摘要:
A memory cell array includes a plurality of memory cells each of which has a control gate and a floating gate. A programming circuit operates in a first programming mode followed by a second programming mode. In the first programming mode, the programming circuit applies a first program pulse to first memory cells while progressively increasing a programming capability of the first program pulse until threshold voltages of the first memory cells become higher than or equal to a first reference voltage. In the second programming mode, the programming circuit applies a second program pulse to second memory cells included in the first memory cells and having threshold voltages lower than a second reference voltage that is higher than the first reference voltage until the threshold voltages of the second memory cells become higher than or equal to the second reference voltage.
摘要:
A semiconductor memory is provided with a memory cell region and a peripheral circuit region. The memory cell region includes semiconductor memory cells arranged in an array and element separating shield electrodes. The element separating shield electrodes extend in a column direction and separate semiconductor memory cells being adjacent to each other in a row direction. Further, a peripheral circuit sending and receiving data to and from the semiconductor memory cell is provided in the peripheral circuit region. Elements in the peripheral circuit are separated by an element separation insulating film. The element separating shield electrodes extend onto the element separation insulating film at a boundary between the memory cell region and the peripheral circuit region.
摘要:
In a semiconductor device having a high voltage transistor, a first well region of the high voltage transistor is formed in a semiconductor substrate as a channel region. The first well region has a first conductive type. Second well regions of the high voltage transistor are formed in the semiconductor substrate as a source region and a drain region to sandwich the first well region. The second well region has a second conductive type. A surface of the first region and surfaces of the second well regions have a flat plane.
摘要:
Disclosed herein is a stacked gate type non-volatile semiconductor memory cell including source/drain regions having a first portion covered with a tunnel oxide film and a second portion covered with an insulator film. The memory cell further includes a gate insulating film formed on a channel region, wherein the tunnel insulating film is thinner than the gate oxide film and the insulator film is thicker than the gate insulating film. A floating gate is formed on the respective insulating films and a control gate is formed over the floating gate with an intervention of a second gate insulating film.
摘要:
A semiconductor memory device with a contactless array structure has bit-lines formed in a semiconductor substrate by diffusion of an impurity. Word-lines (control gates) are formed on the substrate so as to intersect the bit-lines. Floating gates are disposed in intersecting regions between the bit- and word-lines. Regions of higher resistance extend in parallel to the bit-lines located on both sides of a floating gates and located in an offset manner relative to the floating gate. A thick dielectric film is formed between the regions of higher resistance and word-lines. In this semiconductor memory device, a source side injection method with higher efficiency can be utilized for electron injection to a floating gate (programming) and thereby a lower programming voltage, less power consumption, and higher degree of integration are achieved.
摘要:
A memory device includes a plurality of gate electrode layers stacked on a substrate, a plurality of channel layers penetrating the plurality of gate electrode layers, a gate insulating layer between the plurality of gate electrode layers and the plurality of channel layers, and a common source line on the substrate adjacent to the gate electrode layers. The common source line includes a first part and a second part that are alternately arranged in a first direction and have different heights in a direction vertical to a top surface of the substrate. The gate insulating layer includes a plurality of vertical parts and a horizontal part. The plurality of vertical parts surrounds corresponding ones of the plurality of channel layers. The horizontal part extends parallel to a top surface of the substrate.
摘要:
A vertical memory device includes a substrate, a channel on the substrate, extending in a vertical direction with respect to a top surface of the substrate, and including a protrusion at a lower portion of the channel, the protrusion extending in a parallel direction with respect to the top surface of the substrate, a semiconductor pattern connecting the protrusion and the substrate, and gate lines stacked and spaced apart from each other in the vertical direction, the gate lines on the protrusion and the semiconductor pattern and surrounding the channel.
摘要:
A semiconductor device including memory cells isolated by a trench that may be self aligned with a stacked film pattern (7) has been disclosed. The memory cells may be flash memory cells having an active gate film (2) that may be thinner than a gate oxide film (30). The active gate film (2) may be located in a central portion under of a gate electrode (3). The gate oxide film (30) may be located under end portions of the gate electrode (3). In this way, a distance between a shoulder portion of a trench (11) and a gate electrode (3) may be increased. Thus, an electric field concentration in the shoulder portion of the trench (11) may be decreased and memory cell characteristics may be improved.
摘要:
Provided is a highly reliable multi-bit memory cell capable of miniaturization including: a semiconductor substrate with a channel formed therein; diffusion layers arranged at two sides of the channel, for serving as source/drain; an insulating film arranged on a part of the channel; a trap film made of an insulating material having an electron trapping characteristic, arranged on the semiconductor substrate, the diffusion layers and the insulating film, and including trap regions each capable of trapping electrons in at least areas in contact with the semiconductor substrate at two sides of the insulating film; and a gate electrode arranged on the trap film. The trap regions are also formed on side surfaces of the insulating film, and the trap film has a structure in which the trap film is bent upward from the surface of the semiconductor substrate in the trap regions due to the insulating film.
摘要:
According to the present invention, a gettering layer is deposited both on the side surfaces and the bottom surface of a semiconductor chip. The semiconductor chip is then mounted on the board of a package so that a Schottky barrier is formed on the bottom surface. With this structure, metal ions that pass through the board of the package can be captured by the defect layer deposited on the side surfaces and/or the bottom surface of the semiconductor chip, and by the Schottky barrier.