公开(公告)号：US20150131229A1

公开(公告)日：2015-05-14

申请号：US14401282

申请日：2013-05-10

Applicant: NEC Corporation

Inventor： Arihiro Matsunaga ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Kenichi Inaba

IPC: H05K7/20 ,  B23P15/26

CPC classification number: H05K7/20336 ,  B23P15/26 ,  F28D15/0266 ,  F28D15/0275 ,  F28F2275/08 ,  H01L23/4006 ,  H01L23/427 ,  H01L2023/4062 ,  H01L2924/0002 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/2039 ,  Y10T29/4913 ,  Y10T29/53174 ,  H01L2924/00

Abstract: It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening.

Abstract translation: 由于与要冷却的加热元件的热​​阻增加，因此使用相变系统的冷却装置，寻求高的热输送性能，以获得足够的冷却性能是不可能的，因此，冷却装置的连接结构 本发明的示例性方面包括具有开口的连接板; 薄板的压板可弹性变形; 第一固定装置，用于将压板固定到连接板上，其中压板设置成覆盖构成冷却装置的热接收装置; 以及第二固定装置，用于将所述连接板固定到基板上，所述热接收装置抵靠安装在所述基板上并设置在所述开口中的加热元件。

公开(公告)号：US20140083652A1

公开(公告)日：2014-03-27

申请号：US14118556

申请日：2012-05-21

Applicant: NEC Corporation

Inventor： Arihiro Matsunaga ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Masaki Chiba ,  Kenichi Inaba

IPC: F28D15/02

CPC classification number: F28D15/025 ,  F28D15/0266 ,  F28D15/0275 ,  H01L23/10 ,  H01L23/4006 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A sealed casing includes a container provided with a plurality of opening and houses at least one heat-generating body, and a plurality of top boards sealing the openings respectively, and is characterized in that at least one of the openings is disposed in a heat-generating area where the heat-generating body is disposed, and that a cooling unit is disposed on the top board sealing the opening in the heat-generating area.

Abstract translation: 密封壳体包括设置有多个开口并容纳至少一个发热体的容器和分别密封开口的多个顶板，其特征在于，至少一个开口设置在热交换器中， 并且在顶板上设置冷却单元，该冷却单元密封发热区域中的开口。

公开(公告)号：US11821667B2

公开(公告)日：2023-11-21

申请号：US17520901

申请日：2021-11-08

Applicant: NEC Corporation

Inventor： Yoshinori Miyamoto ,  Minoru Yoshikawa ,  Masaki Chiba

IPC: F25B49/02 ,  F25B39/00 ,  F25B43/04

CPC classification number: F25B49/02 ,  F25B39/00 ,  F25B43/043 ,  F25B2400/16 ,  F25B2400/24 ,  F25B2600/05 ,  F25B2600/2513

Abstract: A cooling apparatus includes a heat receiver that evaporates a low pressure heat transfer medium. The apparatus includes a compressor that compresses the evaporated heat transfer medium in a gas phase state, and a condenser that condenses the compressed heat transfer medium. The apparatus includes a receiver tank that receives and stores at least one of the heat transfer medium from any place in a flow path of the medium in the gas phase state that returns the medium to the heat receiver and the condensed medium in a liquid phase state. The apparatus includes an air storage tank that air separated from the heat transfer medium. The apparatus includes a liquid level controller that controls a liquid level in the receiver tank such that the heat transfer medium is stored in the receiver tank at a predetermined liquid level height.

公开(公告)号：US11644249B2

公开(公告)日：2023-05-09

申请号：US17040731

申请日：2019-03-29

Applicant: NEC Corporation

Inventor： Mahiro Hachiya ,  Minoru Yoshikawa

IPC: H01L23/427 ,  H05K7/20 ,  F28D15/04 ,  G06F1/20

CPC classification number: F28D15/04 ,  G06F1/20 ,  H01L23/427 ,  G06F2200/201 ,  H05K7/20336

Abstract: This electronic apparatus 100 comprises a heating element 20, and a case 30. The case 30 has an opening hole 31. In order that a refrigerant COO will be sealed between the case 30 and the heating element 20, the outer periphery part of a first heating element external surface 21, which is the external surface of the heating element 20, is attached to the outer periphery part of the opening hole 31. Also, the refrigerant COO is a refrigerant that is capable of phase change from a liquid refrigerant LP-COO to a gas phase refrigerant GP-COO. As a result, it is possible to more efficiently cool the heat of the heating element 20.

