公开(公告)号：US20130068515A1

公开(公告)日：2013-03-21

申请号：US13701010

申请日：2011-06-02

申请人： Hiroshi Toyao ,  Manabu Kusumoto ,  Naoki Kobayashi ,  Noriaki Ando

发明人： Hiroshi Toyao ,  Manabu Kusumoto ,  Naoki Kobayashi ,  Noriaki Ando

IPC分类号： H05K1/18 ,  H05K1/11

CPC分类号： H05K1/0236 ,  H05K1/0224

摘要： An electronic apparatus (100) has an electronic device (151), a power supply plane (121) and a power supply plane (122) disposed with a gap (123) therebetween, a connection member (152) that electrically connects the power supply plane (122) and the electronic device (151), a ground plane (141) facing the power supply plane (121) or the power supply plane (122), a connection member (153) that electrically connects the ground plane (141) and the electronic device (151), a plurality of conductor elements (131) that is repeatedly arrayed, and open stubs (111) formed at a location overlapping the gap (123) included in an area surrounded by the conductor elements (131). In addition, at least some of the open stubs (111) face the power supply plane (122) which is not in contact with the open stubs (111).

摘要翻译： 一种电子设备（100），具有电子设备（151），电源平面（121）和设置在其间的间隙（123）的电源平面（122），连接构件（152）将电源 平面（122）和电子设备（151），面对电源平面（121）或电源平面（122）的接地平面（141），将接地平面（141）电连接的连接构件 电子设备（151），重复排列的多个导体元件（131）和形成在与由导体元件（131）包围的区域中的间隙（123）重叠的位置处的开口短截线（111）。 此外，至少一些开放桩（111）面向不与开放桩（111）接触的供电平面（122）。

公开(公告)号：US20130037316A1

公开(公告)日：2013-02-14

申请号：US13583277

申请日：2011-02-18

申请人： Hiroshi Toyao ,  Naoki Kobayashi ,  Noriaki Ando

发明人： Hiroshi Toyao ,  Naoki Kobayashi ,  Noriaki Ando

IPC分类号： H05K1/11

CPC分类号： H05K1/0236 ,  H01P3/00 ,  H05K1/0298

摘要： A structure (10) includes a conductor (151), conductors (111, 131) that are located on the same side with respect to the conductor (151), that are opposed to at least a part of the conductor (151), and that overlap each other when seen in a plan view, a connection member (101) that penetrates the conductors (111, 131, 151), that is connected to the conductor (151), and that is insulated from the conductors (111, 131), openings (112, 132) that are formed in the conductors (111, 131), respectively, and which the connection member (101) passes through, and conductor elements (121, 141) that are formed to be opposed to the openings (112, 132), that are connected to the connection member (101) passing through the openings (112, 132), and that are larger than the openings (112, 132). The number of layers in which the conductor elements (121, 141) are located is two or more and less than or equal to the number of layers in which the conductors (111, 131) are located.

摘要翻译： 结构（10）包括导体（151），相对于导体（151）位于同一侧的与导体（151）的至少一部分相对的导体（111,131），以及 在平面图中看到彼此重叠的连接构件（101），其连接到与导体（151）连接并且与导体（111,131）绝缘的导体（111,131,151） ），分别形成在导体（111,131）中并且连接构件（101）通过的开口（112,132）以及形成为与开口相对的导体元件（121,141） （112,132），其连接到穿过所述开口（112,132）的所述连接构件（101），并且大于所述开口（112,132）。 导体元件（121,141）所在的层数为两个以上且小于等于导体（111,131）所在的层数。

公开(公告)号：US09000307B2

公开(公告)日：2015-04-07

申请号：US13583485

申请日：2011-02-18

申请人： Hiroshi Toyao ,  Naoki Kobayashi ,  Noriaki Ando

发明人： Hiroshi Toyao ,  Naoki Kobayashi ,  Noriaki Ando

IPC分类号： H05K1/11 ,  H05K1/03 ,  H05K1/09 ,  H05K1/14 ,  H01K3/10 ,  H05K1/02 ,  H01P3/00

CPC分类号： H05K1/0236 ,  H01P3/00 ,  H05K1/024 ,  H05K1/0298 ,  H05K1/115 ,  Y10T29/49165

摘要： The disclosed structure (10) is provided with: at least three conductors (111, 131, 151) which face one-another; a through-via (101) which passes through each of the conductors (111, 131, 151); openings (112, 152) which are provided so as to surround the circumference of the through-via (101); and conductor elements (121, 141) which are located in different layers to those in which the conductors (111, 131, 151) are located, and which are connected to the through-via (101). Facing opening 112 is conductor element 121, which is larger than said opening (112), and facing opening 152 is conductor element 141, which is larger than said opening (152).

