公开(公告)号：US07781896B2

公开(公告)日：2010-08-24

申请号：US12138637

申请日：2008-06-13

申请人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

发明人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L24/27 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/28 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

摘要翻译： 将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在250℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10MPa以下。半导体装置 这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。

公开(公告)号：US07078094B2

公开(公告)日：2006-07-18

申请号：US10891090

申请日：2004-07-15

申请人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

发明人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

IPC分类号： B32B15/04 ,  H01L23/495

CPC分类号： H01L24/27 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/28 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

公开(公告)号：US5270438A

公开(公告)日：1993-12-14

申请号：US679940

申请日：1991-04-03

申请人： Masami Yusa ,  Shinji Takeda ,  Yasuo Miyadera

发明人： Masami Yusa ,  Shinji Takeda ,  Yasuo Miyadera

IPC分类号： C08G73/10 ,  C08G69/26 ,  C08G8/02

CPC分类号： C08G73/1039 ,  C08G73/1007

摘要： A fluorine-containing polyimide having a low dielectric constant, low water absorption and excellent heat resistance and moisture resistance and a precursor thereof such as a fluorine-containing polyamide-acid, can be prepared by reacting an acid anhydride with an aromatic diamine having perfluoroalkyl group.

公开(公告)号：US5243019A

公开(公告)日：1993-09-07

申请号：US674604

申请日：1991-03-25

申请人： Shinji Takeda ,  Masami Yusa ,  Yasuo Miyadera

发明人： Shinji Takeda ,  Masami Yusa ,  Yasuo Miyadera

IPC分类号： C08G69/26 ,  C08G69/32 ,  C08G69/40 ,  C08G69/42

CPC分类号： C08G69/265 ,  C08G69/32 ,  C08G69/40

摘要： A fluorine-containing aromatic polyamide obtained by reacting an aromatic dicarboxylic acid having a perfluoroalkenyloxy group with a diamine is excellent in water repellency, water resistance, heat resistance, etc.

摘要翻译： 通过使具有全氟链烯氧基的芳香族二羧酸与二胺反应而得到的含氟芳香族聚酰胺的斥水性，耐水性，耐热性等优异。

公开(公告)号：US5401878A

公开(公告)日：1995-03-28

申请号：US114361

申请日：1993-09-01

申请人： Masami Yusa ,  Shinji Takeda ,  Yasuo Miyadera

发明人： Masami Yusa ,  Shinji Takeda ,  Yasuo Miyadera

IPC分类号： C08G73/10 ,  C07C217/84 ,  C07C271/28

CPC分类号： C08G73/1039 ,  C08G73/1007

摘要： A fluorine-containing polyimide having a low dielectric constant, low water absorption and excellent heat resistance and moisture resistance and a precursor thereof such as a fluorine-containing polyamide-acid, can be prepared by reacting an acid anhydride with an aromatic diamine having perfluoroalkyl group.

摘要翻译： 具有低介电常数，低吸水性和优异的耐热性和耐湿性的含氟聚酰亚胺及其前体如含氟聚酰胺酸可以通过使酸酐与具有全氟烷基的芳族二胺反应来制备 。

公开(公告)号：US08835553B2

公开(公告)日：2014-09-16

申请号：US13266021

申请日：2010-06-30

申请人： Shinji Takeda ,  Masafumi Achiwa ,  Hiroyuki Noguchi ,  Akemi Kouketsu ,  Katsunobu Mochizuki

发明人： Shinji Takeda ,  Masafumi Achiwa ,  Hiroyuki Noguchi ,  Akemi Kouketsu ,  Katsunobu Mochizuki

IPC分类号： C09D133/20 ,  C09D133/04 ,  C08K3/30 ,  C08K3/34 ,  C08K3/26 ,  C08F220/10 ,  C08F220/42 ,  C08F220/20 ,  C09D7/12 ,  C09D133/10 ,  C09D133/06 ,  C08K7/22 ,  C08F220/18

CPC分类号： C09D133/06 ,  C08F2220/185 ,  C08K7/22 ,  C09D7/61 ,  C09D7/70 ,  C09D133/10 ,  Y10T428/269 ,  C08F2220/1858 ,  C08F220/44 ,  C08F2220/302 ,  C08F220/06 ,  C08F212/08

