公开(公告)号：US07719121B2

公开(公告)日：2010-05-18

申请号：US11581888

申请日：2006-10-17

申请人： Giles Humpston ,  Guilian Gao ,  Belgacem Haba

发明人： Giles Humpston ,  Guilian Gao ,  Belgacem Haba

IPC分类号： H01L23/48

CPC分类号： H01L23/4985 ,  H01L23/49811 ,  H01L24/48 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/3011 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package includes a microelectronic element having contacts, a flexible substrate spaced from and overlying the microelectronic element and a plurality of conductive posts extending from the flexible substrate and projecting away from the microelectronic element. The conductive posts are electrically interconnected with the microelectronic element. Each conductive post has a conductive base that is in contact with the flexible substrate and a conductive tip that extends from the base, with the base of the conductive post having a larger diameter than the tip of the conductive post. In certain embodiments, the conductive base and the conductive tip have a cylindrical shape.

摘要翻译： 微电子封装包括具有触点的微电子元件，与微电子元件隔开并覆盖的柔性基板以及从柔性基板延伸并远离微电子元件突出的多个导电柱。 导电柱与微电子元件电互连。 每个导电柱具有与柔性基板接触的导电基底和从基部延伸的导电尖端，导电柱的基部具有比导电柱的尖端更大的直径。 在某些实施例中，导电基底和导电尖端具有圆柱形形状。

公开(公告)号：US08378487B2

公开(公告)日：2013-02-19

申请号：US13356752

申请日：2012-01-24

申请人： Teck-Gyu Kang ,  Belgacem Haba ,  Guilian Gao

发明人： Teck-Gyu Kang ,  Belgacem Haba ,  Guilian Gao

IPC分类号： H01L21/44

CPC分类号： H01L24/16 ,  H01L21/4853 ,  H01L23/3114 ,  H01L23/49811 ,  H01L24/02 ,  H01L24/11 ,  H01L24/12 ,  H01L24/81 ,  H01L2224/02125 ,  H01L2224/0231 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/11334 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2224/29099

摘要： Wafer level chip packages including risers having sloped sidewalls and methods of fabricating such chip packages are disclosed. The inventive wafer level chip packages may advantageously be used in various microelectronic assemblies.

摘要翻译： 公开了包括具有倾斜侧壁的立管和制造这种芯片封装的方法的晶片级芯片封装。 本发明的晶片级芯片封装可有利地用于各种微电子组件中。

公开(公告)号：US20120126407A1

公开(公告)日：2012-05-24

申请号：US13356752

申请日：2012-01-24

申请人： Teck-Gyu Kang ,  Belgacem Haba ,  Guilian Gao

发明人： Teck-Gyu Kang ,  Belgacem Haba ,  Guilian Gao

IPC分类号： H01L23/498 ,  H01L21/762

CPC分类号： H01L24/16 ,  H01L21/4853 ,  H01L23/3114 ,  H01L23/49811 ,  H01L24/02 ,  H01L24/11 ,  H01L24/12 ,  H01L24/81 ,  H01L2224/02125 ,  H01L2224/0231 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/11334 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2224/29099

摘要： Wafer level chip packages including risers having sloped sidewalls and methods of fabricating such chip packages are disclosed. The inventive wafer level chip packages may advantageously be used in various microelectronic assemblies.

摘要翻译： 公开了包括具有倾斜侧壁的立管和制造这种芯片封装的方法的晶片级芯片封装。 本发明的晶片级芯片封装可有利地用于各种微电子组件中。

公开(公告)号：US20080088033A1

公开(公告)日：2008-04-17

申请号：US11581888

申请日：2006-10-17

申请人： Giles Humpston ,  Guilian Gao ,  Belgacem Haba

发明人： Giles Humpston ,  Guilian Gao ,  Belgacem Haba

IPC分类号： H01L23/48

CPC分类号： H01L23/4985 ,  H01L23/49811 ,  H01L24/48 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/3011 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package includes a microelectronic element having contacts, a flexible substrate spaced from and overlying the microelectronic element and a plurality of conductive posts extending from the flexible substrate and projecting away from the microelectronic element. The conductive posts are electrically interconnected with the microelectronic element. Each conductive post has a conductive base that is in contact with the flexible substrate and a conductive tip that extends from the base, with the base of the conductive post having a larger diameter than the tip of the conductive post. In certain embodiments, the conductive base and the conductive tip have a cylindrical shape.