摘要翻译： 所公开的结构（10）设置有：至少三个彼此面对的导体（111,131,151）; 穿过每个导体（111,131,151）的通孔（101）; 设置成围绕通孔（101）的圆周的开口（112,152）; 以及导体元件（121,141），它们位于与导体（111,131,151）所在的不同的层中，并且连接到通孔（101）。 面对开口112是大于所述开口（112）的导体元件121，并且面对的开口152是大于所述开口（152）的导体元件141。

公开(公告)号：US20120325544A1

公开(公告)日：2012-12-27

申请号：US13583485

申请日：2011-02-18

申请人： Hiroshi Toyao ,  Naoki Kobayashi ,  Noriaki Ando

发明人： Hiroshi Toyao ,  Naoki Kobayashi ,  Noriaki Ando

IPC分类号： H05K1/11 ,  H01K3/10

CPC分类号： H05K1/0236 ,  H01P3/00 ,  H05K1/024 ,  H05K1/0298 ,  H05K1/115 ,  Y10T29/49165

摘要： The disclosed structure (10) is provided with: at least three conductors (111, 131, 151) which face one-another; a through-via (101) which passes through each of the conductors (111, 131, 151); openings (112, 152) which are provided so as to surround the circumference of the through-via (101); and conductor elements (121, 141) which are located in different layers to those in which the conductors (111, 131, 151) are located, and which are connected to the through-via (101). Facing opening 112 is conductor element 121, which is larger than said opening (112), and facing opening 152 is conductor element 141, which is larger than said opening (152).

摘要翻译： 所公开的结构（10）设置有：至少三个彼此面对的导体（111,131,151）; 穿过每个导体（111,131,151）的通孔（101）; 设置成围绕通孔（101）的圆周的开口（112,152）; 以及导体元件（121,141），它们位于与导体（111,131,151）所在的不同的层中，并且连接到通孔（101）。 面对开口112是大于所述开口（112）的导体元件121，并且面对的开口152是大于所述开口（152）的导体元件141。

公开(公告)号：US09357633B2

公开(公告)日：2016-05-31

申请号：US13583168

申请日：2011-02-07

申请人： Naoki Kobayashi ,  Hiroshi Toyao ,  Noriaki Ando

发明人： Naoki Kobayashi ,  Hiroshi Toyao ,  Noriaki Ando

IPC分类号： H05K1/11 ,  H05K1/00 ,  H05K1/03 ,  H01K3/10 ,  H05K1/02 ,  H01Q15/00 ,  H01P1/20

CPC分类号： H05K1/0236 ,  H01P1/2005 ,  H01Q15/006 ,  H01Q15/008 ,  Y10T29/49165

摘要： A structure (100) includes ground conductive bodies (111 and 141) that are formed in an A layer (110) and a D layer (140) that face each other, a connection member (151) that connects between the ground conductive bodies (111 and 141), a conductive part (131) that is formed in a C layer (130) and faces the ground conductive bodies (111 and 141), and an opening (132), through which the connection member (151) passes through, disposed in the conductive part (131), and a conductive element (121) that is formed in a B layer (120), faces the conductive part (131), and is electrically connected to the connection member (151) that passes through an opening (132) disposed in the conductive part (131).

摘要翻译： 结构（100）包括形成在相互面对的A层（110）和D层（140）中的接地导电体（111和141），连接在接地导体之间的连接构件（151） 111和141），形成在C层（130）中并且面对接地导电体（111和141）的导电部分（131）和连接构件（151）穿过的开口（132） ，设置在所述导电部分（131）中的导电元件（121）和形成在B层（120）中的导电元件（121）面对所述导电部分（131），并且电连接到所述连接构件（151），所述连接构件 设置在所述导电部（131）中的开口（132）。