公开(公告)号：US11226130B2

公开(公告)日：2022-01-18

申请号：US16477935

申请日：2018-01-09

Applicant: NEC CORPORATION

Inventor： Koichi Todoroki ,  Arihiro Matsunaga ,  Masanori Sato ,  Mizuki Wada ,  Minoru Yoshikawa

IPC: F24F11/84 ,  F28F27/00 ,  F25B41/20 ,  F25B41/31

Abstract: A valve control device includes a receiving unit, an opening degree control unit, and a fixing control unit. The receiving unit receives information concerning the measured temperature of a fluid to be cooled that is cooled by a vaporizer in a refrigerant circulation path that is equipped with the vaporizer and a condenser. The opening degree control unit variably controls the opening degree of a valve that controls the flow rate of the refrigerant that circulates through the circulation path in accordance with the difference between the measured temperature and a target temperature provided in advance. The fixing control unit fixes the opening degree of the valve with priority over variable control performed by the opening degree control unit in the case where a fixing condition based on the difference between the measured temperature and the target temperature and a valve opening degree variation condition is satisfied.

公开(公告)号：US11047627B2

公开(公告)日：2021-06-29

申请号：US16088197

申请日：2017-03-21

Applicant: NEC Corporation

Inventor： Masaki Chiba ,  Mahiro Hachiya ,  Minoru Yoshikawa

IPC: F28D15/02 ,  H05K7/20 ,  H01L23/427 ,  F28D21/00 ,  F28F1/40 ,  F28F9/02

Abstract: An evaporator includes: a first surface which conducts heat; a heat medium in the evaporator, which vaporizes as a result of the heat absorbed; a condenser which liquefies the heat medium in a vaporized state; a vapour pipe which guides the heat medium in the vaporized state from the evaporator to the condenser; and a liquid pipe which guides the heat medium in a liquefied state from the condenser to the evaporator. A first opening of the vapour pipe and a second opening of the liquid pipe are disposed in different positions from each other in a first direction, and are disposed so as to open into a heat medium accommodation space inside the evaporator at different positions from each other in a second direction, and which is different to the first direction, and also at different positions from each other in a third direction which intersects the first surface.

公开(公告)号：US10607918B2

公开(公告)日：2020-03-31

申请号：US15128354

申请日：2015-03-20

Applicant: NEC Corporation

Inventor： Hitoshi Sakamoto ,  Minoru Yoshikawa ,  Mahiro Hachiya

IPC: H01L23/427 ,  H01L23/40 ,  F28D15/02 ,  H05K7/20

Abstract: A cooler grows in size and its structure becomes complicated in a phase-change cooler if it is intended to cool a plurality of heating elements; therefore, a phase-change cooler according to an exemplary aspect of the present invention includes a heat-conducting board configured to be thermally connected to a cooling object; heat receiving means for storing a refrigerant and receiving heat of the cooling object through the heat-conducting board; radiation means for radiating heat, condensing and devolatilizing a vapor-phase refrigerant arising from vaporization of the refrigerant in the heat receiving means; and connection means for connecting the heat receiving means and the radiation means.

公开(公告)号：US09459031B2

公开(公告)日：2016-10-04

申请号：US14378659

申请日：2013-02-13

Applicant: NEC Corporation

Inventor： Kenichi Inaba ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Arihiro Matsunaga

IPC: F25B43/00 ,  G06F1/20 ,  H05K7/20 ,  F28D15/02 ,  F25B39/00 ,  F25B39/02 ,  F25B39/04

CPC classification number: F25B43/00 ,  F25B39/00 ,  F25B39/02 ,  F25B39/04 ,  F28D15/0266 ,  G06F1/20 ,  H05K7/20818

