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公开(公告)号：US20250140774A1
公开(公告)日：2025-05-01
申请号：US19011500
申请日：2025-01-06
Applicant: Micron Technology, Inc.
Inventor： Cem Basceri , Casey Kurth , Kevin Tetz
IPC: H01L25/00 , H01L25/075 , H05K1/02 , H05K1/03 , H10H20/01 , H10H20/831 , H10H20/85 , H10H20/851 , H10H20/857
Abstract: Solid state lights (SSLs) including a back-to-back solid state emitters (SSEs) and associated methods are disclosed herein. In various embodiments, an SSL can include a carrier substrate having a first surface and a second surface different from the first surface. First and second through substrate interconnects (TSIs) can extend from the first surface of the carrier substrate to the second surface. The SSL can further include a first and a second SSE, each having a front side and a back side opposite the front side. The back side of the first SSE faces the first surface of the carrier substrate and the first SSE is electrically coupled to the first and second TSIs. The back side of the second SSE faces the second surface of the carrier substrate and the second SSE is electrically coupled to the first and second TSIs.
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12.发明公开公开(公告)号：US20230420602A1
公开(公告)日：2023-12-28
申请号：US18464789
申请日：2023-09-11
Applicant: Micron Technology, Inc.
Inventor： Kevin Tetz , Charles M. Watkins
CPC classification number: H01L33/005 , B05C11/00
Abstract: Several embodiments of semiconductor systems and associated methods of color corrections are disclosed herein. In one embodiment, a method for producing a light emitting diode (LED) includes forming an (LED) on a substrate, measuring a base emission characteristic of the formed LED, and selecting a phosphor based on the measured base emission characteristic of the formed LED such that a combined emission from the LED and the phosphor at least approximates white light. The method further includes introducing the selected phosphor onto the LED via, for example, inkjet printing.
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公开(公告)号：US20220158066A1
公开(公告)日：2022-05-19
申请号：US17588576
申请日：2022-01-31
Applicant: Micron Technology, Inc.
Inventor： Kevin Tetz , Charles M. Watkins
Abstract: Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.
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公开(公告)号：US20210057621A1
公开(公告)日：2021-02-25
申请号：US17011915
申请日：2020-09-03
Applicant: Micron Technology, Inc.
Inventor： Martin F. Schubert , Kevin Tetz
Abstract: Solid state lighting (SSL) devices and methods of manufacturing SSL devices are disclosed herein. In one embodiment, an SSL device comprises a support having a surface and a solid state emitter (SSE) at the surface of the support. The SSE can emit a first light propagating along a plurality of first vectors. The SSL device can further include a converter material over at least a portion of the SSE. The converter material can emit a second light propagating along a plurality of second vectors. Additionally, the SSL device can include a lens over the SSE and the converter material. The lens can include a plurality of diffusion features that change the direction of the first light and the second light such that the first and second lights blend together as they exit the lens. The SSL device can emit a substantially uniform color of light.
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公开(公告)号：US10243120B2
公开(公告)日：2019-03-26
申请号：US15982330
申请日：2018-05-17
Applicant: Micron Technology, Inc.
Inventor： Martin F. Schubert , Kevin Tetz
Abstract: Solid state lighting (SSL) devices and methods of manufacturing SSL devices are disclosed herein. In one embodiment, an SSL device comprises a support having a surface and a solid state emitter (SSE) at the surface of the support. The SSE can emit a first light propagating along a plurality of first vectors. The SSL device can further include a converter material over at least a portion of the SSE. The converter material can emit a second light propagating along a plurality of second vectors. Additionally, the SSL device can include a lens over the SSE and the converter material. The lens can include a plurality of diffusion features that change the direction of the first light and the second light such that the first and second lights blend together as they exit the lens. The SSL device can emit a substantially uniform color of light.
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Patent Agency Ranking
公开(公告)号：US20190058097A1
公开(公告)日：2019-02-21
申请号：US16167172
申请日：2018-10-22
Applicant: Micron Technology, Inc.
Inventor： Martin F. Schubert , Kevin Tetz
CPC classification number: H01L33/58 , H01L25/0753 , H01L33/007 , H01L33/0095 , H01L33/50 , H01L33/54 , H01L51/5275 , H01L2924/0002 , H01L2933/0083 , H01L2924/00
Abstract: Solid state lighting (SSL) devices and methods of manufacturing SSL devices are disclosed herein. In one embodiment, an SSL device comprises a support having a surface and a solid state emitter (SSE) at the surface of the support. The SSE can emit a first light propagating along a plurality of first vectors. The SSL device can further include a converter material over at least a portion of the SSE. The converter material can emit a second light propagating along a plurality of second vectors. Additionally, the SSL device can include a lens over the SSE and the converter material. The lens can include a plurality of diffusion features that change the direction of the first light and the second light such that the first and second lights blend together as they exit the lens. The SSL device can emit a substantially uniform color of light.