公开(公告)号：US09000306B2

公开(公告)日：2015-04-07

申请号：US13701010

申请日：2011-06-02

申请人： Hiroshi Toyao ,  Manabu Kusumoto ,  Naoki Kobayashi ,  Noriaki Ando

发明人： Hiroshi Toyao ,  Manabu Kusumoto ,  Naoki Kobayashi ,  Noriaki Ando

IPC分类号： H05K1/11 ,  H05K1/02

CPC分类号： H05K1/0236 ,  H05K1/0224

摘要： An electronic apparatus (100) has an electronic device (151), a power supply plane (121) and a power supply plane (122) disposed with a gap (123) therebetween, a connection member (152) that electrically connects the power supply plane (122) and the electronic device (151), a ground plane (141) facing the power supply plane (121) or the power supply plane (122), a connection member (153) that electrically connects the ground plane (141) and the electronic device (151), a plurality of conductor elements (131) that is repeatedly arrayed, and open stubs (111) formed at a location overlapping the gap (123) included in an area surrounded by the conductor elements (131). In addition, at least some of the open stubs (111) face the power supply plane (122) which is not in contact with the open stubs (111).

摘要翻译： 一种电子设备（100），具有电子设备（151），电源平面（121）和设置在其间的间隙（123）的电源平面（122），连接构件（152）将电源 平面（122）和电子设备（151），面对电源平面（121）或电源平面（122）的接地平面（141），将接地平面（141）电连接的连接构件 电子设备（151），重复排列的多个导体元件（131）和形成在与由导体元件（131）包围的区域中的间隙（123）重叠的位置处的开口短截线（111）。 此外，至少一些开放桩（111）面向不与开放桩（111）接触的供电平面（122）。

公开(公告)号：US20120261178A1

公开(公告)日：2012-10-18

申请号：US13502936

申请日：2010-10-06

申请人： Manabu Kusumoto ,  Naoki Kobayashi ,  Noriaki Ando ,  Hiroshi Toyao

发明人： Manabu Kusumoto ,  Naoki Kobayashi ,  Noriaki Ando ,  Hiroshi Toyao

IPC分类号： H05K1/11 ,  G06F17/50

CPC分类号： H05K3/0005 ,  G06F17/5077 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/09718

摘要： A via disposition information acquiring unit acquires via disposition information indicating a disposition of the plurality of first vias (212). A second conductor information acquiring unit acquires second conductor information indicating disposition positions of a plurality of second conductors (232) repeatedly disposed in the second conductor layer (230). A via extracting unit extracts an extraction via with respect to each of the plurality of second conductors (232). The extraction via is each of the first vias (212) overlapping the second conductor (232). A via selecting unit selects a selection via with respect to each of the plurality of second conductors (232). The selection via is each of first vias (212) selected in a predetermined number from the extraction vias. An opening introducing unit introduces a first opening (234) to each of the plurality of second conductors (232). The first opening (234) overlaps the extraction via not selected by the via selecting unit in plan view.

摘要翻译： 通过配置信息获取单元通过表示多个第一通孔（212）的配置的配置信息来获取。 第二导体信息获取单元获取表示重复设置在第二导体层（230）中的多个第二导体（232）的配置位置的第二导体信息。 通路提取单元相对于多个第二导体（232）中的每一个提取提取通路。 提取孔通过与第二导体（232）重叠的第一通孔（212）中的每一个。 通路选择单元相对于多个第二导体（232）中的每一个选择通孔。 选择通孔是从提取通孔以预定数量选择的每个第一通孔（212）。 开口引入单元将多个第二导体（232）中的每一个引入第一开口（234）。 第一开口（234）在平面图中未经由通孔选择单元选择而与提取重叠。

公开(公告)号：US09036365B2

公开(公告)日：2015-05-19

申请号：US13502936

申请日：2010-10-06

申请人： Manabu Kusumoto ,  Naoki Kobayashi ,  Noriaki Ando ,  Hiroshi Toyao

发明人： Manabu Kusumoto ,  Naoki Kobayashi ,  Noriaki Ando ,  Hiroshi Toyao

IPC分类号： H05K1/11 ,  G06F17/50 ,  H05K3/00 ,  H05K3/42

CPC分类号： H05K3/0005 ,  G06F17/5077 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/09718

摘要： A via disposition information acquiring unit acquires via disposition information indicating a disposition of the plurality of first vias (212). A second conductor information acquiring unit acquires second conductor information indicating disposition positions of a plurality of second conductors (232) repeatedly disposed in the second conductor layer (230). A via extracting unit extracts an extraction via with respect to each of the plurality of second conductors (232). The extraction via is each of the first vias (212) overlapping the second conductor (232). A via selecting unit selects a selection via with respect to each of the plurality of second conductors (232). The selection via is each of first vias (212) selected in a predetermined number from the extraction vias. An opening introducing unit introduces a first opening (234) to each of the plurality of second conductors (232). The first opening (234) overlaps the extraction via not selected by the via selecting unit in plan view.