Abstract: A cooling apparatus includes N (N is an integer of 2 or larger) refrigerant storage units arranged in a vertical direction and configured to store refrigerants, a condensation unit disposed above the N refrigerant storage units, a steam pipe for circulating gas phase refrigerants flowing out of the N refrigerant storage units to the condensation unit, a liquid pipe for circulating a liquid phase refrigerant flowing out of the condensation unit to an uppermost refrigerant storage unit, and separation piping for circulating a liquid phase refrigerant flowing out of an upper refrigerant storage unit to a lower refrigerant storage unit. The liquid phase refrigerant flows into each refrigerant storage unit via an inlet, and flows out from the refrigerant storage unit via a first connection port formed below the inlet.

Abstract translation: 一种冷却装置，其特征在于，包括N个（N为2以上的整数）制冷剂储存单元，其沿垂直方向配置，构成为储存制冷剂，冷凝单元设置在所述N个制冷剂储存单元的上方;蒸气管，其使流出的气相制冷剂循环 的N个制冷剂储存单元的冷凝装置，将从冷凝装置流出的液相制冷剂循环到最上层的制冷剂储存部的液体管，以及使从上部制冷剂储存部流出的液相制冷剂循环的分离配管 到下部制冷剂储存单元。 液相制冷剂经由入口流入各制冷剂储存单元，经由形成在入口下方的第一连接口从制冷剂储存单元流出。

公开(公告)号：US09456528B2

公开(公告)日：2016-09-27

申请号：US14401282

申请日：2013-05-10

Applicant: NEC Corporation

Inventor： Arihiro Matsunaga ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Kenichi Inaba

IPC: H05K7/20 ,  B23P15/26 ,  H01L23/427 ,  F28D15/02 ,  G06F1/20 ,  H01L23/40

CPC classification number: H05K7/20336 ,  B23P15/26 ,  F28D15/0266 ,  F28D15/0275 ,  F28F2275/08 ,  H01L23/4006 ,  H01L23/427 ,  H01L2023/4062 ,  H01L2924/0002 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/2039 ,  Y10T29/4913 ,  Y10T29/53174 ,  H01L2924/00

Abstract: It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening.

Abstract translation: 由于与要冷却的加热元件的热​​阻增加，因此使用相变系统的冷却装置，寻求高的热输送性能，以获得足够的冷却性能是不可能的，因此，冷却装置的连接结构 本发明的示例性方面包括具有开口的连接板; 薄板的压板可弹性变形; 第一固定装置，用于将压板固定到连接板上，其中压板设置成覆盖构成冷却装置的热接收装置; 以及第二固定装置，用于将所述连接板固定到基板上，所述热接收装置抵靠安装在所述基板上并设置在所述开口中的加热元件。

公开(公告)号：US20150241096A1

公开(公告)日：2015-08-27

申请号：US14427487

申请日：2013-07-19

Applicant: NEC Corporation

Inventor： Arihiro Matsunaga ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Kenichi Inaba

IPC: F25B39/02 ,  B23P15/26

CPC classification number: F25B39/028 ,  B23P15/26 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49359 ,  H01L2924/00

Abstract: In order to maintain a high cooling capability even in a case where a heating element has a lower calorific value, a boiling section of a heat receiving section in a phase change cooling apparatus includes a comb-shaped structure and a porous layer provided on a bottom portion of the comb-shaped structure between fins of the comb-shaped structure. With such a boiling section, a liquid film of a liquid phase refrigerant is forcedly made thinner. Thus, the liquid phase refrigerant is changed in phase into a gaseous phase refrigerant even in a case of a small difference between the temperature of the gaseous phase refrigerant and the temperature of the heat receiving surface.

Abstract translation: 为了即使在加热元件具有较低的发热量的情况下也能保持高的冷却能力，相变冷却装置中的受热部的沸腾部分包括梳状结构和设置在底部的多孔层 该梳形结构的一部分在梳形结构的翅片之间。 通过这样的沸腾部分，强制使液相制冷剂的液膜变薄。 因此，即使在气相制冷剂的温度与受热面的温度之间的差异较小的情况下，液相制冷剂也相位变化为气相制冷剂。