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公开(公告)号：US07901551B2
公开(公告)日：2011-03-08
申请号：US12585141
申请日：2009-09-04
IPC分类号： C25B9/02
CPC分类号： C25D17/001 , C25D7/12 , C25D7/123 , C25D17/004 , C25D17/005 , C25D17/06 , C25D17/08 , C25D21/12 , H01L21/2885 , H01L21/67126 , H01L21/67253 , H01L21/6838 , H01L21/687 , H01L21/68728 , H01L21/68764 , H01L21/76879 , H01L24/11 , H01L24/742 , H01L2224/05568 , H01L2224/05573 , H01L2224/11462 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13169 , H01L2924/00014 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2224/05599
摘要： The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.
摘要翻译： 本发明提供一种能够利用密封构件进行更完全的密封的衬底保持器，并且可以容易且牢固地将衬底从衬底保持器中取出，以及设置有衬底保持器的电镀设备。 衬底保持器包括：固定保持构件和用于在其间保持衬底的可动保持构件; 安装到所述固定保持构件或所述可动保持构件的密封构件; 以及用于吸引保持在固定保持构件和可动保持构件之间的基板的背面的吸盘。
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公开(公告)号：US20100000858A1
公开(公告)日：2010-01-07
申请号：US12585141
申请日：2009-09-04
IPC分类号： C25D17/08
CPC分类号： C25D17/001 , C25D7/12 , C25D7/123 , C25D17/004 , C25D17/005 , C25D17/06 , C25D17/08 , C25D21/12 , H01L21/2885 , H01L21/67126 , H01L21/67253 , H01L21/6838 , H01L21/687 , H01L21/68728 , H01L21/68764 , H01L21/76879 , H01L24/11 , H01L24/742 , H01L2224/05568 , H01L2224/05573 , H01L2224/11462 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13169 , H01L2924/00014 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2224/05599
摘要： The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.
摘要翻译： 本发明提供一种能够利用密封构件进行更完全的密封的衬底保持器，并且可以容易且牢固地将衬底从衬底保持器中取出，以及设置有衬底保持器的电镀设备。 衬底保持器包括：固定保持构件和用于在其间保持衬底的可动保持构件; 安装到所述固定保持构件或所述可动保持构件的密封构件; 以及用于吸引保持在固定保持构件和可动保持构件之间的基板的背面的吸盘。
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公开(公告)号：US07601248B2
公开(公告)日：2009-10-13
申请号：US10482476
申请日：2003-06-20
CPC分类号： C25D17/001 , C25D7/12 , C25D7/123 , C25D17/004 , C25D17/005 , C25D17/06 , C25D17/08 , C25D21/12 , H01L21/2885 , H01L21/67126 , H01L21/67253 , H01L21/6838 , H01L21/687 , H01L21/68728 , H01L21/68764 , H01L21/76879 , H01L24/11 , H01L24/742 , H01L2224/05568 , H01L2224/05573 , H01L2224/11462 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13169 , H01L2924/00014 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2224/05599
摘要： The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.
摘要翻译： 本发明提供一种能够利用密封构件进行更完全的密封的衬底保持器，并且可以容易且牢固地将衬底从衬底保持器中取出，以及设置有衬底保持器的电镀设备。 衬底保持器包括：固定保持构件和用于在其间保持衬底的可动保持构件; 安装到所述固定保持构件或所述可动保持构件的密封构件; 以及用于吸引保持在固定保持构件和可动保持构件之间的基板的背面的吸盘。
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公开(公告)号：US20110127159A1
公开(公告)日：2011-06-02
申请号：US13017294
申请日：2011-01-31
CPC分类号： C25D17/001 , C25D7/12 , C25D7/123 , C25D17/004 , C25D17/005 , C25D17/06 , C25D17/08 , C25D21/12 , H01L21/2885 , H01L21/67126 , H01L21/67253 , H01L21/6838 , H01L21/687 , H01L21/68728 , H01L21/68764 , H01L21/76879 , H01L24/11 , H01L24/742 , H01L2224/05568 , H01L2224/05573 , H01L2224/11462 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13169 , H01L2924/00014 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2224/05599
摘要： The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.
