公开(公告)号：US20230279226A1

公开(公告)日：2023-09-07

申请号：US17740375

申请日：2022-05-10

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Wei-Ru Huang ,  Hung-Yi Chang ,  Chia-Lin Liu ,  Chien Kai Wei

IPC: C08L79/08 ,  C08G73/10

CPC classification number: C08L79/08 ,  C08G73/1032 ,  C08G73/105 ,  C08G73/1082 ,  C08G73/1042 ,  C08L2201/08 ,  C08L2201/10 ,  C08L2203/16

Abstract: A polyimide resin is obtained by polymerizing a modified polyphenylene ether resin with terminal amine groups and tetracarboxylic dianhydride. The polyimide has the following characteristics: the dissipation factor under 10 GHz electromagnetic wave is less than 0.0040; the water absorption rate is less than 0.3%; or, the temperature of glass transition is greater than 250° C.

公开(公告)号：US20250011548A1

公开(公告)日：2025-01-09

申请号：US18448977

申请日：2023-08-14

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  HungFan Lee ,  Hng-Yi Chang ,  Wei-Ru Huang ,  Chia-Lin Liu

IPC: C08J3/07 ,  C08K3/011 ,  C08K3/34 ,  C08K5/541

Abstract: A manufacturing method of a resin composition includes the following steps. An inorganic filler, a first solvent, and a dispersant are mixed, wherein a material of the dispersant is silane and/or polysiloxane including an organic-philic end and an inorganic-philic end, and the dispersant and the inorganic filler undergo a dealcoholization condensation reaction reaction to form a dispersion including a modified inorganic filler. The organic-philic end includes a carbonyl group, an epoxy group, and/or an amine group. Epoxy resin is dissolved into the dispersion.

公开(公告)号：US20240417557A1

公开(公告)日：2024-12-19

申请号：US18357167

申请日：2023-07-24

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Wei-Ru Huang ,  Hung-Yi Chang ,  Chia-Lin Liu

IPC: C08L25/06 ,  C08K13/06 ,  C08L25/16 ,  C08L71/12

Abstract: The invention provides a resin composition that may effectively increase glass transition temperature while maintaining low-k electrical specification. The resin composition includes a first resin polymerized by a monomer mixture including styrene, divinylbenzene, and ethylene, a second resin including a bismaleimide-modified polyphenylene ether resin, a divinylbenzene crosslinking agent, a halogen-free flame retardant, a spherical silica, and a siloxane coupling agent.

公开(公告)号：US20240166874A1

公开(公告)日：2024-05-23

申请号：US18300383

申请日：2023-04-13

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Yu-Ting Liu ,  Hung-Yi Chang ,  Chia-Lin Liu ,  Wei-Ru Huang

IPC: C08L79/08 ,  C08K3/36 ,  C08K5/5415

CPC classification number: C08L79/08 ,  C08K3/36 ,  C08K5/5415 ,  C08L2205/025 ,  C08L2205/035

Abstract: A resin composition including a modified maleimide resin is provided. The modified maleimide resin is formed from a dicyclopentadiene (DCPD)-based resin having an amino group and a maleic anhydride by a condensation polymerization. The dicyclopentadiene-based resin having an amino group is formed by nitration reaction and hydrogenation reaction of dicyclopentadiene phenolic resin.

公开(公告)号：US20240166859A1

公开(公告)日：2024-05-23

申请号：US18087757

申请日：2022-12-22

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Wei-Ru Huang ,  Hung-Yi Chang ,  Chia-Lin Liu

IPC: C08L47/00 ,  C08K3/36 ,  C08K7/18 ,  C08K9/04 ,  C08L77/00

CPC classification number: C08L47/00 ,  C08K3/36 ,  C08K7/18 ,  C08K9/04 ,  C08L77/00 ,  C08K2201/003

Abstract: A resin composition is provided. The resin composition includes a resin mixture, a flame retardant, spherical silica and a siloxane coupling agent. The resin mixture includes a first resin polymerized by a monomer mixture comprising styrene, divinylbenzene and ethylene, a second resin polymerized by modified dicyclopentadiene diamine and maleic anhydride, and a SBS resin. The resin composition of the disclosure may have a high glass transition temperature and a low dielectric constant and a low dissipation factor after curing.

