Abstract:
Provided is a surface light-emitting device comprising a substrate composed of an oriented polycrystalline zinc oxide sintered body in a plate shape, a light emitting functional layer provided on the substrate, and an electrode provided on the light emitting functional layer. According to the present invention, a surface light-emitting device having high luminous efficiency can be inexpensively provided.
Abstract:
A heating apparatus includes a susceptor having a heating face of heating a semiconductor and a supporting part joined with a back face of the susceptor. The susceptor comprises a ceramic material comprising magnesium, aluminum, oxygen and nitrogen as main components. The material comprises a main phase comprising magnesium-aluminum oxynitride phase exhibiting an XRD peak at least in 2θ=47 to 50° by CuKα X-ray.
Abstract:
Initially, an Yb2O3 raw material was subjected to uniaxial pressure forming at a pressure of 200 kgf/cm2, so that a disc-shaped compact having a diameter of about 35 mm and a thickness of about 10 mm was produced, and was stored into a graphite mold for firing. Subsequently, firing was performed by using a hot-press method at a predetermined firing temperature (1,500° C.), so as to obtain a corrosion-resistant member for semiconductor manufacturing apparatus. The press pressure during firing was specified to be 200 kgf/cm2 and an Ar atmosphere was kept until the firing was finished. The retention time at the firing temperature (maximum temperature) was specified to be 4 hours. In this manner, the corrosion-resistant member for semiconductor manufacturing apparatus made from an Yb2O3 sintered body having an open porosity of 0.2% was obtained.
Abstract translation:首先,将Yb 2 O 3原料在200kgf / cm 2的压力下进行单轴压力成形,制造直径约35mm,厚度约10mm的圆盘状压块,并将其储存在 石墨模具用于烧制。 接着,在规定的烧成温度(1500℃)下,使用热压法进行烧成,得到半导体制造装置的耐腐蚀部件。 烧成时的加压压力为200kgf / cm 2,保持Ar气氛直至烧成结束。 烧成温度(最高温度)的保持时间为4小时。 以这种方式,获得了由具有0.2%的开孔率的Yb2O3烧结体制成的用于半导体制造装置的耐腐蚀构件。
Abstract:
There is provided an AlN single-crystal substrate satisfying a relation: 5≤[(λ25−λ200)×log10 ρ]/(T640-660−T260-280)≤50, wherein λ25 is a thermal conductivity (W/m·K) at 25° C. of the AlN single-crystal substrate; λ200 is a thermal conductivity (W/m·K) at 200° C. of the AlN single-crystal substrate; ρ is an electrical resistivity (Ω·cm) at 25° C. of the AlN single-crystal substrate; T640-660 is an average value of transmittance (%) at 640 to 660 nm in a transmission spectrum of the AlN single-crystal substrate; and T260-280 is an average value of transmittance (%) at 260 to 280 nm in the transmission spectrum.
Abstract:
Provided is an AlN single crystal substrate having a three-layer structure composed of one AlN single crystal as a whole and is classifiable into the first layer, the second layer, and the third layer in this order in the thickness direction in terms of defect density, wherein the second layer has a defect density of 10 times or more the defect density of each of the first layer and the third layer.
Abstract:
A multilayer structure of the present invention is a multilayer structure including a base substrate and a semiconductor film that is made of α-Ga2O3 or an α-Ga2O3-based solid solution and has a corundum crystal structure, the semiconductor film being disposed on the base substrate. The semiconductor film has an average film thickness of greater than or equal to 10 μm. The semiconductor film is convexly or concavely warped. An amount of warpage of the semiconductor film is 20 μm or greater and 64 μm or less.
Abstract:
An α-Ga2O3 semiconductor film according to the present invention has a measurement point (dark spot) with a maximum emission intensity A of not more than 0.6 times the average value X of top 5% of the maximum emission intensities A at all measurement points in intensity mapping of plane cathodoluminescence, wherein the maximum emission intensity A at each measurement point is determined in the wavelength range of 250 to 365 nm.
Abstract:
Provided is a semiconductor film having a corundum-type crystal structure composed of α-Ga2O3 or an α-Ga2O3 solid solution, and an impurity concentration and/or a heterogeneous phase amount differ between a front surface and a rear surface of the semiconductor film.
Abstract:
Provided is a SiC composite substrate including a biaxially-oriented SiC layer in which SiC is oriented in both a c-axis direction and an a-axis direction, and a SiC polycrystalline layer provided on one surface of the biaxially-oriented SiC layer. Pores are present in the SiC composite substrate.
Abstract:
There is provided a self-supporting polycrystalline gallium nitride substrate having excellent characteristics such as high luminous efficiency and high conversion efficiency when used for devices, such as light emitting devices and solar cells. The self-supporting polycrystalline gallium nitride substrate is composed of gallium nitride-based single crystal grains having a specific crystal orientation in a direction approximately normal to the substrate, and has a top surface and a bottom surface. The crystal orientations of individual gallium nitride-based single crystal grains as determined from inverse pole figure mapping by electron backscatter diffraction (EBSD) analysis on the top surface are distributed at various tilt angles from the specific crystal orientation, in which the average tilt angle thereof is 0.1° or more and less than 1° and the cross-sectional average diameter DT of the gallium nitride-based single crystal grains at the outermost surface exposed on the top surface is 10 μm or more.