公开(公告)号：US20060118808A1

公开(公告)日：2006-06-08

申请号：US10539926

申请日：2004-03-08

申请人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

发明人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

IPC分类号： H01L33/00

CPC分类号： H01L33/642 ,  H01L33/46 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/00014

摘要： A semiconductor device for adequately removing heat generated by a semiconductor element is provided. A semiconductor device 100 is equipped with a substrate 2, having a bottom surface 2b and an element mounting surface 2a which is positioned on the opposite side of bottom surface 2b, and a semiconductor element 1, having a main surface 1a which is mounted onto element mounting surface 2a. With L being the length in the long direction of main surface 1a and H being the distance between bottom surface 2b and element mounting surface 2a, the ratio H/L is 0.3 or greater. When the semiconductor element is a light emitting element, element mounting surface 2a is a cavity 2u, and element 1 is provided in cavity 2u. A metal layer 13 is provided on the surface of cavity 2u.

摘要翻译： 提供了用于充分去除由半导体元件产生的热的半导体器件。 半导体器件100配备有具有底面2b和位于底面2b的相反侧的元件安装面2a的基板2和具有主表面1a的半导体元件1， 安装在元件安装表面2a上。 在L表示主表面1a的长度方向上的长度a和H是底面2b与元件安装面2a之间的距离时，H / L的比例为0.3以上。 当半导体元件是发光元件时，元件安装表面2a是空腔2u，元件1设置在腔体2u中。 金属层13设置在空腔2u的表面上。

公开(公告)号：US07504671B2

公开(公告)日：2009-03-17

申请号：US11929492

申请日：2007-10-30

申请人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

发明人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

IPC分类号： H01L33/00

CPC分类号： H01L33/642 ,  H01L33/46 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/00014

摘要： A semiconductor device for adequately removing heat generated by a semiconductor element is provided. A semiconductor device 100 is equipped with a substrate 2, having a bottom surface 2b and an element mounting surface 2a which is positioned on the opposite side of bottom surface 2b, and a semiconductor element 1, having a main surface 1a which is mounted onto element mounting surface 2a. With L being the length in the long direction of main surface 1 and H being the distance between bottom surface 2b and element mounting surface 2a, the ratio H/L is 0.3 or greater. When the semiconductor element is a light emitting element, element mounting surface 2a is a cavity 2u, and element 1 is provided in cavity 2u. A metal layer 13 is provided on the surface of cavity 2u. In addition, when an electrode 32 which connects to an external part is provided on main surface 1a, on the cavity side of the part which connects with electrode 32, main surface 1a is provided with a groove. The groove is for preventing outward flow of connection member 34 of electrode 32.

摘要翻译： 提供了用于充分去除由半导体元件产生的热的半导体器件。 半导体装置100配备有基板2，基板2具有底面2b和位于底面2b的相反侧的元件安装面2a，半导体元件1具有安装在元件上的主表面1a 安装面2a。 在L是主表面1的长度方向上的长度，H是底面2b与元件安装面2a的距离的情况下，H / L的比例为0.3以上。 当半导体元件是发光元件时，元件安装表面2a是空腔2u，元件1设置在腔体2u中。 金属层13设置在空腔2u的表面上。 此外，当在主表面1a上设置连接到外部部分的电极32时，在与电极32连接的部分的空腔侧，主表面1a设置有凹槽。 凹槽用于防止电极32的连接构件34向外流动。

公开(公告)号：US07335925B2

公开(公告)日：2008-02-26

申请号：US10539926

申请日：2004-03-08

申请人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

发明人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

IPC分类号： H01L33/00

CPC分类号： H01L33/642 ,  H01L33/46 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/00014

摘要： A semiconductor device for adequately removing heat generated by a semiconductor element is provided. A semiconductor device 100 is equipped with a substrate 2, having a bottom surface 2b and an element mounting surface 2a which is positioned on the opposite side of bottom surface 2b, and a semiconductor element 1, having a main surface 1a which is mounted onto element mounting surface 2a. With L being the length in the long direction of main surface 1a and H being the distance between bottom surface 2b and element mounting surface 2a, the ratio H/L is 0.3 or greater. When the semiconductor element is a light emitting element, element mounting surface 2a is a cavity 2u, and element 1 is provided in cavity 2u. A metal layer 13 is provided on the surface of cavity 2u.

