公开(公告)号：US11367849B2

公开(公告)日：2022-06-21

申请号：US16232041

申请日：2018-12-25

Applicant: Lextar Electronics Corporation

Inventor： Hui-Ru Wu ,  Jian-Chin Liang ,  Jo-Hsiang Chen ,  Lung-Kuan Lai ,  Cheng-Yu Tsai ,  Hsin-Lun Su ,  Ting-Kai Chen

IPC: H01L51/50 ,  H01L51/52 ,  H01L33/60

Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.

公开(公告)号：US11961951B2

公开(公告)日：2024-04-16

申请号：US17383402

申请日：2021-07-22

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao Lin ,  Jian-Chin Liang ,  Shih-Lun Lai ,  Jo-Hsiang Chen

IPC: H01L33/62 ,  H01L25/16 ,  H01L33/10 ,  H01L33/22 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L25/165 ,  H01L25/167 ,  H01L33/10 ,  H01L33/22 ,  H01L33/54

Abstract: A light emitting diode device includes a substrate, a conductive via, first and second conductive pads, a driving chip, a flat layer, a redistribution layer, a light emitting diode, and an encapsulating layer. The substrate has a first surface and a second surface opposite thereto. The conductive via penetrates from the first surface to the second surface. The first and second conductive pads are respectively disposed on the first and second surface and in contact with the conductive via. The driving chip is disposed on the first surface. The flat layer is disposed over the first surface and covers the driving chip and the first conductive pad. The redistribution layer is disposed on the flat layer and electrically connects to the driving chip. The light emitting diode is flip-chip bonded to the redistribution layer. The encapsulating layer covers the redistribution layer and the light emitting diode.

公开(公告)号：US11670749B2

公开(公告)日：2023-06-06

申请号：US17653462

申请日：2022-03-03

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao Lin ,  Jo-Hsiang Chen ,  Shih-Lun Lai ,  Min-Che Tsai ,  Jian-Chin Liang

IPC: H01L33/62 ,  H01L33/58 ,  H01L33/00

CPC classification number: H01L33/62 ,  H01L33/0095 ,  H01L33/58 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A method for manufacturing a light emitting diode packaging structure includes the operations below. A flexible substrate having a first surface and a second surface is provided. A carrier substrate is formed on the first surface. An adhesive layer is formed on the second surface. A micro light emitting element is formed on the adhesive layer. The micro light emitting element has a conductive pad thereon opposite to the adhesive layer. A redistribution layer is formed and covers the micro light emitting element and the adhesive layer, wherein the redistribution layer includes a circuit layer electrically connecting to the conductive pad and an insulating layer covering the circuit layer. An electrode pad is formed on the redistribution layer and electrically connected to the circuit layer, wherein a total thickness of the flexible substrate, the adhesive layer, the redistribution layer, and the electrode pad is less than 200 um.

公开(公告)号：US11552222B2

公开(公告)日：2023-01-10

申请号：US16879787

申请日：2020-05-21

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao Lin ,  Hui-Ru Wu ,  Jo-Hsiang Chen ,  Jian-Chin Liang ,  Ai-Sen Liu

IPC: H01L33/50 ,  H01L33/60 ,  H01L25/075

Abstract: The display device includes a substrate, a patterned wall, the first, second, third sub-pixels, and an optical layer. The patterned wall is disposed on the substrate and has a plurality of openings. The first sub-pixel is disposed in one of the openings and includes a light-emitting element and a wavelength conversion layer. The second sub-pixel is disposed in one of the openings and includes a light-emitting element and a wavelength conversion layer. The third sub-pixel is disposed in one of the openings and includes a light-emitting element and a wavelength conversion layer, wherein a first distance between a top surface of the light-emitting element and a top surface of the patterned wall is about 10 um to about 100 um. The optical layer is disposed on the patterned wall and in direct contact with at least one of the first sub-pixel, the second sub-pixel, and the third sub-pixel.

公开(公告)号：US10811396B2

公开(公告)日：2020-10-20

申请号：US16252690

申请日：2019-01-20

Applicant: Lextar Electronics Corporation

Inventor： Cheng-Yu Tsai ,  Jian-Chin Liang ,  Jo-Hsiang Chen

IPC: H01J1/62 ,  H01J63/04 ,  G02B5/02 ,  G02F1/1335 ,  G02B5/30 ,  H01L25/075 ,  G02B1/11 ,  H01L33/58 ,  H01L33/48

Abstract: A display device includes a substrate, a light-emitting member, and an anti-reflective glass layer. The light-emitting member is on the substrate. The anti-reflective glass layer is over the light-emitting member, and the anti-reflective glass layer has a transmittance of 40-95%. The anti-reflective glass layer includes a glass layer and a light-absorbing layer. The glass layer has a rough top surface and a haze of 70-80%. The light-absorbing layer is on the rough top surface of glass layer.