摘要翻译： 本发明提供一种能够利用密封构件进行更完全的密封的衬底保持器，并且可以容易且牢固地将衬底从衬底保持器中取出，以及设置有衬底保持器的电镀设备。 衬底保持器包括：固定保持构件和用于在其间保持衬底的可动保持构件; 安装到所述固定保持构件或所述可动保持构件的密封构件; 以及用于吸引保持在固定保持构件和可动保持构件之间的基板的背面的吸盘。
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公开(公告)号：US07118664B2
公开(公告)日：2006-10-10
申请号：US10779708
申请日：2004-02-18
IPC分类号： C25D21/00
CPC分类号： C23C18/1834 , C23C18/1605 , C25D5/003 , C25D17/001 , C25D21/00 , C25D21/04 , H05K3/187 , H05K3/422 , H05K3/423
摘要： The present invention provides a plating method and apparatus, which is capable of introducing plating solution into the fine channels and holes formed in a substrate without needing to add a surface active agent to the plating solution, and capable of forming a high-quality plating film having no defects or omissions. The plating method for performing electrolytic or electroless plating of an object using a plating solution comprises: conducting a plating operation after or while deaerating dissolved gas in the plating solution; and/or conducting a preprocessing operation using a preprocessing solution after or while deaerating dissolved gas in the preprocessing solution and subsequently conducting the plating operation.
摘要翻译： 本发明提供一种电镀方法和装置，其能够将电镀液引入形成于基板中的细孔和孔，而无需向电镀液中添加表面活性剂，能够形成高品质的镀膜 没有缺陷或遗漏。 使用电镀液对物体进行电解或无电镀的电镀方法包括：在溶液中溶解气体脱气后进行电镀操作; 和/或在预处理溶液中的溶解气体脱气之后使用预处理溶液进行预处理操作，然后进行电镀操作。
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公开(公告)号：US06716332B1
公开(公告)日：2004-04-06
申请号：US09582919
申请日：2000-07-07
IPC分类号： C25D2100
CPC分类号： C23C18/1834 , C23C18/1605 , C25D5/003 , C25D17/001 , C25D21/00 , C25D21/04 , H05K3/187 , H05K3/422 , H05K3/423
摘要： The present invention provides a plating method and apparatus, which is capable of introducing plating solution into the fine channels and holes formed in a substrate without needing to add a surface active agent to the plating solution, and capable of forming a high-quality plating film having no defects or omissions. The plating method for performing electrolytic or electroless plating of an object using a plating solution comprises: conducting a plating operation after or while deaerating dissolved gas in the plating solution; and/or conducting a preprocessing operation using a preprocessing solution after or while deaerating dissolved gas in the preprocessing solution and subsequently conducting the plating operation.
摘要翻译： 本发明提供一种电镀方法和装置，其能够将电镀液引入形成于基板中的细孔和孔，而无需向电镀液中添加表面活性剂，能够形成高品质的镀膜 没有缺陷或遗漏。 使用电镀液对物体进行电解或无电镀的电镀方法包括：在溶液中溶解气体脱气后进行电镀操作; 和/或在预处理溶液中的溶解气体脱气之后使用预处理溶液进行预处理操作，然后进行电镀操作。
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公开(公告)号：US07402227B2
公开(公告)日：2008-07-22
申请号：US10968183
申请日：2004-10-20
CPC分类号： C25D17/02 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/004 , C25D17/06 , C25D21/04 , C25D21/10 , C25D21/12
摘要： An apparatus forms a plated film in fine trenches and plugs for interconnects and in the openings of a resist formed in the surface of a substrate such as a semiconductor wafer, and forms bumps (protruding electrodes) on the surface of a semiconductor wafer. The apparatus includes a substrate holder capable of opening and closing for holding a substrate such that the front surface of the substrate is exposed while the backside and the edge thereof are hermetically sealed. A plating tank accommodates a plating liquid in which an anode is immersed. A diaphragm is provided in the plating tank and disposed between the anode and the substrate held by the substrate holder. Plating liquid circulating systems circulate the plating liquid to respective regions of the plating tank, separated by the diaphragm. A deaerating unit is disposed in at least one of the plating liquid circulating systems.
摘要翻译： 一种装置在精细的沟槽中形成镀膜，并在诸如半导体晶片的衬底的表面形成的抗蚀剂的开口中形成用于互连的插塞，并且在半导体晶片的表面上形成凸块（突起电极）。 该装置包括能够打开和关闭用于保持基板的基板保持器，使得基板的前表面在其背侧和边缘被气密密封的同时露出。 电镀槽容纳浸渍有阳极的电镀液。 在电镀槽中设置隔膜，并设置在由基板保持件保持的阳极和基板之间。 电镀液循环系统将镀液循环到电镀槽的各个区域，由隔膜隔开。 排气单元设置在至少一个电镀液循环系统中。
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公开(公告)号：US20080245669A1
公开(公告)日：2008-10-09
申请号：US12142570
申请日：2008-06-19
IPC分类号： C25D5/00
CPC分类号： C25D17/02 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/004 , C25D17/06 , C25D21/04 , C25D21/10 , C25D21/12
摘要： An apparatus forms a plated film in fine trenches and plugs for interconnects and in the openings of a resist formed in the surface of a substrate such as a semiconductor wafer, and forms bumps (protruding electrodes) on the surface of a semiconductor wafer. The apparatus includes a substrate holder capable of opening and closing for holding a substrate such that the front surface of the substrate is exposed while the backside and the edge thereof are hermetically sealed. A plating tank accommodates a plating liquid in which an anode is immersed. A diaphragm is provided in the plating tank and disposed between the anode and the substrate held by the substrate holder. Plating liquid circulating systems circulate the plating liquid to respective regions of the plating tank, separated by the diaphragm. A deaerating unit is disposed in at least one of the plating liquid circulating systems.