摘要翻译： 提供了用于充分去除由半导体元件产生的热的半导体器件。 半导体器件100配备有具有底面2b和位于底面2b的相反侧的元件安装面2a的基板2和具有主表面1a的半导体元件1， 安装在元件安装表面2a上。 在L表示主表面1a的长度方向上的长度a和H是底面2b与元件安装面2a之间的距离时，H / L的比例为0.3以上。 当半导体元件是发光元件时，元件安装表面2a是空腔2u，元件1设置在腔体2u中。 金属层13设置在空腔2u的表面上。

公开(公告)号：US07649270B2

公开(公告)日：2010-01-19

申请号：US10589747

申请日：2005-07-21

申请人： Kenjiro Higaki ,  Daisuke Takagi ,  Sadamu Ishidu ,  Yasushi Tsuzuki

发明人： Kenjiro Higaki ,  Daisuke Takagi ,  Sadamu Ishidu ,  Yasushi Tsuzuki

IPC分类号： H01L23/29

CPC分类号： H01L33/62 ,  H01L23/49827 ,  H01L24/97 ,  H01L31/02002 ,  H01L31/0203 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09827 ,  H01L2924/00014 ,  H01L2924/00

摘要： A collective substrate (1) is produced by firing a ceramic green sheet and forming through-holes (11) in the resulting substrate. The through-holes (11) each have an interior surface including taper surfaces (11b, 11c) which are tapered as having an opening size progressively decreasing from a main surface (21) and an external connection surface (22) toward a minimum size hole portion (11a). The taper surfaces (11b, 11c) respectively form obtuse angles θ1, θ2 with the main surface (21) and the external connection surface (22). A semiconductor element mount (BL) includes an insulative member (2) cut out of the collective substrate (1). An imaging device (PE2) includes an imaging element (PE1) mounted in a region surrounded by a frame (4) which is bonded to the main surface (21) of the insulative member (2) and closed by a cover (FL). A light emitting diode component (LE2) includes a light emitting element (LE1) mounted on the main surface (21) of the insulative member (2) with the minimum size hole portion (11a) of the through-hole being filled with an electrically conductive material (33a), the light emitting element being sealed with a fluorescent material and/or a protective resin (FR). A light emitting diode (LE3) includes the light emitting diode component (LE2) mounted in a package (7).

摘要翻译： 通过烧制陶瓷生片并在所得到的衬底中形成通孔（11）来制备集合衬底（1）。 通孔（11）各自具有包括锥形表面（11b，11c）的内表面，锥形表面（11b，11c）具有从主表面（21）和外部连接表面（22）朝向最小尺寸孔逐渐减小的开口尺寸的锥形 部分（11a）。 锥形表面（11b，11c）分别与主表面（21）和外部连接表面（22）形成钝角θ1，θ2。 半导体元件安装件（BL）包括从集体基板（1）切出的绝缘构件（2）。 成像装置（PE2）包括安装在被框架（4）包围的区域中的成像元件（PE1），该框架结合到绝缘构件（2）的主表面（21）并由盖（FL）封闭。 发光二极管部件（LE2）包括安装在绝缘构件（2）的主表面（21）上的发光元件（LE1），其中通孔的最小尺寸孔部分（11a）填充有电 导电材料（33a），发光元件用荧光材料和/或保护树脂（FR）密封。 发光二极管（LE3）包括安装在封装（7）中的发光二极管部件（LE2）。

公开(公告)号：US20080105894A1

公开(公告)日：2008-05-08

申请号：US11929387

申请日：2007-10-30

申请人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

发明人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

IPC分类号： H01L33/00

CPC分类号： H01L33/642 ,  H01L33/46 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/00014

摘要： A semiconductor device for adequately removing heat generated by a semiconductor element is provided. A semiconductor device 100 is equipped with a substrate 2, having a bottom surface 2b and an element mounting surface 2a which is positioned on the opposite side of bottom surface 2b, and a semiconductor element 1, having a main surface 1a which is mounted onto element mounting surface 2a. With L being the length in the long direction of main surface 1 and H being the distance between bottom surface 2b and element mounting surface 2a, the ratio H/L is 0.3 or greater. When the semiconductor element is a light emitting element, element mounting surface 2a is a cavity 2u, and element 1 is provided in cavity 2u. A metal layer 13 is provided on the surface of cavity 2u. In addition, when an electrode 32 which connects to an external part is provided on main surface 1a, on the cavity side of the part which connects with electrode 32, main surface 1a is provided with a groove. The groove is for preventing outward flow of connection member 34 of electrode 32.

