公开(公告)号：US07719121B2

公开(公告)日：2010-05-18

申请号：US11581888

申请日：2006-10-17

申请人： Giles Humpston ,  Guilian Gao ,  Belgacem Haba

发明人： Giles Humpston ,  Guilian Gao ,  Belgacem Haba

IPC分类号： H01L23/48

CPC分类号： H01L23/4985 ,  H01L23/49811 ,  H01L24/48 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/3011 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package includes a microelectronic element having contacts, a flexible substrate spaced from and overlying the microelectronic element and a plurality of conductive posts extending from the flexible substrate and projecting away from the microelectronic element. The conductive posts are electrically interconnected with the microelectronic element. Each conductive post has a conductive base that is in contact with the flexible substrate and a conductive tip that extends from the base, with the base of the conductive post having a larger diameter than the tip of the conductive post. In certain embodiments, the conductive base and the conductive tip have a cylindrical shape.

摘要翻译： 微电子封装包括具有触点的微电子元件，与微电子元件隔开并覆盖的柔性基板以及从柔性基板延伸并远离微电子元件突出的多个导电柱。 导电柱与微电子元件电互连。 每个导电柱具有与柔性基板接触的导电基底和从基部延伸的导电尖端，导电柱的基部具有比导电柱的尖端更大的直径。 在某些实施例中，导电基底和导电尖端具有圆柱形形状。

公开(公告)号：US20080088033A1

公开(公告)日：2008-04-17

申请号：US11581888

申请日：2006-10-17

申请人： Giles Humpston ,  Guilian Gao ,  Belgacem Haba

发明人： Giles Humpston ,  Guilian Gao ,  Belgacem Haba

IPC分类号： H01L23/48

CPC分类号： H01L23/4985 ,  H01L23/49811 ,  H01L24/48 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/3011 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package includes a microelectronic element having contacts, a flexible substrate spaced from and overlying the microelectronic element and a plurality of conductive posts extending from the flexible substrate and projecting away from the microelectronic element. The conductive posts are electrically interconnected with the microelectronic element. Each conductive post has a conductive base that is in contact with the flexible substrate and a conductive tip that extends from the base, with the base of the conductive post having a larger diameter than the tip of the conductive post. In certain embodiments, the conductive base and the conductive tip have a cylindrical shape.

摘要翻译： 微电子封装包括具有触点的微电子元件，与微电子元件隔开并覆盖的柔性基板以及从柔性基板延伸并远离微电子元件突出的多个导电柱。 导电柱与微电子元件电互连。 每个导电柱具有与柔性基板接触的导电基底和从基部延伸的导电尖端，导电柱的基部具有比导电柱的尖端更大的直径。 在某些实施例中，导电基底和导电尖端具有圆柱形形状。

公开(公告)号：US20110006432A1

公开(公告)日：2011-01-13

申请号：US12670952

申请日：2008-07-25

申请人： Belgacem Haba ,  Giles Humpston ,  David Ovrutsky ,  Laura Mirkarimi

发明人： Belgacem Haba ,  Giles Humpston ,  David Ovrutsky ,  Laura Mirkarimi

IPC分类号： H01L23/538 ,  H01L21/50

CPC分类号： H01L21/50 ,  H01L24/24 ,  H01L24/96 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/04105 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/00

摘要： A stacked microelectronic unit is provided which can include a plurality of vertically stacked microelectronic elements (12, 12A) each having a front surface (117), contacts (22) exposed at the front surface, a rear surface (118) and edges (18, 20) extending between the front and rear surfaces. Traces (24) connected with the contacts may extend along the front surfaces towards edges of the microelectronic elements with the rear surface of at least one of the stacked microelectronic elements being adjacent to a top face (90) of the microelectronic unit. A plurality of conductors (66) may extend along edges of the microelectronic elements from the traces (24) to the top face (90). The conductors may be conductively connected with unit contacts (76) such that the unit contacts overlie the rear surface (118) of the at least one microelectronic element (12A) adjacent to the top face.

