公开(公告)号：US20070145404A1

公开(公告)日：2007-06-28

申请号：US11644977

申请日：2006-12-26

申请人： Kei Murayama ,  Akinori Shiraishi ,  Masahiro Sunohara ,  Naoyuki Koizumi ,  Hideaki Sakaguchi ,  Mitsutoshi Higashi ,  Yuichi Taguchi

发明人： Kei Murayama ,  Akinori Shiraishi ,  Masahiro Sunohara ,  Naoyuki Koizumi ,  Hideaki Sakaguchi ,  Mitsutoshi Higashi ,  Yuichi Taguchi

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  H01L24/97 ,  H01L33/507 ,  H01L33/62 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01029 ,  H01L2924/12041 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor device made by mounting a light emitting element on a substrate, where an optically-transparent cover with a flat plate shape is installed on the light emitting element and a groove part for suppressing reflection of light emission of the light emitting element is formed in the cover.

摘要翻译： 通过将发光元件安装在基板上而制成的半导体器件，其中在发光元件上安装有平板形状的光学透明盖，并且形成用于抑制发光元件的发光反射的槽部 封面。

公开(公告)号：US07897510B2

公开(公告)日：2011-03-01

申请号：US11896009

申请日：2007-08-29

申请人： Kei Murayama ,  Akinori Shiraishi ,  Masahiro Sunohara ,  Yuichi Taguchi ,  Naoyuki Koizumi ,  Mitsutoshi Higashi

发明人： Kei Murayama ,  Akinori Shiraishi ,  Masahiro Sunohara ,  Yuichi Taguchi ,  Naoyuki Koizumi ,  Mitsutoshi Higashi

IPC分类号： H01L21/00

CPC分类号： H01L23/055 ,  B81B7/007 ,  B81B2203/0353 ,  B81B2203/0384 ,  B81B2207/096 ,  B81C1/00103 ,  B81C2201/0132 ,  H01L21/486 ,  H01L23/13 ,  H01L23/147 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method for manufacturing a package which includes: an etching step of etching a silicon substrate, and forming a via hole penetrating through the silicon substrate; and a step of embedding an electrically conductive material in the via hole, and forming a via plug, characterized in that the etching step includes a first etching step of forming the via hole in a straight shape, and a second etching step of forming the via hole in a taper shape.

摘要翻译： 一种制造封装的方法，包括：蚀刻步骤，蚀刻硅衬底，以及形成穿透硅衬底的通孔; 以及在所述通孔中嵌入导电材料的步骤，以及形成通孔塞，其特征在于，所述蚀刻步骤包括以直线形状形成所述通孔的第一蚀刻步骤和形成所述通孔的第二蚀刻步骤 孔呈锥形。

公开(公告)号：US07876036B2

公开(公告)日：2011-01-25

申请号：US11645581

申请日：2006-12-27

申请人： Yuichi Taguchi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Mitsutoshi Higashi

发明人： Yuichi Taguchi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Mitsutoshi Higashi

IPC分类号： H01J1/62

CPC分类号： H01L33/507 ,  H01L33/486 ,  H01L33/501 ,  H01L2224/16225 ,  H01L2924/16195 ,  H01L2933/0041

摘要： A light emitting apparatus, includes: a light emitting device accommodating body, which has a recessed portion wherein a light emitting device is accommodated; a wiring pattern, which is provided for the light emitting device accommodating body 11 and is electrically connected to the light emitting device; a light transmitting substrate, which is mounted on the light emitting device accommodating body and completely closes the recessed portion; and a phosphor-containing, ultraviolet curing resin, which is so deposited that, opposite to the light emitting device accommodating body, the face of the light transmitting member is covered.

摘要翻译： 发光装置包括：发光装置容纳主体，其具有容纳发光装置的凹部; 布线图案，其被设置用于发光装置容纳主体11并且电连接到发光装置; 透光基板，其安装在发光装置容纳体上并完全封闭凹部; 和含有荧光体的紫外线固化树脂，其被沉积成与发光装置容纳体相对的透光部件的表面被覆盖。

公开(公告)号：US07655956B2

公开(公告)日：2010-02-02

申请号：US11644933

申请日：2006-12-26

申请人： Masahiro Sunohara ,  Mitsutoshi Higashi ,  Yuichi Taguchi ,  Hideaki Sakaguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama

发明人： Masahiro Sunohara ,  Mitsutoshi Higashi ,  Yuichi Taguchi ,  Hideaki Sakaguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama

IPC分类号： H01L33/00

CPC分类号： H01L33/483 ,  H01L33/507 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/01019 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

摘要： There is provided a semiconductor device mounted with a light emitting element, which can be downsized easily, improve light emitting efficiency and be formed easily, and a method for manufacturing the semiconductor device effectively. The semiconductor device includes a substrate, a light emitting element mounted on the substrate by flip chip bonding, a sealing structure sealing the light emitting element and a phosphor film which is formed on an internal surface of the sealing structure. The sealing structure includes a blocking portion which is formed integrally with the substrate so as to surround the light emitting element on the substrate and functions as a reflector that reflects a light emitted from the light emitting element and a cover portion which is arranged on the top of the blocking portion and is bonded to the blocking portion.

