Abstract:
A voltage nonlinear resistive element includes a resistor containing a joined body in which a zinc oxide ceramic layer composed mainly of zinc oxide and having a volume resistivity of 1.0×10−1 Ωcm or less is joined to a bismuth oxide layer composed mainly of bismuth oxide, and a pair of electrodes disposed on the resistor such that an electrically conductive path passes through a joint surface between the zinc oxide ceramic layer and the bismuth oxide layer. In this element, the zinc oxide ceramic layer of the joined body has a lower volume resistivity than before. This can result in a lower clamping voltage in a high-current region than before.
Abstract:
The manufacturing method includes a step of mixing a coarse particle zeolite, a fine particle zeolite, and a raw material of an inorganic bonding material to prepare a zeolite raw material; a step of forming the prepared zeolite raw material into a honeycomb shape to prepare a honeycomb formed body; and a step of firing the prepared honeycomb formed body to prepare the honeycomb structure. In the step of preparing the zeolite raw material, as the coarse particle zeolite, a chabazite type zeolite having a specific average particle diameter, the fine particle zeolite having a specific average particle diameter, the raw material of the inorganic bonding material which includes at least basic aluminum lactate is used.
Abstract:
A voltage-nonlinear resistor element 10 includes a voltage-nonlinear resistor (referred simply as “resistor”) 20 and a pair of electrodes 14 and 16 between which the resistor 20 is interposed. The resistor 20 has a multilayer structure including a first layer 21 composed primarily of zinc oxide, a second layer 22 composed primarily of zinc oxide, and a third layer 23 composed primarily of a metal oxide other than zinc oxide. The second layer 22 is adjacent to the first layer 21 and has a smaller thickness and a higher volume resistivity than the first layer 21. The third layer 23 is adjacent to the second layer 22.
Abstract:
Initially, an Yb2O3 raw material was subjected to uniaxial pressure forming at a pressure of 200 kgf/cm2, so that a disc-shaped compact having a diameter of about 35 mm and a thickness of about 10 mm was produced, and was stored into a graphite mold for firing. Subsequently, firing was performed by using a hot-press method at a predetermined firing temperature (1,500° C.), so as to obtain a corrosion-resistant member for semiconductor manufacturing apparatus. The press pressure during firing was specified to be 200 kgf/cm2 and an Ar atmosphere was kept until the firing was finished. The retention time at the firing temperature (maximum temperature) was specified to be 4 hours. In this manner, the corrosion-resistant member for semiconductor manufacturing apparatus made from an Yb2O3 sintered body having an open porosity of 0.2% was obtained.
Abstract translation:首先,将Yb 2 O 3原料在200kgf / cm 2的压力下进行单轴压力成形,制造直径约35mm,厚度约10mm的圆盘状压块,并将其储存在 石墨模具用于烧制。 接着,在规定的烧成温度(1500℃)下,使用热压法进行烧成,得到半导体制造装置的耐腐蚀部件。 烧成时的加压压力为200kgf / cm 2,保持Ar气氛直至烧成结束。 烧成温度(最高温度)的保持时间为4小时。 以这种方式,获得了由具有0.2%的开孔率的Yb2O3烧结体制成的用于半导体制造装置的耐腐蚀构件。