摘要翻译： 通过配置信息获取单元通过表示多个第一通孔（212）的配置的配置信息来获取。 第二导体信息获取单元获取表示重复设置在第二导体层（230）中的多个第二导体（232）的配置位置的第二导体信息。 通路提取单元相对于多个第二导体（232）中的每一个提取提取通路。 提取孔通过与第二导体（232）重叠的第一通孔（212）中的每一个。 通路选择单元相对于多个第二导体（232）中的每一个选择通孔。 选择通孔是从提取通孔以预定数量选择的每个第一通孔（212）。 开口引入单元将多个第二导体（232）中的每一个引入第一开口（234）。 第一开口（234）在平面图中未经由通孔选择单元选择而与提取重叠。

公开(公告)号：US20130003333A1

公开(公告)日：2013-01-03

申请号：US13583884

申请日：2011-02-18

申请人： Hiroshi Toyao ,  Manabu Kusumoto ,  Naoki Kobayashi ,  Noriaki Ando

发明人： Hiroshi Toyao ,  Manabu Kusumoto ,  Naoki Kobayashi ,  Noriaki Ando

IPC分类号： H05K7/06

CPC分类号： H05K1/0236 ,  H05K1/0218 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/116 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/09309 ,  H05K2201/09618 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/0979 ,  H05K2201/10371 ,  H05K2201/10674

摘要： A wiring board includes a metal cap pad that is arranged so as to surround a mounting position of an electronic component and is connected to an end portion of a metal cap, a power source plane that is connected to the electronic component through a connection member and has a gap, a ground plane that is connected to the electronic component through a connection member, and a plurality of conductive body elements that are repeatedly arranged so as to surround the connection members and the gap. The power source plane and the ground plane extend so as to include at least a part of an area that is surrounded by the plurality of conductive body elements and at least a part of an area facing the plurality of conductive body elements.

摘要翻译： 布线基板包括金属盖焊盘，其被设置为围绕电子部件的安装位置并且连接到金属盖的端部，电源平面，其通过连接构件连接到电子部件， 具有间隙，通过连接构件连接到电子部件的接地平面，以及重复地布置成围绕连接构件和间隙的多个导电体元件。 电源平面和接地平面延伸成包括由多个导电体元件围绕的区域的至少一部分和面向多个导电体元件的区域的至少一部分。

公开(公告)号：US20120325537A1

公开(公告)日：2012-12-27

申请号：US13583461

申请日：2011-02-18

申请人： Hiroshi Toyao ,  Manabu Kusumoto ,  Naoki Kobayashi ,  Noriaki Ando

发明人： Hiroshi Toyao ,  Manabu Kusumoto ,  Naoki Kobayashi ,  Noriaki Ando

IPC分类号： H05K1/16

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/16152 ,  H05K1/024 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/116 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/09618 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/0979 ,  H05K2201/10371 ,  H05K2201/10674

摘要： A circuit board (100) includes power supply planes (141, 143) arranged with gaps (147) in a D layer (140), connection members (182, 183, 184) electrically connecting at least one of the power supply planes (141, 143) to an electronic device (181), plural conductor elements (121) repeatedly arranged to surround at least some of the gaps (147) and the connection members (182, 183, 184), and ground planes (111, 171) being located in an A layer (110) or a G layer (170) and extending in a second region or a third region including a region opposing the first region and a region opposing the conductor elements (121).

摘要翻译： 电路板（100）包括在D层（140）中布置有间隙（147）的电源平面（141,143），电连接至少一个电源平面（141）的连接构件（182,183,184） ，143）连接到电子设备（181），多个重复布置成围绕所述间隙（147）和所述连接构件（182,183,184）中的至少一些的导体元件（121）和接地平面（111,171） 位于A层（110）或G层（170）中并且在包括与第一区域相对的区域和与导体元件（121）相对的区域的第二区域或第三区域中延伸。