摘要翻译： 微电子封装包括具有触点的微电子元件，与微电子元件隔开并覆盖的柔性基板以及从柔性基板延伸并远离微电子元件突出的多个导电柱。 导电柱与微电子元件电互连。 每个导电柱具有与柔性基板接触的导电基底和从基部延伸的导电尖端，导电柱的基部具有比导电柱的尖端更大的直径。 在某些实施例中，导电基底和导电尖端具有圆柱形形状。

公开(公告)号：US20080067663A1

公开(公告)日：2008-03-20

申请号：US11522885

申请日：2006-09-18

申请人： Teck-Gyu Kang ,  Belgacem Haba ,  Guilian Gao

发明人： Teck-Gyu Kang ,  Belgacem Haba ,  Guilian Gao

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L24/16 ,  H01L21/4853 ,  H01L23/3114 ,  H01L23/49811 ,  H01L24/02 ,  H01L24/11 ,  H01L24/12 ,  H01L24/81 ,  H01L2224/02125 ,  H01L2224/0231 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/11334 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2224/29099

摘要： Wafer level chip packages including risers having sloped sidewalls and methods of fabricating such chip packages are disclosed. The inventive wafer level chip packages may advantageously be used in various microelectronic assemblies.

摘要翻译： 公开了包括具有倾斜侧壁的立管和制造这种芯片封装的方法的晶片级芯片封装。 本发明的晶片级芯片封装可有利地用于各种微电子组件中。

公开(公告)号：US08133808B2

公开(公告)日：2012-03-13

申请号：US11522885

申请日：2006-09-18

申请人： Teck-Gyu Kang ,  Belgacem Haba ,  Guilian Gao

发明人： Teck-Gyu Kang ,  Belgacem Haba ,  Guilian Gao

IPC分类号： H01L21/44

CPC分类号： H01L24/16 ,  H01L21/4853 ,  H01L23/3114 ,  H01L23/49811 ,  H01L24/02 ,  H01L24/11 ,  H01L24/12 ,  H01L24/81 ,  H01L2224/02125 ,  H01L2224/0231 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/11334 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2224/29099

摘要： Wafer level chip packages including risers having sloped sidewalls and methods of fabricating such chip packages are disclosed. The inventive wafer level chip packages may advantageously be used in various microelectronic assemblies.

摘要翻译： 公开了包括具有倾斜侧壁的立管和制造这种芯片封装的方法的晶片级芯片封装。 本发明的晶片级芯片封装可有利地用于各种微电子组件中。

公开(公告)号：US20120113590A1

公开(公告)日：2012-05-10

申请号：US13293946

申请日：2011-11-10

申请人： Matthew Schwiebert ,  Ron Goldman ,  Kenneth Honer ,  Guilian Gao ,  Yan Zhang ,  Nels Jewell-Larsen

发明人： Matthew Schwiebert ,  Ron Goldman ,  Kenneth Honer ,  Guilian Gao ,  Yan Zhang ,  Nels Jewell-Larsen

IPC分类号： H05K7/20 ,  F28F13/00

CPC分类号： H05K7/20163 ,  H05K7/20172

摘要： An electronic system including an enclosure and an internal air plenum within the enclosure. At least one component of the electronic system within the enclosure evolves heat and has a surface exposed to the internal air plenum. The enclosure has inlet and outlet ventilation boundaries together with an EHD air mover disposed therein to motivate airflow along a flow path between the inlet and outlet ventilation boundaries, wherein the flow path is substantially excluded from the internal air plenum by a barrier.

