摘要:
A semiconductor memory for operating in burst mode. The memory has a memory cell array divided into a plurality of memory blocks, a plurality of (e.g., 2) output registers each including a plurality of output data retaining blocks corresponding to the multiple memory blocks, and a burst counter unit. The output registers alternately receive data transferred from the memory cell array. In accordance with the result of counting by the burst counter unit, the data retained in the output registers is output alternately in bursts, whereby the speed of data read operation in the memory is boosted regardless of the operating speed of the memory cell array therein.
摘要:
An internal address signal corresponding to data to be written into a memory cell is held in a latch circuit. The held internal address signal is selected by a multiplexer in the next writing operation and applied to a decoder. Write data is taken in and held by the latch circuit during the period in which data is not being read out from the memory cell array. A comparator compares the held internal address signal and an internal address signal for reading data. If a matching is found between them, the multiplexer outputs data from the latch circuit for external output. Accordingly, delay of a writing operation following a reading operation can be eliminated without increasing chip cost, package cost, and system cost, as a result high speed operation of cache memories is achieved and the speed performance of computers of various levels such as supercomputers, large size calculators, work stations and personal computers can be improved.
摘要:
In a computer graphics apparatus, a main memory stores image data representing pixels on a raster scan display. A cache memory is provided for retaining a partial copy of the image data in the main memory. A computing unit processes the image data copied into the cache memory. A video cache memory acquires image data from the main memory and the cache memory. A graphics controller acquires image data from the video cache memory and outputs the image data to the raster scan display.
摘要:
A semiconductor memory device comprises first and second data buses. An output drive circuit adjusts the potentials at the first and second data buses in response to an internal read signal read from a memory cell. The gates of a PMOS transistor and an NMOS transistor forming an output stage corresponding to an output final stage are connected to ends of the first and second data buses, respectively. The potential of an output signal derived from the output stage loosely transits with a value decided by the capacitances of the first and second data buses. Thus, through rate control of the output signal can be implemented without reducing current drivability of the MOS transistors forming the output final stage.
摘要:
In repairing a defective memory cell of a data memory placed in a data memory region, a repairing circuit which employs a repairing method causing some access penalty but having high repairing efficiency is located in a redundant row region and a redundant column region in the data memory region. On the other hand, in repairing a defective memory cell of a tag memory placed in a tag memory region, a repairing circuit which employs a repairing method having low repairing efficiency but causing little access penalty is located in a redundant column region in the tag memory region. Accordingly, optimal repair of a defective memory cell can be achieved according to respective functions of the tag memory and the data memory.
摘要:
A semiconductor memory device comprises a dynamic memory cell array, a static memory cell array, a plurality of word lines, a plurality of DRAM bit line pairs and a plurality of SRAM bit line pairs. The dynamic memory cell array comprises a plurality of dynamic memory cells arranged in the shape of a matrix. The static memory cell array is arranged adjacent to the dynamic memory cell array. The static memory cell array includes the static memory cells arranged in the shape of a matrix. A plurality of word lines are arranged in a plurality of rows. Each word line is connected to the dynamic and static memory cells arranged in the corresponding rows. A plurality of DRAM bit line pairs are arranged in a plurality of columns. Each DRAM bit line pair is connected to the dynamic memory cells. A plurality of SRAM bit line pairs are arranged in the other plurality of columns. Each SRAM bit line pair is connected to the static memory cells arranged in the corresponding columns.
摘要:
Bit lines which are adjacent to each other are connected to bit line signal input/output lines which are not adjacent to each other, via through holes. By this connection, data input/output lines, shield lines and a global word line are arranged between the through holes, whereby the distance between the through holes can be widened, minimum space between the bit lines can be widened, and therefore, higher integration of the memory array is realized.
摘要:
A plurality of bit line signal IO lines L1, /L1 . . . Ln and /Ln are arranged on a memory cell array. These bit line signal IO lines are arranged to cross respective bit lines BL1, /BL1, . . . BLn and /BLn, and are connected to the corresponding bit lines, respectively. Each bit line signal IO line has an end extended to an end, in a direction perpendicular to the bit line, of a memory cell array, and is coupled at the end to a bit line peripheral circuit. Although bit line peripheral circuits could be arranged only at upper and lower ends of the bit lines in the prior art, the bit line peripheral circuits can be arranged also at the ends of the bit line signal IO lines in the invention. This can increase a degree of freedom in a layout for the bit line peripheral circuits, and thus the bit line peripheral circuits can be dispersedly arranged in a larger area.
摘要:
A semiconductor memory device changeable in word organization has a plurality of input/output terminals and a plurality of input terminals. Each of the plurality of input/output terminals and the plurality of input terminals are connected to an internal circuit via input/output buffers. These input/output buffers have identical structures and arrangements with identical input/output capacitance. The output buffer in the input/output buffer connected to an input terminal is coupled to a predetermined potential. The output buffer in the input/output buffer connected to an input/output terminal is activated by an output driver. The semiconductor memory device is generally set to a 1M word.times.1 bit organization. This semiconductor memory device may be set to a 256 k word.times.4 bit organization at the time of testing.
摘要:
A static semiconductor memory device comprises a plurality of memory cells each connected to complementary bit line pairs and to word lines, a row decoder for selecting any of the word lines, and a load and a transfer gate connected to the bit line pairs. When data "0" or "1" is written into all of the memory cells, the load is cut off from the bit lines by a current cutoff circuit, the bit lines are fixed to a predetermined potential by a current fixing circuit, and all of the word lines are driven by a word line driving circuit, so that all of the memory cells simultaneously enter a common state.