摘要翻译： 提供堆叠的微电子单元，其可以包括多个垂直堆叠的微电子元件（12,12A），每个微电子元件具有前表面（117），在前表面暴露的触点（22），后表面（118）和边缘（18 ，20）在前表面和后表面之间延伸。 与触点连接的轨迹（24）可以沿着前表面朝着微电子元件的边缘延伸，其中至少一个堆叠的微电子元件的后表面与微电子单元的顶面（90）相邻。 多个导体（66）可以沿着微电子元件的边缘从迹线（24）延伸到顶面（90）。 导体可以与单元触点（76）导电连接，使得单元触点覆盖邻近顶面的至少一个微电子元件（12A）的后表面（118）。

公开(公告)号：US07793414B2

公开(公告)日：2010-09-14

申请号：US11642570

申请日：2006-12-20

申请人： Belgacem Haba ,  Masud Beroz ,  David B. Tuckerman ,  Giles Humpston ,  Richard Dewitt Crisp

发明人： Belgacem Haba ,  Masud Beroz ,  David B. Tuckerman ,  Giles Humpston ,  Richard Dewitt Crisp

IPC分类号： H01R9/00 ,  H01R12/04

CPC分类号： H01L23/49838 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/115 ,  H05K3/041 ,  H05K3/06 ,  H05K3/202 ,  H05K3/4038 ,  H05K2201/09609 ,  H05K2201/097 ,  H05K2201/09827 ,  H05K2201/09881 ,  H05K2203/0733 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49165 ,  H01L2924/00

摘要： Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through the surfaces. Also included is a plurality of electrically conductive posts. Each post extends from a base to a tip located within a corresponding hole of the substrate. An additional substrate may be provided such that the base of each post is located on a surface thereof. Additional electrically conductive posts may be provided having tips in corresponding holes of the additional substrate. Optionally, a dielectric material may be placed between the substrate and the posts.

摘要翻译： 提供了用于微电子器件的连接结构和用于形成结构的方法。 包括具有相对表面的基板和延伸穿过该表面的多个孔。 还包括多个导电柱。 每个柱从基部延伸到位于基板的相应孔内的尖端。 可以提供另外的基底，使得每个柱的基部位于其表面上。 可以提供额外的导电柱，其具有在附加衬底的相应孔中的尖端。 可选地，介电材料可以放置在基板和柱之间。

公开(公告)号：US20080191300A1

公开(公告)日：2008-08-14

申请号：US12004149

申请日：2007-12-20

申请人： Michael J. Nystrom ,  David B. Tuckerman ,  Belgacem Haba ,  Giles Humpston ,  Jesse Burl Thompson

发明人： Michael J. Nystrom ,  David B. Tuckerman ,  Belgacem Haba ,  Giles Humpston ,  Jesse Burl Thompson

IPC分类号： H01L27/146

CPC分类号： H01L27/14636 ,  H01L27/14618 ,  H01L27/14683 ,  H01L31/0203 ,  H01L31/0232 ,  H01L2224/48091 ,  H01L2224/73265 ,  H04N5/2253 ,  H04N5/2257 ,  H01L2924/00014

摘要： The present invention relates to a camera module. The camera module includes a circuit panel having a top side, a bottom side and transparent region, the circuit panel having conductors. The module further includes sensor unit disposed on the bottom side of the circuit panel, and the sensor unit includes a semiconductor chip having a front surface including an imaging area facing in a forward direction in alignment with the transparent region and an imaging circuit adapted to generate signals representative of an optical image impinging on the imaging area. The module further includes posts protruding from the bottom side of the circuit panel, wherein at least some of the posts being engagement posts having bottom surfaces, and at least some of the bottom surfaces abutting an engagement surface of the sensor unit.