摘要： A coating composition has excellent application workability, facilitates thick coating, rarely causes cracks at an initial drying stage, and provides a dried film having excellent tensile properties and adhesiveness. The composition contains an aggregate and an emulsion with a polymer particle dispersed in an aqueous medium. The polymer particle includes 40% to 98% of a unit formed by polymerizing an alkyl(meth)acrylate monomer, the alkyl group having 4 to 14 carbon atoms, 0.1% to 5% of a unit formed by polymerizing an ethylenically unsaturated carboxylic acid monomer, 1% to 20% of a unit formed by polymerizing a vinyl monomer having a cyano group, 1% to 20% of a unit formed by polymerizing a reaction product of a (meth)acrylic acid and a monofunctional epoxy compound, and 0% to 50% of a unit formed by copolymerizing at least one of the above monomers with another monomer.

摘要翻译： 涂料组合物具有优异的应用可加工性，便于厚涂层，在初始干燥阶段很少引起裂纹，并提供具有优异的拉伸性能和粘合性的干燥膜。 该组合物含有聚集体和分散在水性介质中的聚合物颗粒的乳液。 聚合物颗粒包含通过聚合（甲基）丙烯酸烷基酯单体，具有4至14个碳原子的烷基，通过聚合烯键式不饱和羧酸单体形成的单元的0.1％至5％形成的单元的40％至98％ ，通过使具有氰基的乙烯基单体聚合形成的单元的1〜20％，通过聚合（甲基）丙烯酸和单官能环氧化合物的反应产物而形成的单元的1〜20％，以及0％ 至50％的单体与至少一种上述单体共聚形成的单元。

公开(公告)号：US08233443B2

公开(公告)日：2012-07-31

申请号：US11908307

申请日：2006-03-03

申请人： Hidenori Aoki ,  Kengo Yagyu ,  Shinji Takeda ,  Atsushi Fujiwara ,  Yoichi Matsumoto

发明人： Hidenori Aoki ,  Kengo Yagyu ,  Shinji Takeda ,  Atsushi Fujiwara ,  Yoichi Matsumoto

IPC分类号： H04W4/00

CPC分类号： H04W48/08 ,  H04L41/00 ,  H04W28/18 ,  H04W40/24 ,  H04W84/18 ,  H04W88/02

摘要： A wireless communication apparatus is provided. The wireless communication apparatus includes: detection means that detects that there is another wireless communication apparatus around the wireless communication apparatus; comparison means that compares a first reference value managed in the wireless communication apparatus with a second reference value managed in the another wireless communication apparatus; means that corrects the first reference value based on the comparison result; and means that announces the first reference value to the another wireless communication apparatus. Frequencies are set such that a frequency of the wireless communication apparatus becomes same as a frequency of still another wireless communication apparatus to which a radio wave of the wireless communication apparatus does not reach but a radio wave of the another wireless communication apparatus reaches.

摘要翻译： 提供一种无线通信装置。 无线通信装置包括：检测装置，用于检测在无线通信装置周围有另一无线通信装置; 比较装置将在无线通信装置中管理的第一参考值与在另一无线通信装置中管理的第二参考值进行比较; 意味着根据比较结果校正第一个参考值; 以及向另一无线通信装置通知第一参考值的装置。 频率被设置为使得无线通信装置的频率变得与无线通信装置的无线电波未到达的另一无线通信装置的频率相同，但是另一无线通信装置的无线电波达到的频率相同。

公开(公告)号：US07881660B2

公开(公告)日：2011-02-01

申请号：US11697481

申请日：2007-04-06

申请人： Shinji Takeda ,  Atsushi Fujiwara ,  Hitoshi Yoshino ,  Toru Otsu ,  Yasushi Yamao

发明人： Shinji Takeda ,  Atsushi Fujiwara ,  Hitoshi Yoshino ,  Toru Otsu ,  Yasushi Yamao

