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    Binaural recording for processing audio signals to enable alerts
    11.
    发明授权
    Binaural recording for processing audio signals to enable alerts 有权

    公开(公告)号：US11095985B2

    公开(公告)日：2021-08-17

    申请号：US16862208

    申请日：2020-04-29

    Applicant: Intel Corporation

    Inventor： Rajesh Poornachandran ,  David Gottardo ,  Swarnendu Kar ,  Saurabh Dadu ,  Mark MacDonald

    IPC: H04R1/10 ,  H04R3/00 ,  H04R5/04 ,  G10L25/51 ,  G10L25/30 ,  H04S7/00

    Abstract: An example apparatus includes: a first earpiece to be positioned proximate a first ear of a user and including: a first microphone to transduce ambient sound external to the first earpiece into a first ambient audio signal, the ambient sound including sound indicative of a potential danger; and a first speaker to transduce a first input audio signal into music and the first ambient audio signal into the sound indicative of the potential danger; and a second earpiece to be positioned proximate a second ear of the user and including: a second microphone to transduce the ambient sound external to the second earpiece into a second ambient audio signal, the ambient sound including the sound indicative of the potential danger; and a second speaker to transduce a second input audio signal into the music and the second ambient audio signal into the sound indicative of the potential danger.

    HETEROGENEOUS HEAT PIPES
    13.
    发明申请
    HETEROGENEOUS HEAT PIPES 有权

    公开(公告)号：US20210059073A1

    公开(公告)日：2021-02-25

    申请号：US17090624

    申请日：2020-11-05

    Applicant: Intel Corporation

    Inventor： Gaurav Patankar ,  Ruander Cardenas ,  Mark MacDonald ,  Akhilesh P. Rallabandi

    IPC: H05K7/20

    Abstract: Heterogeneous heat pipe solutions provide both low thermal resistance and a high Qmax. Some heterogeneous heat pipe solutions comprise multiple homogenous heat pipes operating in parallel, with each homogeneous heat pipe having its thermal performance tailored to handle a processor operating in a particular power mode. Other heterogeneous heat pipe solutions comprise one or more heterogeneous heat pipes, each heterogeneous heat pipe having more than wick, each wick having a different set of wick characteristics (wick material, wick thickness, etc.). Heterogeneous heat pipes can provide a thermal management solution for processors over their full operating power range.

    Electronic device having an active edge
    17.
    发明授权
    Electronic device having an active edge 有权

    公开(公告)号：US10114444B2

    公开(公告)日：2018-10-30

    申请号：US15236571

    申请日：2016-08-15

    Applicant: INTEL CORPORATION

    Inventor： Mark MacDonald

    IPC: G06F1/32 ,  G06F1/16 ,  G06F1/20

    Abstract: An electronic device is provided that includes a base, a processor, and a tablet having a front surface, a rear surface and a bottom edge surface. A processor may operate at a first operating condition when the tablet is coupled to the base, and the processor may operate at a second operating condition when the tablet is not coupled to the base. The tablet may include a heat conducting device and an active edge. The heat conducting device may conduct heat from the processor to the active edge where the heat may be dissipated using supplemental cooling.

    SONIC DUST REMEDIATION
    18.
    发明申请
    SONIC DUST REMEDIATION 审中-公开
    SONIC污垢补救

    公开(公告)号：US20170059263A1

    公开(公告)日：2017-03-02

    申请号：US15122424

    申请日：2014-03-31

    Applicant: Yanbing SUN ,  Mark MACDONALD ,  Jiancheng TAO ,  Intel Corporation

    Inventor： Yanbing Sun ,  Mark MacDonald ,  Jiancheng Tao ,  Ming Zhang

    IPC: F28G7/00 ,  F28G15/00 ,  B08B7/02 ,  G05B15/02 ,  G06F1/20

    CPC classification number: F28G7/00 ,  B08B7/026 ,  F28G15/003 ,  G05B15/02 ,  G06F1/203 ,  H05K7/20181

    Abstract: A system and method are disclosed for using a sonic frequency to induce a vibration useful for clearing dust accumulation from microelectronics, such as a laptop computer. A speaker driver may be mounted onto a support structure for a heat exchanger (220). At an advantageous time, such as boot up, a sonic frequency may be driven onto the speaker (250), thus inducing vibration in the heat exchanger (220) and helping to clear dust accumulation. In some cases, a resonant frequency may be used to optimize the amount of vibration per unit power delivery.

    Abstract translation: 公开了一种系统和方法，用于使用声频来引起用于清除诸如膝上型计算机之类的微电子的灰尘积聚的振动。 扬声器驱动器可以安装在用于热交换器（220）的支撑结构上。 在有利的时间，例如引导，声音频率可以被驱动到扬声器（250）上，从而引起热交换器（220）中的振动并帮助清除灰尘积聚。 在某些情况下，可以使用谐振频率来优化每单位功率输送的振动量。

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