摘要翻译： 本发明涉及摄像机模块。 相机模块包括具有顶侧，底侧和透明区域的电路板，电路板具有导体。 该模块还包括设置在电路板的底侧上的传感器单元，并且传感器单元包括半导体芯片，该半导体芯片具有前表面，该前表面包括与透明区域对准的向前方向的成像区域和适于 产生表示入射到成像区域上的光学图像的信号。 模块还包括从电路板的底侧突出的柱，其中至少一些柱是具有底表面的接合柱，并且至少一些底表面邻接传感器单元的接合表面。

公开(公告)号：US20070145536A1

公开(公告)日：2007-06-28

申请号：US11318815

申请日：2005-12-27

申请人： Michael Nystrom ,  Belgacem Haba ,  Giles Humpston

发明人： Michael Nystrom ,  Belgacem Haba ,  Giles Humpston

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L23/3114 ,  H01L23/525 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00

摘要： A compliant structure is provided on a semiconductor wafer. The compliant structure includes cavities. The compliant structure and the wafer seal the cavities during process steps used to form conductive elements on the compliant structure. After processing, vents are opened to connect the cavities to the exterior of the assembly. The vents may be formed by severing the wafer and compliant structure to form individual units, so that the severance planes intersect channels or other voids communicating with the cavities. Alternatively, the vents may be formed by forming holes in the compliant structure, or by opening bores extending through the wafer.

摘要翻译： 在半导体晶片上提供柔性结构。 顺应结构包括腔。 顺应结构和晶片在用于在柔性结构上形成导电元件的工艺步骤期间密封空腔。 处理后，通风口打开，将空腔连接到组件的外部。 通孔可以通过切断晶片和柔顺结构以形成单独的单元而形成，使得分离平面与通道或与空腔连通的其它空隙相交。 或者，可以通过在柔性结构中形成孔或通过打开延伸穿过晶片的孔而形成通气口。

公开(公告)号：US20060032670A1

公开(公告)日：2006-02-16

申请号：US10917978

申请日：2004-08-13

申请人： Belgacem Haba ,  Masud Beroz ,  David Tuckerman ,  Giles Humpston ,  Richard Crisp

发明人： Belgacem Haba ,  Masud Beroz ,  David Tuckerman ,  Giles Humpston ,  Richard Crisp

IPC分类号： H05K1/14

CPC分类号： H01L23/49838 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/115 ,  H05K3/041 ,  H05K3/06 ,  H05K3/202 ,  H05K3/4038 ,  H05K2201/09609 ,  H05K2201/097 ,  H05K2201/09827 ,  H05K2201/09881 ,  H05K2203/0733 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49165 ,  H01L2924/00

摘要： Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through the surfaces. Also included is a plurality of electrically conductive posts. Each post extends from a base to a tip located within a corresponding hole of the substrate. An additional substrate may be provided such that the base of each post is located on a surface thereof. Additional electrically conductive posts may be provided having tips in corresponding holes of the additional substrate. Optionally, a dielectric material may be placed between the substrate and the posts.

摘要翻译： 提供了用于微电子器件的连接结构和用于形成结构的方法。 包括具有相对表面的基板和延伸穿过该表面的多个孔。 还包括多个导电柱。 每个柱从基部延伸到位于基板的相应孔内的尖端。 可以提供另外的基底，使得每个柱的基部位于其表面上。 可以提供额外的导电柱，其具有在附加衬底的相应孔中的尖端。 可选地，介电材料可以放置在基板和柱之间。

公开(公告)号：US20050087861A1

公开(公告)日：2005-04-28

申请号：US10949844

申请日：2004-09-24

申请人： Robert Burtzlaff ,  Belgacem Haba ,  Giles Humpston ,  David Tuckerman ,  Michael Warner ,  Craig Mitchell

发明人： Robert Burtzlaff ,  Belgacem Haba ,  Giles Humpston ,  David Tuckerman ,  Michael Warner ,  Craig Mitchell

IPC分类号： H01L21/60 ,  H01L23/04 ,  H01L23/10 ,  H01L23/485 ,  H01L27/146 ,  H03H3/007 ,  H03H3/08 ,  H03H9/10 ,  H01L21/44 ,  H01L23/52

CPC分类号： H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion of the front surface of the chip, the lid having a top surface facing upwardly away from the chip and unit connections exposed at the top surface of the lid. At least some of the unit connections are electrically connected to the chip. The packaged microelectronic device also includes a package structure including structure defining package terminals, at least some of the package terminals being electrically connected to the chip. The package structure, the unit or both define a downwardly-facing bottom surface of the package, the terminals being exposed at the bottom surface.