公开(公告)号：US11890832B2

公开(公告)日：2024-02-06

申请号：US17316677

申请日：2021-05-10

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Hao-Sheng Chen ,  Hung-Yi Chang ,  Chih-Kai Chang ,  Chia-Lin Liu

IPC: B32B15/16 ,  B32B15/08 ,  B32B15/14 ,  B32B5/16

CPC classification number: B32B15/16 ,  B32B5/16 ,  B32B15/08 ,  B32B15/14 ,  B32B2250/02 ,  B32B2250/03 ,  B32B2264/1021 ,  B32B2264/1023 ,  B32B2264/12 ,  B32B2264/201 ,  B32B2264/202 ,  B32B2307/204 ,  B32B2307/302

Abstract: A prepreg and a metallic clad laminate are provided. The prepreg includes a reinforcing material and a thermosetting resin layer. The thermosetting resin layer is formed by immersing the reinforcing material in a thermosetting resin composition. The thermosetting resin composition includes a polyphenylene ether resin, a liquid polybutadiene resin, a crosslinker, and fillers. Based on a total weight of the thermosetting resin composition being 100 phr, an amount of the fillers ranges from 50 phr to 70 phr. The fillers include a granular dielectric filler and a flaky thermal conductive filler. The metallic clad laminate is formed by disposing at least one metal layer onto the prepreg.

公开(公告)号：US10023707B2

公开(公告)日：2018-07-17

申请号：US14973809

申请日：2015-12-18

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Dein-Run Fung ,  Ying-Te Huang ,  Hao-Sheng Chen ,  Hung-Yi Chang ,  Chia-Lin Liu

IPC: C08L51/08 ,  H05K1/09 ,  H05K1/03 ,  C08J5/04 ,  C08J5/24 ,  C08J3/24 ,  C08L71/12

Abstract: A thermosetting resin composition due to containing a modified PPE resin as a main ingredient is suited for use in making a pregreg or a copper foil substrate, when hardened, featuring a small dielectric constant (Dk), a low dielectric dissipation factor (Df) and a high Tg as well as a high resistance to heat and flame, this outstanding result is because the modified PPE resin is formed with a novel two-dimensional hardenable structure prepared to have side-chain reactive functional groups being provided in addition to those at the terminal ends of the main chain of the PPE resin thereof.

公开(公告)号：US20250075067A1

公开(公告)日：2025-03-06

申请号：US18481241

申请日：2023-10-05

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Wei-Ru Huang ,  Hung-Yi Chang ,  Chia-Lin Liu

IPC: C08L35/00 ,  C08J5/24 ,  C08K13/02

Abstract: Disclosed is a resin composition including a resin. The resin includes a benzoxazine resin, an epoxy resin, and a modified maleimide resin. The modified maleimide resin is formed from a dicyclopentadiene (DCPD)-based resin having an amino group and a maleic anhydride by a condensation polymerization. The dicyclopentadiene-based resin having an amino group is formed by performing a nitration and a hydrogenation to a dicyclopentadiene phenolic resin.

公开(公告)号：US20240228767A1

公开(公告)日：2024-07-11

申请号：US18170561

申请日：2023-02-17

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Wei-Ru Huang ,  Hung-Yi Chang ,  Chia-Lin Liu

IPC: C08L63/00

CPC classification number: C08L63/00 ,  C08L2201/02 ,  C08L2205/025 ,  C08L2205/035

Abstract: A resin composition includes an epoxy resin, a benzoxazine resin, a BMI resin, and a modified polyphenylene ether resin has a structure represented by the following formula:






wherein R represents a chemical group of a bisphenol compound located between two hydroxyphenyl functional groups, and n is an integer ranging from 3 to 25.

公开(公告)号：US20240166866A1

公开(公告)日：2024-05-23

申请号：US18182399

申请日：2023-03-13

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Hung-Yi Chang ,  Chia-Lin Liu ,  Wei-Ru Huang

IPC: C08L71/00

CPC classification number: C08L71/00 ,  C08L2201/08

Abstract: A resin composition is provided. The resin composition includes a resin and an inorganic filler. The resin includes a bismaleimide resin and a polyphenylene ether resin. The inorganic filler includes a first inorganic filler and a second inorganic filler. An average particle size of the first inorganic filler is 0.3 μm to 0.6 μm. An average particle size of the second inorganic filler is 20 μm to 50 μm.