IPC分类号： H04B7/15

CPC分类号： H04W40/12 ,  H04B7/2606 ,  H04L45/00 ,  H04L45/122 ,  H04L45/125 ,  H04L45/20 ,  H04L45/302 ,  H04W40/08 ,  H04W40/16 ,  H04W40/22 ,  H04W52/46 ,  H04W72/08 ,  H04W84/18 ,  H04W88/02 ,  Y02D70/324 ,  Y02D70/34 ,  Y02D70/39 ,  Y02D70/449

摘要： A mobile communication system determines a communication path to implement fast communication by multihop connection. A mobile communication system includes a mobile station, at least one relay station, and a base station and implements packet transmission from the mobile station to the base station through a communication path with an intermediary of at least one relay station or through a communication path without an intermediary of a relay station. The mobile communication system is provided with a communication path determiner for determining a communication path with a largest communication speed or a communication path satisfying a required line quality, based on interference levels of respective signals received at a relay station constituting a communication path between the transmitting station and the receiving station, and at the base station.

摘要翻译： 移动通信系统确定通过多跳连接实现快速通信的通信路径。 移动通信系统包括移动站，至少一个中继站和基站，并且通过与至少一个中继站或通过通信路径的通信路径实现从移动站到基站的分组传输，而没有 中继站的中介。 移动通信系统具有通信路径确定器，用于基于在构成发送端之间的通信路径的中继站处接收到的各信号的干扰电平，确定具有最大通信速度的通信路径或满足所需线路质量的通信路径 站和接收站，并在基站。

公开(公告)号：US07876619B2

公开(公告)日：2011-01-25

申请号：US12368667

申请日：2009-02-10

申请人： Shinji Takeda ,  Yoshiharu Hirata

发明人： Shinji Takeda ,  Yoshiharu Hirata

IPC分类号： G11C11/34 ,  G11C16/04

CPC分类号： G11C16/0483 ,  G11C16/10

摘要： A semiconductor memory device comprises: a write circuit including a latch circuit configured by two inverters having a positive side power supply terminal supplied with a first voltage and a negative side power supply terminal supplied with a second voltage; and a write state machine controlling the first and second voltages. When writing data to a memory cell, the first voltage is changed to a second value that is lower than a first value. When writing data to a memory cell, the second voltage is changed to a third value that is lower than the second value. The write state machine lowers the second voltage to an intermediate value between the second value and the third value and, while maintaining this intermediate value, lowers the first voltage from the first value to the second value.

摘要翻译： 一种半导体存储器件，包括：写入电路，包括由具有提供有第一电压的正侧电源端子和被提供有第二电压的负侧电源端子的两个反相器构成的锁存电路; 以及控制第一和第二电压的写状态机。 当将数据写入存储单元时，将第一电压改变为低于第一值的第二值。 当将数据写入存储单元时，第二电压被改变为低于第二值的第三值。 写状态机将第二电压降低到第二值和第三值之间的中间值，并且在保持该中间值的同时，将第一电压从第一值降低到第二值。

公开(公告)号：US07586894B2

公开(公告)日：2009-09-08

申请号：US11059685

申请日：2005-02-17

申请人： Hidenori Aoki ,  Shinji Takeda ,  Kengo Yagyu ,  Narumi Umeda

发明人： Hidenori Aoki ,  Shinji Takeda ,  Kengo Yagyu ,  Narumi Umeda

IPC分类号： H04J3/24

CPC分类号： H04W40/02

摘要： A communication apparatus is disclosed, which includes an information collection unit, a storage unit, a selection unit, and a route control unit. The information collection unit is configured to collect route information and condition information. The storage unit is configured to store the route information and the connection information. The selection unit is configured to select a connection apparatuses for a terminal apparatus based on the route information and the connection information. The route control unit is configured to control routes from the communication apparatus to the connection apparatus.

摘要翻译： 公开了一种通信装置，其包括信息收集单元，存储单元，选择单元和路由控制单元。 信息收集单元被配置为收集路线信息和条件信息。 存储单元被配置为存储路由信息和连接信息。 选择单元被配置为基于路线信息和连接信息来选择终端装置的连接装置。 路由控制部被配置为控制从通信装置到连接装置的路径。