摘要翻译： 提供一种封装的微电子器件，其包括：（a）具有面向上的前表面和面向下的后表面的芯片的单元，覆盖所述芯片的前表面的至少一部分的盖，所述盖具有 面向上远离芯片的顶表面和暴露在盖的顶表面处的单元连接。 至少一些单元连接电连接到芯片。 封装的微电子器件还包括包括限定封装端子的结构的封装结构，至少一些封装端子电连接到芯片。 封装结构，单元或两者限定了封装的向下的底部表面，端子在底部表面露出。

公开(公告)号：US20050082654A1

公开(公告)日：2005-04-21

申请号：US10949575

申请日：2004-09-24

申请人： Giles Humpston ,  Belgacem Haba

发明人： Giles Humpston ,  Belgacem Haba

IPC分类号： H01L21/60 ,  H01L23/04 ,  H01L23/10 ,  H01L23/485 ,  H01L27/146 ,  H03H3/007 ,  H03H3/08 ,  H03H9/10 ,  H01L23/02

CPC分类号： H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A method of making the lidded chip assembly are provided which includes the steps of: (a) aligning a lid member with a chip member including one or more chips so that electrically conductive elements projecting from a front surface of the chip-member extend into through-holes in the lid member and at least partially control location of the lid member relative to the chip member in one or more horizontal directions parallel to the front surface; and (b) forming interconnections extending through the lid member so that the interconnections include the conductive elements. A capped chip is provided in which the conductive interconnects extend from the chip through openings in a cap member, the openings being tapered to become smaller in a direction from the bottom or inner surface of the opening towards the top or outer surface.

摘要翻译： 提供了一种制造带盖芯片组件的方法，其包括以下步骤：（a）将盖构件与包括一个或多个芯片的芯片构件对准，使得从芯片构件的前表面突出的导电元件延伸穿过 并且在平行于前表面的一个或多个水平方向上至少部分地控制盖构件相对于芯片构件的位置; 和（b）形成延伸穿过盖构件的互连，使得互连包括导电元件。 提供了一种封盖芯片，其中导电互连件从芯片通过盖构件中的开口延伸，开口在从开口的底部或内表面朝向顶部或外表面的方向上逐渐变细。

公开(公告)号：US20130056241A1

公开(公告)日：2013-03-07

申请号：US13302811

申请日：2011-11-22

申请人： Guilian Gao ,  Nels Jewell-Larsen ,  Giles Humpston

发明人： Guilian Gao ,  Nels Jewell-Larsen ,  Giles Humpston

IPC分类号： H01B5/00 ,  F28F13/00 ,  F04B19/00 ,  B05D5/12

CPC分类号： B03C3/60 ,  B03C3/41 ,  B03C2201/04 ,  B03C2201/14

摘要： By selecting different materials for each layer, a multi-layered electrode structure can be made with superior performance characteristics. For example, a multilayered electrode can include a high tensile strength tungsten core, a conductive intermediate palladium, palladium-nickel, or other platinum group metal layer for generating a corona discharge, and a hardened layer comprising rhodium or other platinum group metal or alloy of the same to resist frictional abrasion during removal of silica dendrites that accumulate on the electrode surface during operation.

摘要翻译： 通过为每层选择不同的材料，可以制造具有优异性能特性的多层电极结构。 例如，多层电极可以包括用于产生电晕放电的高拉伸强度钨芯，导电中间体钯，钯 - 镍或其它铂族金属层，以及包含铑或其它铂族金属或其它铂族金属的合金的硬化层 同样能够抵抗在操作期间积聚在电极表面上的二氧化硅枝晶的去除期间的摩擦磨损。