摘要翻译： 包括外壳内的电子系统和内部空气增压室。 外壳内的电子系统的至少一个部件散发热量并具有暴露于内部空气增压室的表面。 外壳具有入口和出口通风边界以及设置在其中的EHD空气移动器，以沿着入口和出口通风边界之间的流动路径激发气流，其中流动路径基本上被隔离物从内部空气增压室排除。

公开(公告)号：US20130056241A1

公开(公告)日：2013-03-07

申请号：US13302811

申请日：2011-11-22

申请人： Guilian Gao ,  Nels Jewell-Larsen ,  Giles Humpston

发明人： Guilian Gao ,  Nels Jewell-Larsen ,  Giles Humpston

IPC分类号： H01B5/00 ,  F28F13/00 ,  F04B19/00 ,  B05D5/12

CPC分类号： B03C3/60 ,  B03C3/41 ,  B03C2201/04 ,  B03C2201/14

摘要： By selecting different materials for each layer, a multi-layered electrode structure can be made with superior performance characteristics. For example, a multilayered electrode can include a high tensile strength tungsten core, a conductive intermediate palladium, palladium-nickel, or other platinum group metal layer for generating a corona discharge, and a hardened layer comprising rhodium or other platinum group metal or alloy of the same to resist frictional abrasion during removal of silica dendrites that accumulate on the electrode surface during operation.

摘要翻译： 通过为每层选择不同的材料，可以制造具有优异性能特性的多层电极结构。 例如，多层电极可以包括用于产生电晕放电的高拉伸强度钨芯，导电中间体钯，钯 - 镍或其它铂族金属层，以及包含铑或其它铂族金属或其它铂族金属的合金的硬化层 同样能够抵抗在操作期间积聚在电极表面上的二氧化硅枝晶的去除期间的摩擦磨损。

公开(公告)号：US20110308773A1

公开(公告)日：2011-12-22

申请号：US12819966

申请日：2010-06-21

申请人： Guilian Gao ,  Nels Jewell-Larsen ,  Chung-Chuan Tseng

发明人： Guilian Gao ,  Nels Jewell-Larsen ,  Chung-Chuan Tseng

IPC分类号： H05K7/20 ,  B24B31/00

CPC分类号： B03C3/743 ,  B03C2201/04

摘要： An apparatus for cleaning an emitter electrode in electrohydrodynamic fluid accelerator and precipitator devices via movement of a cleaning device including granular abrasives positioned to frictionally engage the emitter electrode. The cleaning device causes the granular abrasives to travel along a longitudinal extent of the emitter electrode to remove detrimental material accumulated on the electrode. The granular abrasives can be retained in housing, on opposed cleaning surfaces, and can be compressed by the housing or an applied force to abrade detrimental material from the electrode surface.

摘要翻译： 一种用于通过包括定位成摩擦地接合发射电极的颗粒磨料的清洁装置的移动来清洁电动液体加速器和除尘装置中的发射极的装置。 清洁装置使得颗粒磨料沿着发射极的纵向延伸，以去除积聚在电极上的有害材料。 颗粒状研磨剂可以保持在壳体中的相对的清洁表面上，并且可以被壳体或施加的力压缩以从电极表面磨蚀有害材料。

公开(公告)号：US6056189A

公开(公告)日：2000-05-02

申请号：US39096

申请日：1998-03-13

申请人： Guilian Gao ,  Lakhi Nandlal Goenka

发明人： Guilian Gao ,  Lakhi Nandlal Goenka

IPC分类号： B23K1/20 ,  B23K35/36 ,  H05K3/34 ,  B23K31/02

CPC分类号： B23K1/206 ,  B23K35/3618 ,  B23K2201/42 ,  H05K3/3489

摘要： A flux formulation without a surfactant is available for use in the assembly of electronic circuit boards as a no-clean formulation. The formulation includes a flux solution having a fluxing agent consisting essentially of one or more weak organic acids and a solvent consisting essentially of water. The flux solution serves to transport the fluxing agent before deposition thereof upon a soldering site for reliability improvement engendered by a lack of hygroscopic residue and for avoidance of environmental degradation engendered by a lack of volatile organic chemicals (VOC's). The method includes the steps of heating the flux solution and dispersing it as a fine spray.

摘要翻译： 不含表面活性剂的助熔剂配方可用于组装电子电路板作为免清洗配方。 制剂包括助熔剂溶液，其具有基本上由一种或多种弱有机酸组成的助熔剂和基本上由水组成的溶剂。 焊剂溶液用于在其沉积之前将助熔剂输送到焊接位置，以便由于缺乏吸湿残余物而产生的可靠性改进，并避免由于挥发性有机化学物质（VOC）的缺乏引起的环境退化。 该方法包括加热熔剂溶液并将其分散为细喷雾的步骤。