摘要翻译： 提供一种安装有发光元件的半导体器件，其可以容易地小型化，提高发光效率并且容易地形成，以及有效地制造半导体器件的方法。 半导体器件包括衬底，通过倒装焊接安装在衬底上的发光元件，密封发光元件的密封结构和形成在密封结构的内表面上的荧光膜。 密封结构包括阻挡部分，该阻挡部分与基底一体地形成以围绕基底上的发光元件，并且用作反射从发光元件发射的光的反射器和布置在顶部的盖部分 并且结合到阻挡部分。

公开(公告)号：US20070177360A1

公开(公告)日：2007-08-02

申请号：US11624440

申请日：2007-01-18

申请人： Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Hideaki Sakaguchi ,  Masahiro Sunohara ,  Yuichi Taguchi ,  Mitsutoshi Higashi

发明人： Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Hideaki Sakaguchi ,  Masahiro Sunohara ,  Yuichi Taguchi ,  Mitsutoshi Higashi

IPC分类号： H05K1/14

CPC分类号： B81B7/0067 ,  H01L24/97 ,  H01L2224/16225

摘要： According to a sealed structure 60 constituted by anodically bonding a silicon board 20 and a glass plate 40, an upper opening of a recessed portion 22 is sealed in an airtight state by the glass plate 40 by bonding an upper face of a wall portion 26 to the glass plate 40. A voltage applying pattern 70 is formed to surround a light transmitting region to which an optical conversion element 24 is opposed. Further, the voltage applying pattern 70 functions as a cathode pattern applied with a voltage by being brought into contact with a lower face of the cathode plate 50.

摘要翻译： 根据通过阳极结合硅板20和玻璃板40构成的密封结构60，通过将壁部26的上表面粘接到玻璃板40的密封状态，将凹部22的上部开口密封在气密状态 玻璃板40。 电压施加图案70形成为包围光转换元件24相对的光透射区域。 此外，电压施加图案70通过与阴极板50的下表面接触而用作施加电压的阴极图案。

公开(公告)号：US20070173165A1

公开(公告)日：2007-07-26

申请号：US11656580

申请日：2007-01-23

申请人： Yuichi Taguchi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Mitsutoshi Higashi

发明人： Yuichi Taguchi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Mitsutoshi Higashi

IPC分类号： H01J9/00 ,  H01J1/62

CPC分类号： H01L33/507 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2924/16195 ,  H01L2933/0041

摘要： A method of producing a light emitting apparatus including a light emitting element, a light emitting element housing having a recess for housing the light emitting element, and a translucent substrate placed on the light emitting element housing is disclosed. The disclosed method includes a fluorescent-substance-containing resin forming step of forming a fluorescent-substance-containing resin on a first side of the translucent substrate which first side is opposite to a second side of the translucent substrate which second side faces the recess. In the fluorescent-substance-containing resin forming step, luminance and chromaticity of light that is emitted from the light emitting element and then transmitted by the fluorescent-substance-containing resin are measured and a thickness of the fluorescent-substance-containing resin is adjusted based on the measured luminance and chromaticity so that light emitted from the light emitting apparatus attains the specified luminance and chromaticity.

摘要翻译： 公开了一种制造包括发光元件的发光装置的方法，具有用于容纳发光元件的凹部的发光元件壳体和放置在发光元件壳体上的透光性基板。 所公开的方法包括在透光性基板的第一面上形成含有荧光物质的树脂的荧光物质的树脂形成工序，第一面与透光性基板的第二面相对，第二面与凹部相对。 在含荧光物质的树脂形成步骤中，测量从发光元件发射并随后由含荧光物质的树脂透射的光的亮度和色度，并调节含荧光物质的树脂的厚度 基于测量的亮度和色度，使得从发光装置发射的光达到规定的亮度和色度。

公开(公告)号：US20070161316A1

公开(公告)日：2007-07-12

申请号：US11646955

申请日：2006-12-28

申请人： Yuichi Taguchi ,  Akinori Shiraishi ,  Kei Murayama ,  Naoyuki Koizumi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Mitsutoshi Higashi

发明人： Yuichi Taguchi ,  Akinori Shiraishi ,  Kei Murayama ,  Naoyuki Koizumi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Mitsutoshi Higashi

IPC分类号： H01J9/26 ,  H01J9/32

CPC分类号： H01L33/50 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00012

摘要： A method of manufacturing a light emitting apparatus including a light emitting device and a light emitting device installing body having a concave part for installing the light emitting device therein is disclosed. The method includes the steps of a) forming a coating of plural fluorophor particles covering the light emitting device installed in the concave part, and b) forming a transparent resin covering the plural fluorophor particle coating. Step b) includes a step of performing illumination with the light emitting device so that the light emitted from the light emitting apparatus has a predetermined luminance and chromaticity.

