公开(公告)号：US20170058107A1

公开(公告)日：2017-03-02

申请号：US15351151

申请日：2016-11-14

Applicant: LG Innotek Co., Ltd.

Inventor： Sang A Ju ,  Hyun Gu Im ,  Jae Man Park

IPC: C08K9/06 ,  C08L63/00 ,  H05K1/02 ,  H01L33/64 ,  H05K1/03 ,  C08K3/38 ,  C08L83/08

CPC classification number: C08K9/06 ,  B05D3/0254 ,  C08K3/22 ,  C08K3/38 ,  C08K9/02 ,  C08K9/08 ,  C08K2003/2227 ,  C08K2003/385 ,  H01L33/641 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0227 ,  C08L63/00

Abstract: An inorganic filler according to an embodiment of the present invention includes a boron nitride agglomerate and a coating layer formed on the boron nitride agglomerate and including a —Si—R—NH2 group, and R is selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, an alkene group having 2 to 3 carbon atoms, and an alkyne group having 2 to 3 carbon atoms.

Abstract translation: 根据本发明的一个实施方案的无机填料包括氮化硼附聚物和形成在氮化硼附聚物上并包含-Si-R-NH 2基团的涂层，R选自具有 1至3个碳原子，具有2至3个碳原子的烯烃基和具有2至3个碳原子的炔基。

公开(公告)号：US09282637B2

公开(公告)日：2016-03-08

申请号：US13968812

申请日：2013-08-16

Applicant: LG INNOTEK CO., LTD.

Inventor： Sung Jin Yun ,  Hyuk Soo Lee ,  In Hee Cho ,  Jae Man Park ,  Myeong Jeong Kim ,  Jong Heum Yoon ,  Jeung Ook Park ,  Jong Sik Lee ,  Gun Young Gil ,  Thanh Kieu Giang ,  Jin Hwan Kim

IPC: B32B27/38 ,  H05K1/02 ,  H05K1/03 ,  C08G59/28 ,  C08G59/30 ,  C08L63/00 ,  H05K1/05 ,  C08K3/00

CPC classification number: H05K1/0373 ,  C08G59/28 ,  C08G59/30 ,  C08K3/013 ,  C08L63/00 ,  H05K1/0203 ,  H05K1/056 ,  H05K2201/0209 ,  C08K3/0033

Abstract: There is provided an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler. Also, there is provided a radiant heat circuit board including a metal plate, an insulating layer formed on the metal plate; and a circuit pattern formed on the insulating layer, in which the insulting layer is formed by curing an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler.

Abstract translation: 提供了包含环氧树脂的环氧树脂化合物，该环氧树脂包括结晶环氧树脂，固化剂和无机填料。 另外，提供了一种辐射热电路板，其包括金属板，形成在金属板上的绝缘层; 以及形成在绝缘层上的电路图案，其中通过固化包括结晶环氧树脂，固化剂和无机填料的环氧树脂的环氧树脂化合物来形成绝缘层。

公开(公告)号：US09000071B2

公开(公告)日：2015-04-07

申请号：US13872682

申请日：2013-04-29

Applicant: LG Innotek Co., Ltd.

Inventor： Jae Man Park ,  Hae Yeon Kim ,  SungBae Moon ,  Jeungook Park ,  SungJin Yun ,  JongHeum Yoon ,  Hyuk Soo Lee ,  Jaehun Jeong ,  In Hee Cho

IPC: C08L63/00 ,  C07D303/46 ,  H05K1/05 ,  C08G59/28

CPC classification number: C08L63/00 ,  C07D303/46 ,  C08G59/28 ,  H05K1/05

Abstract: An epoxy resin compound including an epoxy resin, a hardening agent, and an inorganic filler as a main component is provided. The epoxy resin includes an epoxy resin represented by a chemical formula. Therefore, the epoxy resin having a mesogen structure that increases crystallinity is used, and thus thermal conductivity can be increased. Further, the epoxy resin is used as an insulating material for a printed circuit board, and thus a high radiant heat substrate can be provided.

Abstract translation: 提供包含环氧树脂，硬化剂和无机填料作为主要成分的环氧树脂化合物。 环氧树脂包括由化学式表示的环氧树脂。 因此，使用具有提高结晶性的介晶结构的环氧树脂，因此可以提高导热性。 此外，环氧树脂用作印刷电路板的绝缘材料，因此可以提供高辐射热衬底。