公开(公告)号：US20060198162A1

公开(公告)日：2006-09-07

申请号：US10546777

申请日：2004-03-15

申请人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

发明人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

IPC分类号： F21V7/04 ,  H01J1/62 ,  H01L33/00

CPC分类号： H01L33/60 ,  H01L33/486 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01S5/0224 ,  H01S5/02292 ,  H01L2924/00014 ,  H01L2924/00

摘要： The object of the present invention is to provide a light-emitting element mounting member and a semiconductor device using the same that is easy to process and that allows adequate heat dissipation. A light-emitting element mounting member 200 includes: a substrate 2 including an element mounting surface 2a mounting a semiconductor light-emitting element 1 and first and second conductive regions 21, 22 disposed on the element mounting surface 2a and connected to the semiconductor light-emitting element 1; a reflective member 6 including a reflective surface 6a defining an internal space 6b for housing the semiconductor light-emitting element 1 and containing a metal disposed on the element mounting surface 1a; and a metal layer 13 disposed on the reflective surface 6a. The reflective surface 6a is sloped relative to the element mounting surface 2a so that a diameter of the internal space 6b is greater away from the element mounting surface 2a.

摘要翻译： 本发明的目的是提供一种发光元件安装构件和使用该发光元件安装构件的半导体装置，其易于处理并且允许充分的散热。 发光元件安装构件200包括：基板2，其包括安装半导体发光元件1的元件安装表面2a和设置在元件安装表面2a上并连接到半导体的半导体发光元件1的第一和第二导电区域21,22。 发光元件1; 反射构件6，其包括限定用于容纳半导体发光元件1并容纳设置在元件安装表面1a上的金属的内部空间6b的反射表面6a; 以及设置在反射表面6a上的金属层13。 反射表面6a相对于元件安装表面2a倾斜，使得内部空间6b的直径远离元件安装表面2a。

公开(公告)号：US07298049B2

公开(公告)日：2007-11-20

申请号：US10506510

申请日：2003-03-03

申请人： Teruo Amoh ,  Takashi Ishii ,  Kenjiro Higaki ,  Yasushi Tsuzuki

发明人： Teruo Amoh ,  Takashi Ishii ,  Kenjiro Higaki ,  Yasushi Tsuzuki

IPC分类号： H01L23/48

CPC分类号： H01S5/02272 ,  H01L33/62 ,  H01L2924/0002 ,  H01S5/02476 ,  H01L2924/00

摘要： A submount that enables the reliable mounting of a semiconductor light-emitting device on it, and a semiconductor unit incorporating the submount. A submount 3 comprises (a) a substrate 4; and (b) a solder layer 8 formed on the top surface 4f of the substrate 4. The solder layer 8 before melting has a surface roughness, Ra, of at most 0.18 μm. It is more desirable that the solder layer 8 before melting have a surface roughness, Ra, of at most 0.15 μm, yet more desirably at most 0.10 μm. A semiconductor unit 1 comprises the submount 3 and a laser diode 2 mounted on the solder layer 8 of the submount 3.

摘要翻译： 一种能够在其上可靠地安装半导体发光器件的基座，以及并入该基座的半导体单元。 基座3包括（a）基板4; 和（b）形成在基板4的顶面4f上的焊料层8。 熔融前的焊料层8的表面粗糙度Ra为0.18μm以下。 更理想的是，熔融前的焊料层8的表面粗糙度Ra为0.15μm以下，进一步优选为0.10μm以下。 半导体单元1包括基座3和安装在基座3的焊料层8上的激光二极管2。

公开(公告)号：US20050067636A1

公开(公告)日：2005-03-31

申请号：US10506510

申请日：2003-03-03

申请人： Teruo Amoh ,  Takashi Ishii ,  Kenjiro Higaki ,  Yasushi Tsuzuki

发明人： Teruo Amoh ,  Takashi Ishii ,  Kenjiro Higaki ,  Yasushi Tsuzuki

IPC分类号： H01L33/62 ,  H01S5/02 ,  H01S5/022 ,  H01L29/768

CPC分类号： H01S5/02272 ,  H01L33/62 ,  H01L2924/0002 ,  H01S5/02476 ,  H01L2924/00

摘要： A submount that enables the reliable mounting of a semiconductor light-emitting device on it, and a semiconductor unit incorporating the submount. A submount 3 comprises (a) a substrate 4; and (b) a solder layer 8 formed on the top surface 4f of the substrate 4. The solder layer 8 before melting has a surface roughness, Ra, of at most 0.18 μm. It is more desirable that the solder layer 8 before melting have a surface roughness, Ra, of at most 0.15 μm, yet more desirably at most 0.10 μm. A semiconductor unit 1 comprises the submount 3 and a laser diode 2 mounted on the solder layer 8 of the submount 3.