摘要翻译： 公开了一种制造发光装置的方法，该发光装置包括发光装置和具有用于在其中安装发光装置的凹部的发光装置安装体。 该方法包括以下步骤：a）形成覆盖安装在凹部中的发光装置的多个荧光体颗粒的涂层，以及b）形成覆盖多个荧光体颗粒涂层的透明树脂。 步骤b）包括利用发光装置进行照明的步骤，使得从发光装置发射的光具有预定的亮度和色度。

公开(公告)号：US20070158674A1

公开(公告)日：2007-07-12

申请号：US11645876

申请日：2006-12-27

申请人： Yuichi Taguchi ,  Hideaki Sakaguchi ,  Naoyuki Koizumi ,  Mitsutoshi Higashi ,  Akinori Shiraishi ,  Masahiro Sunohara ,  Kei Murayama

发明人： Yuichi Taguchi ,  Hideaki Sakaguchi ,  Naoyuki Koizumi ,  Mitsutoshi Higashi ,  Akinori Shiraishi ,  Masahiro Sunohara ,  Kei Murayama

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： A light emitting device is disclosed. The light emitting device includes a light emitting element (15), and a light emitting element container (11) having a concave section (20) for containing the light emitting element (15). The concave section (20) includes a side surface (20A) and a bottom surface (20B) almost orthogonal to the side surface (20A). The light emitting device further includes a conductive paste layer (17) formed of a conductive paste in which metal particles are dispersed in a solution, and the conductive paste layer (17) includes a slanting surface (17A) on the side surface (20A) and the bottom surface (20B).

摘要翻译： 公开了一种发光器件。 发光器件包括发光元件（15）和具有用于容纳发光元件（15）的凹部（20）的发光元件容器（11）。 凹部（20）包括与侧面（20A）大致正交的侧面（20A）和底面（20B）。 发光装置还包括由导电浆料形成的导电浆料层（17），其中金属颗粒分散在溶液中，并且导电浆料层（17）在侧表面（20）上包括倾斜表面（17A） A）和底面（20B）。

公开(公告)号：US20070145400A1

公开(公告)日：2007-06-28

申请号：US11644933

申请日：2006-12-26

申请人： Masahiro Sunohara ,  Mitsutoshi Higashi ,  Yuichi Taguchi ,  Hideaki Sakaguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama

发明人： Masahiro Sunohara ,  Mitsutoshi Higashi ,  Yuichi Taguchi ,  Hideaki Sakaguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama

IPC分类号： H01L33/00

CPC分类号： H01L33/483 ,  H01L33/507 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/01019 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

摘要： There is provided a semiconductor device mounted with a light emitting element, which can be downsized easily, improve light emitting efficiency and be formed easily, and a method for manufacturing the semiconductor device effectively. The semiconductor device includes a substrate, a light emitting element mounted on the substrate by flip chip bonding, a sealing structure sealing the light emitting element and a phosphor film which is formed on an internal surface of the sealing structure. The sealing structure includes a blocking portion which is formed integrally with the substrate so as to surround the light emitting element on the substrate and functions as a reflector that reflects a light emitted from the light emitting element and a cover portion which is arranged on the top of the blocking portion and is bonded to the blocking portion.

摘要翻译： 提供一种安装有发光元件的半导体器件，其可以容易地小型化，提高发光效率并且容易地形成，以及有效地制造半导体器件的方法。 半导体器件包括衬底，通过倒装焊接安装在衬底上的发光元件，密封发光元件的密封结构和形成在密封结构的内表面上的荧光膜。 密封结构包括阻挡部分，该阻挡部分与基底一体地形成以围绕基底上的发光元件，并且用作反射从发光元件发射的光的反射器和布置在顶部的盖部分 并且结合到阻挡部分。

公开(公告)号：US08148738B2

公开(公告)日：2012-04-03

申请号：US11812149

申请日：2007-06-15

申请人： Kei Murayama ,  Mitsutoshi Higashi ,  Naoyuki Koizumi ,  Yuichi Taguchi ,  Akinori Shiraishi ,  Masahiro Sunohara

发明人： Kei Murayama ,  Mitsutoshi Higashi ,  Naoyuki Koizumi ,  Yuichi Taguchi ,  Akinori Shiraishi ,  Masahiro Sunohara

IPC分类号： H01L31/12

CPC分类号： H01L25/167 ,  H01L23/147 ,  H01L23/4926 ,  H01L23/62 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/32145 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： In a semiconductor device 100, a light emitting element 120 has been mounted on an upper plane of a semiconductor substrate 102. In an impurity diffusion region of the semiconductor substrate 102, a P conducting type of a layer 104, and an N layer 106 have been formed, while an N conducting type impurity is implanted to the P layer 104, and then the implanted impurity is diffused to constitute the N layer 106. A zener diode 108 made of a semiconductor device has been formed by the P layer 104 and the N layer 106.

摘要翻译： 在半导体器件100中，发光元件120已经被安装在半导体衬底102的上平面上。在半导体衬底102的杂质扩散区域中，P导电类型的层104和N层106具有 形成N导电型杂质，然后将N导电型杂质注入到P层104中，然后将注入的杂质扩散以构成N层106.由P层104形成由半导体器件制成的齐纳二极管108， N层106。