摘要翻译： 一种装置在精细的沟槽中形成镀膜，并在诸如半导体晶片的衬底的表面形成的抗蚀剂的开口中形成用于互连的插塞，并且在半导体晶片的表面上形成凸块（突起电极）。 该装置包括能够打开和关闭用于保持基板的基板保持器，使得基板的前表面在其背侧和边缘被气密密封的同时露出。 电镀槽容纳浸渍有阳极的电镀液。 在电镀槽中设置隔膜，并设置在由基板保持件保持的阳极和基板之间。 电镀液循环系统将镀液循环到电镀槽的各个区域，由隔膜隔开。 排气单元设置在至少一个电镀液循环系统中。
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公开(公告)号：US08012332B2
公开(公告)日：2011-09-06
申请号：US12142570
申请日：2008-06-19
IPC分类号： C25D5/34
CPC分类号： C25D17/02 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/004 , C25D17/06 , C25D21/04 , C25D21/10 , C25D21/12
摘要： An apparatus forms a plated film in fine trenches and plugs for interconnects and in the openings of a resist formed in the surface of a substrate such as a semiconductor wafer, and forms bumps (protruding electrodes) on the surface of a semiconductor wafer. The apparatus includes a substrate holder capable of opening and closing for holding a substrate such that the front surface of the substrate is exposed while the backside and the edge thereof are hermetically sealed. A plating tank accommodates a plating liquid in which an anode is immersed. A diaphragm is provided in the plating tank and disposed between the anode and the substrate held by the substrate holder. Plating liquid circulating systems circulate the plating liquid to respective regions of the plating tank, separated by the diaphragm. A deaerating unit is disposed in at least one of the plating liquid circulating systems.
摘要翻译： 一种装置在精细的沟槽中形成镀膜，并在诸如半导体晶片的衬底的表面形成的抗蚀剂的开口中形成用于互连的插塞，并且在半导体晶片的表面上形成凸块（突起电极）。 该装置包括能够打开和关闭用于保持基板的基板保持器，使得基板的前表面在其背侧和边缘被气密密封的同时露出。 电镀槽容纳浸渍有阳极的电镀液。 在电镀槽中设置隔膜，并设置在由基板保持件保持的阳极和基板之间。 电镀液循环系统将镀液循环到电镀槽的各个区域，由隔膜隔开。 排气单元设置在至少一个电镀液循环系统中。
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公开(公告)号：US20050082163A1
公开(公告)日：2005-04-21
申请号：US10968183
申请日：2004-10-20
CPC分类号： C25D17/02 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/004 , C25D17/06 , C25D21/04 , C25D21/10 , C25D21/12
摘要： An apparatus forms a plated film in fine trenches and plugs for interconnects and in the openings of a resist formed in the surface of a substrate such as a semiconductor wafer, and forms bumps (protruding electrodes) on the surface of a semiconductor wafer. The apparatus includes a substrate holder capable of opening and closing for holding a substrate such that the front surface of the substrate is exposed while the backside and the edge thereof are hermetically sealed. A plating tank accommodates a plating liquid in which an anode is immersed. A diaphragm is provided in the plating tank and disposed between the anode and the substrate held by the substrate holder. Plating liquid circulating systems circulate the plating liquid to respective regions of the plating tank, separated by the diaphragm. A deaerating unit is disposed in at least one of the plating liquid circulating systems.
摘要翻译： 一种装置在精细的沟槽中形成镀膜，并在诸如半导体晶片的衬底的表面形成的抗蚀剂的开口中形成用于互连的插塞，并且在半导体晶片的表面上形成凸块（突起电极）。 该装置包括能够打开和关闭用于保持基板的基板保持器，使得基板的前表面在其背侧和边缘被气密密封的同时露出。 电镀槽容纳浸渍有阳极的电镀液。 在电镀槽中设置隔膜，并设置在由基板保持件保持的阳极和基板之间。 电镀液循环系统将镀液循环到电镀槽的各个区域，由隔膜隔开。 排气单元设置在至少一个电镀液循环系统中。
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