摘要翻译： 一种能够在其上可靠地安装半导体发光器件的基座，以及并入该基座的半导体单元。 基座3包括（a）基板4; 和（b）形成在基板4的顶面4f上的焊料层8.熔融前的焊料层8的表面粗糙度Ra为0.18μm以下。 更理想的是，熔融前的焊料层8的表面粗糙度Ra为0.15μm以下，进一步优选为0.10μm以下。 半导体单元1包括基座3和安装在基座3的焊料层8上的激光二极管2。

公开(公告)号：US07015583B2

公开(公告)日：2006-03-21

申请号：US10512828

申请日：2003-04-24

申请人： Takashi Ishii ,  Kenjiro Higaki ,  Yasushi Tsuzuki

发明人： Takashi Ishii ,  Kenjiro Higaki ,  Yasushi Tsuzuki

IPC分类号： H01L23/48 ,  H01L23/152 ,  H01L29/40

CPC分类号： H01S5/02236 ,  H01L23/488 ,  H01L33/62 ,  H01L2224/83192 ,  H01S5/02272 ,  H01S5/02476

摘要： A submount can mount on it a semiconductor light-emitting device with high bonding strength, and a semiconductor unit incorporates the submount. The submount comprises (a) a submount substrate, (b) a solder layer formed at the top surface of the submount substrate, and (c) a solder intimate-contact layer that is formed between the submount substrate and the solder layer and that has a structure in which a transition element layer consisting mainly of at least one type of transition element and a precious metal layer consisting mainly of at least one type of precious metal are piled up. In the above structure, the transition element layer is formed at the submount-substrate side. The semiconductor unit is provided with a semiconductor light-emitting device mounted on the solder layer of the submount.

摘要翻译： 底座可以在其上安装具有高粘结强度的半导体发光器件，并且半导体单元结合了底座。 所述基座包括（a）副安装座基板，（b）形成在所述副安装座基板的顶表面处的焊料层，以及（c）形成在所述副安装座基板和所述焊料层之间的焊料紧密接触层， 堆积了主要由至少一种类型的过渡元素组成的过渡元素层和主要由至少一种贵金属组成的贵金属层的结构。 在上述结构中，过渡元素层形成在基座侧基板侧。 半导体单元设置有安装在基座的焊料层上的半导体发光器件。

公开(公告)号：US20060000432A1

公开(公告)日：2006-01-05

申请号：US10526000

申请日：2004-06-30

申请人： Takehisa Yamamoto ,  Kenjiro Higaki ,  Yasushi Tsuzuki

发明人： Takehisa Yamamoto ,  Kenjiro Higaki ,  Yasushi Tsuzuki

IPC分类号： F01L1/26 ,  F01L1/18

CPC分类号： F01L1/181 ,  F01L1/26 ,  F01L1/46 ,  F01L2101/00

摘要： An object of the present invention is to provide a wear-resistant sliding part with a wear-resistant member to reduce wear of contacting portions of two parts which moves in linkage with each other such as a valve bridge and a rocker arm in a valve train system of a diesel engine, wherein the wear-resistant member is held in a recess of a receiving part securely not to fall off and allowed in the recess to rotate and move in the parallel direction to its bottom surface. Also the wear-resistant member is arranged with at least one of the following: a chamfer provided at the perimeter of bottom surface; the bottom surface with the flatness from 0.05 to 0.20 μm and a convex shape of a raised-up outer side; and at least one of the bottom, side, and top surfaces having surface roughness (Ra) of 0.2 μm or less.

摘要翻译： 本发明的目的是提供一种具有耐磨构件的耐磨滑动部件，以减少彼此连动地移动的两部分的接触部分的磨损，例如阀桥和气门机构中的摇臂 系统，其中所述耐磨构件被保持在接收部分的凹部中，所述凹部牢固地不会脱落并且允许在所述凹部中旋转并沿着其平行方向移动到其底表面。 此外，耐磨构件设置有以下至少一个：设置在底表面的周边的倒角; 平坦度为0.05〜0.20μm的底面和凸起的外侧的凸形状; 并且具有0.2μm或更小的表面粗糙度（Ra）的底表面，侧表面和顶表面中的至少一个。