kai Hung , Kuan-Feng Lee , Ming-Chang Lin , Tzu-Min Yan , Hui-Chieh Wang
IPC: H01L33/62 , H01L21/66 , H01L25/16 , H01L27/12 , H01L33/38 , H01L21/288 , H01L21/67 , B65G43/08 , G01R31/26 , H01L33/00 , G09G3/32 , H01L25/075 , H01L33/50
Abstract: A display device includes a substrate, a light-emitting element, and a transistor. The substrate has a top surface. The light-emitting element is disposed on the substrate, and includes a first electrode and a second electrode. The transistor is disposed on the substrate and electrically connected to the light-emitting element. The transistor includes a gate electrode and a semiconductor layer. The semiconductor layer includes an overlapping portion overlapped with the gate electrode. The first electrode and the second electrode of the light-emitting element do not overlap with the overlapping portion along a direction perpendicular to the top surface of the substrate.
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公开(公告)号:US11380661B2
公开(公告)日:2022-07-05
申请号:US16902463
申请日:2020-06-16
Applicant: InnoLux Corporation
Inventor: Wei-Cheng Chu , Ming-Fu Jiang , Chia-Cheng Liu , Chih-Yuan Lee
IPC: H01L25/16 , H01L33/58 , H01L25/075 , H01L33/62 , H01L33/52
Abstract: A display device is provided. The display device includes a substrate having a first surface and a second surface opposite to the first surface, a plurality of light-emitting units disposed on the first surface of the substrate, and a plurality of conductive structures extending into the substrate from the second surface of the substrate. The plurality of conductive structures are electrically connected to the plurality of light-emitting units.
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公开(公告)号:US10820425B2
公开(公告)日:2020-10-27
申请号:US16446653
申请日:2019-06-20
Applicant: Innolux Corporation
Inventor: Wei-Cheng Chu , Chia-Cheng Liu , Chih-Yuan Lee , Chin-Lung Ting , Tong-Jung Wang
IPC: H05K1/00 , H05K1/02 , H05K1/18 , H05K3/30 , H05K3/32 , H05K3/36 , H01L21/02 , H01L21/44 , H01L23/48 , H01L23/498 , H01J17/02 , H01J17/34 , H05K1/11 , H05K3/06 , H05K1/14 , G02F1/1345 , H05K3/46
Abstract: A display device is provided. The display device includes a display panel, a flexible circuit board, an integrated circuit, and a conductive layer. The flexible circuit board is electrically connected with the display panel and includes a plurality of conductive wires. The integrated circuit is disposed on the flexible circuit board and has a plurality of bumps. The conductive layer is disposed between the integrated circuit and the flexible circuit board and covers a periphery of the integrated circuit. In addition, the conductive layer includes an adhesive and a plurality of conductive particles distributed in the adhesive. Moreover, the bumps are electrically connected with the conductive wires through the conductive particles.
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公开(公告)号:US10720415B2
公开(公告)日:2020-07-21
申请号:US15698777
申请日:2017-09-08
Applicant: InnoLux Corporation
Inventor: Wei-Cheng Chu , Ming-Fu Jiang , Chia-Cheng Liu , Chih-Yuan Lee
IPC: H01L25/16 , H01L33/58 , H01L25/075 , H01L33/62 , H01L33/52
Abstract: A display device is provided. The display device includes a substrate having a first surface and a second surface opposite to the first surface, a plurality of light-emitting units disposed on the first surface of the substrate, and a plurality of conductive structures extending into the substrate from the second surface of the substrate. The plurality of conductive structures are electrically connected to the plurality of light-emitting units.
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公开(公告)号:US20190109174A1
公开(公告)日:2019-04-11
申请号:US16209998
申请日:2018-12-05
Applicant: Innolux Corporation
Inventor: Wei-Cheng Chu , Ming-Fu Jiang , Gu-Jhong Jhang
IPC: H01L27/15 , H01L25/075 , H01L33/44 , H01L33/62
CPC classification number: H01L27/156 , H01L25/0753 , H01L33/44 , H01L33/62 , H01L2933/0066
Abstract: The disclosure provides a manufacturing method of an LED display device, including the following steps: providing a substrate; forming at least one first bonding pad and at least one second bonding pad on the substrate; forming at least one spacer on the substrate, wherein the spacer is located between the first bonding pad and the second bonding pad, and a height of the spacer is P μm; providing a conductive paste layer above the substrate, wherein the conductive paste layer includes a plurality of conductive particles; and bonding at least one LED on the substrate, wherein the LED includes a first electrode and a second electrode, and the first electrode and the second electrode have a height H μm. The first electrode and the second electrode of the LED are respectively electrically connected to the first bonding pad and the second bonding pad of the substrate through the conductive particles of the conductive paste layer, and H+3.5 μm≥P μm≥H+0.48 μM.
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