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公开(公告)号：US10002994B2
公开(公告)日：2018-06-19
申请号：US14684192
申请日：2015-04-10
Applicant: Micron Technology, Inc.
Inventor： Martin F. Schubert , Kevin Tetz
CPC classification number: H01L33/58 , H01L25/0753 , H01L33/007 , H01L33/0095 , H01L33/50 , H01L33/54 , H01L51/5275 , H01L2924/0002 , H01L2933/0083 , H01L2924/00
Abstract: Solid state lighting (SSL) devices and methods of manufacturing SSL devices are disclosed herein. In one embodiment, an SSL device comprises a support having a surface and a solid state emitter (SSE) at the surface of the support. The SSE can emit a first light propagating along a plurality of first vectors. The SSL device can further include a converter material over at least a portion of the SSE. The converter material can emit a second light propagating along a plurality of second vectors. Additionally, the SSL device can include a lens over the SSE and the converter material. The lens can include a plurality of diffusion features that change the direction of the first light and the second light such that the first and second lights blend together as they exit the lens. The SSL device can emit a substantially uniform color of light.
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公开(公告)号：US08969899B2
公开(公告)日：2015-03-03
申请号：US13780136
申请日：2013-02-28
Applicant: Micron Technology, Inc.
Inventor： Charles M. Watkins , Kevin Tetz , Thomas Gehrke
CPC classification number: H01L33/44 , H01L33/507 , H01L2933/0041
Abstract: A method and system for manufacturing a light conversion structure for a light emitting diode (LED) is disclosed. The method includes forming a transparent, thermally insulating cover over an LED chip. The method also includes dispensing a conversion material onto the cover to form a conversion coating on the cover, and encapsulating the LED, the silicone cover, and the conversion coating within an encapsulant. Additional covers and conversion coatings can be added.
Abstract translation: 公开了一种用于制造发光二极管（LED）的光转换结构的方法和系统。 该方法包括在LED芯片上形成透明的隔热盖。 该方法还包括将转换材料分配到盖上以在盖上形成转化涂层，并且将密封剂中的LED，硅树脂盖和转化膜封装。 可以添加额外的盖子和转换涂层。
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公开(公告)号：US11757061B2
公开(公告)日：2023-09-12
申请号：US17373200
申请日：2021-07-12
Applicant: Micron Technology, Inc.
Inventor： Kevin Tetz , Charles M. Watkins
CPC classification number: H01L33/005 , B05C11/00
Abstract: Several embodiments of semiconductor systems and associated methods of color corrections are disclosed herein. In one embodiment, a method for producing a light emitting diode (LED) includes forming an (LED) on a substrate, measuring a base emission characteristic of the formed LED, and selecting a phosphor based on the measured base emission characteristic of the formed LED such that a combined emission from the LED and the phosphor at least approximates white light. The method further includes introducing the selected phosphor onto the LED via, for example, inkjet printing.
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公开(公告)号：US11710732B2
公开(公告)日：2023-07-25
申请号：US17330086
申请日：2021-05-25
Applicant: Micron Technology, Inc.
Inventor： Cem Basceri , Casey Kurth , Kevin Tetz
CPC classification number: H01L25/50 , H01L25/0756 , H01L33/382 , H01L33/486 , H01L33/501 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0041 , H05K1/0203 , H05K1/0306 , H05K2201/10106 , H01L2924/0002 , H01L2924/00
Abstract: Solid state lights (SSLs) including a back-to-back solid state emitters (SSEs) and associated methods are disclosed herein. In various embodiments, an SSL can include a carrier substrate having a first surface and a second surface different from the first surface. First and second through substrate interconnects (TSIs) can extend from the first surface of the carrier substrate to the second surface. The SSL can further include a first and a second SSE, each having a front side and a back side opposite the front side. The back side of the first SSE faces the first surface of the carrier substrate and the first SSE is electrically coupled to the first and second TSIs. The back side of the second SSE faces the second surface of the carrier substrate and the second SSE is electrically coupled to the first and second TSIs.
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